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    Megasonic cleaner having double cleaning probe and cleaning method
    1.
    发明申请
    Megasonic cleaner having double cleaning probe and cleaning method 审中-公开
    超声波清洗机具有双重清洁探头和清洁方法

    公开(公告)号：US20060130871A1

    公开(公告)日：2006-06-22

    申请号：US11268285

    申请日：2005-11-04

    申请人： Kyung-Seuk Hwang ,  Sun-Yong Lee ,  Dong-Chul Heo

    发明人： Kyung-Seuk Hwang ,  Sun-Yong Lee ,  Dong-Chul Heo

    IPC分类号： B08B3/12 ,  C23G1/00 ,  B08B7/00 ,  B08B3/00

    CPC分类号： H01L21/67051 ,  B08B3/12

    摘要： A megasonic cleaner includes a rotatable wafer supporting member for supporting a wafer; a cleaning solution supply member for supplying a cleaning solution to a wafer placed on the wafer supporting member; at least two vibration transfer members for agitating cleaning solutions supplied to different areas of the wafer placed on the wafer supporting member; and a vibration generating member for oscillating the at least two vibration transfer members. The cleaner has at least two quartz rods for transferring oscillation energy. Using the quartz rods, oscillation energy is transferred to respective areas of a wafer to clean the wafer. Thus, a difference between cleaning efficiencies of wafer edge and center is reduced or substantially eliminated to achieve a uniform cleaning efficiency on an entire surface of the wafer.

    摘要翻译： 兆声波清洗器包括用于支撑晶片的可旋转晶片支撑构件; 清洁溶液供给构件，用于将清洁溶液供给到放置在晶片支撑构件上的晶片; 至少两个振动传递构件，用于搅拌提供给放置在晶片支撑构件上的晶片的不同区域的清洁溶液; 以及用于振荡所述至少两个振动传递构件的振动产生构件。 清洁器至少有两个用于传递振荡能量的石英棒。 使用石英棒，将振荡能量转移到晶片的相应区域以清洁晶片。 因此，晶片边缘和中心的清洁效率之间的差异被减小或基本消除，以在晶片的整个表面上实现均匀的清洁效率。

    Dry cleaning apparatus used to manufacture semiconductor devices
    2.
    发明申请
    Dry cleaning apparatus used to manufacture semiconductor devices 审中-公开
    用于制造半导体器件的干洗设备

    公开(公告)号：US20060096622A1

    公开(公告)日：2006-05-11

    申请号：US11272414

    申请日：2005-11-10

    申请人： Sang-Eon Lee ,  Sun-Yong Lee ,  Sang-Rok Hah ,  Dong-Chul Heo

    发明人： Sang-Eon Lee ,  Sun-Yong Lee ,  Sang-Rok Hah ,  Dong-Chul Heo

    IPC分类号： B08B3/00

    CPC分类号： B08B5/02 ,  B08B7/0042 ,  B08B15/02 ,  H01L21/67017 ,  H01L21/67028

    摘要： A dry cleaning apparatus for cleaning a surface of a semiconductor substrate comprises a chamber comprising a first wall and a second wall, a supporting member including a wafer receiving surface, a cleaning member for removing particles from the surface of the substrate placed on the supporting member, and a carrier gas supplying member for supplying a carrier gas and for transporting the particles separated from the surface of the substrate to the outside of the chamber, wherein the first wall of the chamber including a first portion disposed to face the wafer receiving surface and a second portion formed adjacent to the first portion and disposed to receive a part of the carrier gas supplying member.

    摘要翻译： 一种用于清洁半导体衬底的表面的干洗设备，包括：一个包括一个第一壁和一个第二壁的腔室，一个包括一个晶片接收表面的支撑构件，一个用于从放置在支撑构件上的衬底表面去除颗粒的清洁构件 以及用于供给载气并将从基板的表面分离的颗粒输送到室的外部的载气供给部件，其中，所述室的第一壁包括设置成面对晶片接收表面的第一部分和 第二部分，其形成在与第一部分相邻并且设置成容纳载气供应部件的一部分。

    Preparation method of polyamide thin film composite reverse osmosis membrane and polyamide thin film composite reverse osmosis membrane prepared therefrom
    4.
    发明授权
    Preparation method of polyamide thin film composite reverse osmosis membrane and polyamide thin film composite reverse osmosis membrane prepared therefrom 有权
    聚酰胺薄膜复合反渗透膜及其制备的聚酰胺薄膜复合反渗透膜的制备方法

    公开(公告)号：US07598296B2

    公开(公告)日：2009-10-06

    申请号：US10586520

    申请日：2005-12-26

    申请人： Je-Kang Yoo ,  Sun-Yong Lee ,  Youn-Kook Kim

    发明人： Je-Kang Yoo ,  Sun-Yong Lee ,  Youn-Kook Kim

    IPC分类号： C08J5/20

    CPC分类号： B01D69/125 ,  B01D61/025 ,  B01D67/0093 ,  B01D67/0095 ,  B01D71/56 ,  Y02A20/131

    摘要： A preparation method of a polyamide thin film composite reverse osmosis membrane and a polyamide thin film composite reverse osmosis membrane prepared using the preparation method are provided. The preparation method of a polyamide thin film composite reverse osmosis membrane using interfacial polymerization of an amine aqueous solution and amine-reactive compound includes the steps of (a) forming an active layer through interfacial polymerization by contacting a surface of a porous support with an amine aqueous solution containing a polyfunctional aromatic amine monomer and an organic solution containing polyfunctional acyl halide monomer as an amine-reactive compound, and (b) performing post-treatment preceded by the forming of the active layer by contacting the active layer with an aqueous solution containing 0.1 to 100 wt % of polyfunctional tertiary alcohol amine. The polyamide thin film composite reverse osmosis membrane prepared by using the polyfunctional tertiary alcohol amine as a post-treatment compound has improved water permeability and salt rejection compared to a case of using various post-treatment agents or methods.

    摘要翻译： 提供了使用该制备方法制备的聚酰胺薄膜复合反渗透膜和聚酰胺薄膜复合反渗透膜的制备方法。 使用胺水溶液和胺反应性化合物的界面聚合的聚酰胺薄膜复合反渗透膜的制备方法包括以下步骤：（a）通过界面聚合形成活性层，通过使多孔载体的表面与胺 含有多官能芳族胺单体的水溶液和含有多官能酰卤单体作为胺反应性化合物的有机溶液，和（b）在活性层形成之前进行后处理，所述活性层通过使活性层与含有 0.1〜100重量％的多官能叔胺胺。 通过使用多官能叔醇胺作为后处理化合物制备的聚酰胺薄膜复合反渗透膜与使用各种后处理剂或方法的情况相比，具有改善的透水性和耐盐析性。

    Apparatus and method for processing wafers
    7.
    发明授权
    Apparatus and method for processing wafers 有权
    用于处理晶片的装置和方法

    公开(公告)号：US07398801B2

    公开(公告)日：2008-07-15

    申请号：US11292674

    申请日：2005-12-02

    申请人： Kun-Hyung Lee ,  Soo-Woong Lee ,  Hyun-Ho Cho ,  Hee-Sun Chae ,  Jae-Hyung Jung ,  Sun-Yong Lee

    发明人： Kun-Hyung Lee ,  Soo-Woong Lee ,  Hyun-Ho Cho ,  Hee-Sun Chae ,  Jae-Hyung Jung ,  Sun-Yong Lee

    IPC分类号： B65B1/20

    CPC分类号： H01L21/67017 ,  H01L21/67772 ,  Y10S414/14

    摘要： An apparatus and method for manufacturing semiconductor devices are disclosed. In accordance with the invention, a wafer transfer device for transferring wafers from wafer storage containers to wafer processing equipment includes a flow chamber designed to reduce the amount of contaminants that can enter the wafer container. The wafer transfer apparatus provide two gas inlets for allowing two gases to flow through the flow chamber of the transfer apparatus. This results in a reduced amount of contaminants able to enter the wafer container, which in turn results in manufacture of devices with more reliable performance characteristics as well as high manufacturing yield.

    摘要翻译： 公开了一种用于制造半导体器件的设备和方法。 根据本发明，用于将晶片从晶片储存容器转移到晶片加工设备的晶片转移装置包括设计成减少可进入晶片容器的污染物量的流动室。 晶片传送装置提供两个气体入口，用于允许两种气体流过传送装置的流动室。 这导致能够进入晶片容器的污染物量减少，这进而导致具有更可靠的性能特征以及高制造产量的装置的制造。

    Apparatus and method for processing wafers
    8.
    发明申请
    Apparatus and method for processing wafers 有权
    用于处理晶片的装置和方法

    公开(公告)号：US20060104750A1

    公开(公告)日：2006-05-18

    申请号：US11292674

    申请日：2005-12-02

    申请人： Kun-Hyung Lee ,  Soo-Woong Lee ,  Hyun-Ho Cho ,  Hee-Sun Chae ,  Jae-Hyung Jung ,  Sun-Yong Lee

    发明人： Kun-Hyung Lee ,  Soo-Woong Lee ,  Hyun-Ho Cho ,  Hee-Sun Chae ,  Jae-Hyung Jung ,  Sun-Yong Lee

    IPC分类号： H01L21/677

    CPC分类号： H01L21/67017 ,  H01L21/67772 ,  Y10S414/14

    摘要： An apparatus and method for manufacturing semiconductor devices are disclosed. In accordance with the invention, a wafer transfer device for transferring wafers from wafer storage containers to wafer processing equipment includes a flow chamber designed to reduce the amount of contaminants that can enter the wafer container. The wafer transfer apparatus provide two gas inlets for allowing two gases to flow through the flow chamber of the transfer apparatus. This results in a reduced amount of contaminants able to enter the wafer container, which in turn results in manufacture of devices with more reliable performance characteristics as well as high manufacturing yield.

    摘要翻译： 公开了一种用于制造半导体器件的设备和方法。 根据本发明，用于将晶片从晶片储存容器转移到晶片加工设备的晶片转移装置包括设计成减少可进入晶片容器的污染物量的流动室。 晶片传送装置提供两个气体入口，用于允许两种气体流过传送装置的流动室。 这导致能够进入晶片容器的污染物量减少，这进而导致具有更可靠的性能特征以及高制造产量的装置的制造。