公开(公告)号：US20210005485A1

公开(公告)日：2021-01-07

申请号：US17025349

申请日：2020-09-18

Applicant: LAM RESEARCH CORPORATION

Inventor： John E. Daugherty ,  David Trussell ,  Michael Kellogg ,  Christopher Pena ,  Richard H. Gould ,  Klay Kunkel

IPC: H01L21/67

Abstract: A substrate processing tool includes a wafer transport assembly that includes a first wafer transport module and extends along a longitudinal axis of the substrate processing tool. A plurality of process modules includes a first process module and a second process module arranged on opposite sides of the longitudinal axis of the substrate processing tool. Outer sides of the first wafer transport module are coupled to the first and second process modules, respectively. A service tunnel defined below the wafer transport assembly extends along the longitudinal axis from a front end of the substrate processing tool to a rear end of the substrate processing tool below the wafer transport assembly.

公开(公告)号：US10014196B2

公开(公告)日：2018-07-03

申请号：US14887935

申请日：2015-10-20

Applicant: Lam Research Corporation

Inventor： John Daugherty ,  David Trussell ,  Michael Kellogg ,  Christopher Pena ,  Richard Gould ,  Klay Kunkel

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67196 ,  H01L21/67161 ,  H01L21/6719 ,  H01L21/67201 ,  H01L21/67727 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67754 ,  H01L21/67769

Abstract: A wafer transport assembly includes first and second wafer transport modules, and a buffer module coupled between the first and second wafer transport modules. The first and second wafer transport modules and the buffer module are aligned in a single directional axis. The buffer module includes a first buffer stack positioned at a first lateral end of the buffer module, and a second buffer stack positioned at a second lateral end of the buffer module. The first lateral end of the buffer module defines a first side protrusion nested between the first and second wafer transport modules and first and second process modules. The second lateral end of the buffer module defines a second side protrusion that is nested between the first and second wafer transport modules and third and fourth process modules. The first and second wafer transport modules and the buffer module define a continuous controlled environment.

公开(公告)号：US20170110350A1

公开(公告)日：2017-04-20

申请号：US15296547

申请日：2016-10-18

Applicant: Lam Research Corporation

Inventor： David Trussell ,  John Daugherty ,  Michael Kellogg ,  Christopher Pena ,  Richard Gould ,  Klay Kunkel

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67173 ,  H01L21/67155 ,  H01L21/67167 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67201 ,  H01L21/67706 ,  H01L21/67727 ,  H01L21/67733 ,  H01L21/67745

Abstract: A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.

公开(公告)号：US09929028B2

公开(公告)日：2018-03-27

申请号：US15296547

申请日：2016-10-18

Applicant: Lam Research Corporation

Inventor： David Trussell ,  John Daugherty ,  Michael Kellogg ,  Christopher Pena ,  Richard Gould ,  Klay Kunkel

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67173 ,  H01L21/67155 ,  H01L21/67167 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67201 ,  H01L21/67706 ,  H01L21/67727 ,  H01L21/67733 ,  H01L21/67745

Abstract: A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.

公开(公告)号：US10790174B2

公开(公告)日：2020-09-29

申请号：US15951333

申请日：2018-04-12

Applicant: LAM RESEARCH CORPORATION

Inventor： John Daugherty ,  David Trussell ,  Michael Kellogg ,  Christopher Pena ,  Richard H. Gould ,  Klay Kunkel

IPC: H01L21/67

Abstract: A wafer transport assembly includes a first wafer transport module and a second wafer transport module. A buffer module, arranged between the first wafer transport module and the second wafer transport module, includes a first buffer stack and a second buffer stack. Outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively. The first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly.

公开(公告)号：US20170110354A1

公开(公告)日：2017-04-20

申请号：US14887935

申请日：2015-10-20

Applicant: Lam Research Corporation

Inventor： John Daugherty ,  David Trussell ,  Michael Kellogg ,  Christopher Pena ,  Richard Gould ,  Klay Kunkel

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/673

CPC classification number: H01L21/67196 ,  H01L21/67161 ,  H01L21/6719 ,  H01L21/67201 ,  H01L21/67727 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67754 ,  H01L21/67769

Abstract: A wafer transport assembly includes first and second wafer transport modules, and a buffer module coupled between the first and second wafer transport modules. The first and second wafer transport modules and the buffer module are aligned in a single directional axis. The buffer module includes a first buffer stack positioned at a first lateral end of the buffer module, and a second buffer stack positioned at a second lateral end of the buffer module. The first lateral end of the buffer module defines a first side protrusion nested between the first and second wafer transport modules and first and second process modules. The second lateral end of the buffer module defines a second side protrusion that is nested between the first and second wafer transport modules and third and fourth process modules. The first and second wafer transport modules and the buffer module define a continuous controlled environment.

公开(公告)号：US09502275B1

公开(公告)日：2016-11-22

申请号：US14887876

申请日：2015-10-20

Applicant: Lam Research Corporation

Inventor： David Trussell ,  John Daugherty ,  Michael Kellogg ,  Christopher Pena ,  Richard Gould ,  Klay Kunkel

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67173 ,  H01L21/67155 ,  H01L21/67167 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67201 ,  H01L21/67706 ,  H01L21/67727 ,  H01L21/67733 ,  H01L21/67745

Abstract: A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.

Abstract translation: 提供了一种用于处理衬底的系统，包括：晶片传送组件，其被配置为将晶片传送到一个或多个过程模块并从一个或多个过程模块传送晶片传输组件，所述晶片传输组件具有至少一个晶片传送模块，其中所述至少一个晶片的侧面 传输模块被配置为耦合到所述一个或多个处理模块; 在晶片运输组件下面定义的服务楼层，服务楼层被限定在小于系统设置在其中的制造设施楼层的高度的高度。