公开(公告)号：US20210005485A1

公开(公告)日：2021-01-07

申请号：US17025349

申请日：2020-09-18

Applicant: LAM RESEARCH CORPORATION

Inventor： John E. Daugherty ,  David Trussell ,  Michael Kellogg ,  Christopher Pena ,  Richard H. Gould ,  Klay Kunkel

IPC: H01L21/67

Abstract: A substrate processing tool includes a wafer transport assembly that includes a first wafer transport module and extends along a longitudinal axis of the substrate processing tool. A plurality of process modules includes a first process module and a second process module arranged on opposite sides of the longitudinal axis of the substrate processing tool. Outer sides of the first wafer transport module are coupled to the first and second process modules, respectively. A service tunnel defined below the wafer transport assembly extends along the longitudinal axis from a front end of the substrate processing tool to a rear end of the substrate processing tool below the wafer transport assembly.

公开(公告)号：US20170110351A1

公开(公告)日：2017-04-20

申请号：US14887959

申请日：2015-10-20

Applicant: Lam Research Corporation

Inventor： David Trussell ,  Richard Gould ,  John Daugherty

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677

CPC classification number: H01L21/67201 ,  H01L21/67063 ,  H01L21/67161 ,  H01L21/67207 ,  H01L21/6732 ,  H01L21/67727 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67757 ,  H01L21/67766

Abstract: A load lock assembly includes a first load lock connected between an equipment front end module (EFEM) and a wafer transport module, the EFEM being at a lab ambient condition, the wafer transport module being at a vacuum condition, the wafer transport module being part of a wafer transport assembly that is configured to transport wafers to and from one or more process modules that are connected to the wafer transport assembly; a second load lock disposed over the first load lock, the second load lock connected between the EFEM and the wafer transport module; a post-processing module disposed over the second load lock, the post-processing module configured for performing a post-processing operation on a processed wafer that has been processed in at least one of the process modules that are connected to the wafer transport assembly, the post-processing module being configured for connection to the wafer transport module.

公开(公告)号：US10403476B2

公开(公告)日：2019-09-03

申请号：US15346920

申请日：2016-11-09

Applicant: Lam Research Corporation

Inventor： Mariusch Gregor ,  Thorsten Lill ,  David Trussell

IPC: C23C16/40 ,  H01J37/32 ,  C23C16/505 ,  C23C16/52 ,  G01J3/50 ,  H01L21/67 ,  C23C16/44 ,  C23C16/455 ,  C23C16/509

Abstract: An active showerhead used for a plasma reactor is described. The active showerhead includes a plurality of substrate layers. The substrate layers include at least one actuator and transfer component. The actuator and transfer component is coupled to a gas line via a gas channel. The active showerhead further includes an electrode layer located below the substrate layers. The electrode layer and the actuator and transfer component both share an opening. The actuator and transfer component allows passage of one or more process gases received from the gas line and the gas channel into the opening without the need for a conventional gas box.

公开(公告)号：US10304707B2

公开(公告)日：2019-05-28

申请号：US14887959

申请日：2015-10-20

Applicant: Lam Research Corporation

Inventor： David Trussell ,  Richard Gould ,  John Daugherty

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/677

Abstract: A load lock assembly includes a first load lock connected between an equipment front end module (EFEM) and a wafer transport module, the EFEM being at a lab ambient condition, the wafer transport module being at a vacuum condition, the wafer transport module being part of a wafer transport assembly that is configured to transport wafers to and from one or more process modules that are connected to the wafer transport assembly; a second load lock disposed over the first load lock, the second load lock connected between the EFEM and the wafer transport module; a post-processing module disposed over the second load lock, the post-processing module configured for performing a post-processing operation on a processed wafer that has been processed in at least one of the process modules that are connected to the wafer transport assembly, the post-processing module being configured for connection to the wafer transport module.

公开(公告)号：US10014196B2

公开(公告)日：2018-07-03

申请号：US14887935

申请日：2015-10-20

Applicant: Lam Research Corporation

Inventor： John Daugherty ,  David Trussell ,  Michael Kellogg ,  Christopher Pena ,  Richard Gould ,  Klay Kunkel

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67196 ,  H01L21/67161 ,  H01L21/6719 ,  H01L21/67201 ,  H01L21/67727 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67754 ,  H01L21/67769

Abstract: A wafer transport assembly includes first and second wafer transport modules, and a buffer module coupled between the first and second wafer transport modules. The first and second wafer transport modules and the buffer module are aligned in a single directional axis. The buffer module includes a first buffer stack positioned at a first lateral end of the buffer module, and a second buffer stack positioned at a second lateral end of the buffer module. The first lateral end of the buffer module defines a first side protrusion nested between the first and second wafer transport modules and first and second process modules. The second lateral end of the buffer module defines a second side protrusion that is nested between the first and second wafer transport modules and third and fourth process modules. The first and second wafer transport modules and the buffer module define a continuous controlled environment.

公开(公告)号：US11764086B2

公开(公告)日：2023-09-19

申请号：US17860736

申请日：2022-07-08

Applicant: LAM RESEARCH CORPORATION

Inventor： David Trussell ,  John Daugherty ,  Christopher J. Pena ,  Michael C. Kellogg ,  Klay Kunkel ,  Richard H. Gould

IPC: H01L21/67

CPC classification number: H01L21/67196 ,  H01L21/6719 ,  H01L21/67161

Abstract: A substrate processing system configured to process substrates includes a substrate transport assembly that encloses a controlled environment defined within a continuous transport volume and at least two process modules coupled to the substrate transport assembly. The substrate transport assembly is configured to transport substrates to and from the at least two process modules through the continuous transport volume. At least two gas boxes are configured to deliver gas mixtures to the at least two process modules. An exhaust duct configured to selectively evacuate the at least two process modules through the at least two gas boxes. Surfaces of the at least two gas boxes include perforations configured to allow gases to flow from the at least two gas boxes into the exhaust duct.

公开(公告)号：US10804079B2

公开(公告)日：2020-10-13

申请号：US16544769

申请日：2019-08-19

Applicant: Lam Research Corporation

Inventor： Mariusch Gregor ,  Thorsten Lill ,  David Trussell

IPC: C23C16/40 ,  H01J37/32 ,  C23C16/44 ,  C23C16/455 ,  C23C16/509 ,  C23C16/505 ,  C23C16/52 ,  G01J3/50 ,  H01L21/67

Abstract: An active showerhead used for a plasma reactor is described. The active showerhead includes a plurality of substrate layers. The substrate layers include at least one actuator and transfer component. The actuator and transfer component is coupled to a gas line via a gas channel. The active showerhead further includes an electrode layer located below the substrate layers. The electrode layer and the actuator and transfer component both share an opening. The actuator and transfer component allows passage of one or more process gases received from the gas line and the gas channel into the opening without the need for a conventional gas box.

公开(公告)号：US09929028B2

公开(公告)日：2018-03-27

申请号：US15296547

申请日：2016-10-18

Applicant: Lam Research Corporation

Inventor： David Trussell ,  John Daugherty ,  Michael Kellogg ,  Christopher Pena ,  Richard Gould ,  Klay Kunkel

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67173 ,  H01L21/67155 ,  H01L21/67167 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67201 ,  H01L21/67706 ,  H01L21/67727 ,  H01L21/67733 ,  H01L21/67745

Abstract: A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.

公开(公告)号：US20190371573A1

公开(公告)日：2019-12-05

申请号：US16544769

申请日：2019-08-19

Applicant: Lam Research Corporation

Inventor： Mariusch Gregor ,  Thorsten Lill ,  David Trussell

IPC: H01J37/32 ,  C23C16/505 ,  C23C16/52 ,  G01J3/50 ,  H01L21/67

Abstract: An active showerhead used for a plasma reactor is described. The active showerhead includes a plurality of substrate layers. The substrate layers include at least one actuator and transfer component. The actuator and transfer component is coupled to a gas line via a gas channel. The active showerhead further includes an electrode layer located below the substrate layers. The electrode layer and the actuator and transfer component both share an opening. The actuator and transfer component allows passage of one or more process gases received from the gas line and the gas channel into the opening without the need for a conventional gas box.

公开(公告)号：US20170110350A1

公开(公告)日：2017-04-20

申请号：US15296547

申请日：2016-10-18

Applicant: Lam Research Corporation

Inventor： David Trussell ,  John Daugherty ,  Michael Kellogg ,  Christopher Pena ,  Richard Gould ,  Klay Kunkel

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67173 ,  H01L21/67155 ,  H01L21/67167 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67201 ,  H01L21/67706 ,  H01L21/67727 ,  H01L21/67733 ,  H01L21/67745

Abstract: A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.