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公开(公告)号：US10459547B2
公开(公告)日：2019-10-29
申请号：US15533544
申请日：2016-02-26
Applicant: LG CHEM, LTD.
Inventor： Junghwan Yoon , Doohoon Song , Song Ho Jang , JinWoo Park , Ki-Hwan Kim
Abstract: The present specification relates to a conductive structure and a method for manufacturing the same.
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公开(公告)号：US10073572B2
公开(公告)日：2018-09-11
申请号：US15037583
申请日：2015-05-07
Applicant: LG CHEM, LTD.
Inventor： Jin Hyong Lim , Song Ho Jang , Ki-Hwan Kim , Yong Chan Kim , Junghwan Yoon , Chan Hyoung Park , Ilha Lee
CPC classification number: G06F3/044 , B81B7/0006 , G06F3/041 , G06F3/0412 , G06F2203/04103 , H05K3/00 , H05K2201/00
Abstract: The present application relates to a conductive structure body and a method for manufacturing the same. A conductive structure body according to an exemplary embodiment of the present application includes a transparent conductive layer, a metal layer which is provided on the transparent conductive layer and includes aluminum, and an aluminum oxynitride layer which is provided on the metal layer.
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Patent Agency Ranking
公开(公告)号：US09983705B2
公开(公告)日：2018-05-29
申请号：US15035704
申请日：2014-11-20
Applicant: LG CHEM, LTD.
Inventor： Jin Hyong Lim , Song Ho Jang , Ilha Lee , Ki-Hwan Kim , Yong Chan Kim , Junghwan Yoon , Chan Hyoung Park
IPC: G11B5/64 , H05K1/00 , H01L31/00 , G06F3/041 , H01L31/0216 , H01L31/0224 , H05K1/02 , H05K1/09 , H05K3/10 , H05K3/22
CPC classification number: G06F3/041 , G06F2203/04103 , H01L31/02167 , H01L31/022425 , H05K1/0274 , H05K1/09 , H05K3/10 , H05K3/22
Abstract: The present specification provides a conductive structure body and a method for manufacturing the same.
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4.发明授权公开(公告)号：US09736937B2
公开(公告)日：2017-08-15
申请号：US14443213
申请日：2014-10-30
Applicant: LG CHEM, LTD.
Inventor： Yong Chan Kim , Jin Hyong Lim , Ki-Hwan Kim , Junghwan Yoon , Ilha Lee
IPC: H01L31/00 , H05K1/09 , G06F3/041 , H01L31/18 , G06F1/16 , H01L31/0224 , H05K5/00 , H01B1/02 , H05K1/02 , H05K3/06 , H01L51/44
CPC classification number: H05K1/09 , G06F1/16 , G06F3/041 , H01B1/026 , H01L31/022433 , H01L31/022475 , H01L31/022483 , H01L31/1884 , H01L51/445 , H05K1/0274 , H05K1/0298 , H05K3/06 , H05K5/0017 , H05K2201/0108 , H05K2201/0338 , Y02E10/50
Abstract: The present application relates to a conductive film, a method for manufacturing the same, and a display device including the same.
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公开(公告)号：US10963109B2
公开(公告)日：2021-03-30
申请号：US15556883
申请日：2016-08-11
Applicant: LG CHEM, LTD.
Inventor： Junghwan Yoon , Doohoon Song , Song Ho Jang , Jin Woo Park , Ki-Hwan Kim
Abstract: The present application relates to a conductive structure body and a method for manufacturing the same. A conductive structure body according to an exemplary embodiment of the present application comprises a substrate; a metal layer provided on the substrate; and a light reflection reducing layer provided on at least one surface of the metal layer and comprising copper-manganese-nickel oxide.
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6.发明授权公开(公告)号：US10338706B2
公开(公告)日：2019-07-02
申请号：US14765737
申请日：2014-11-27
Applicant: LG CHEM, LTD.
Inventor： Jin Hyong Lim , Yong Chan Kim , Junghwan Yoon , Jung Il Yoon , Ki-Hwan Kim , Ilha Lee
Abstract: The present application provides a conductive structure body precursor, a conductive structure body and a method for manufacturing the same.
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公开(公告)号：US09706653B2
公开(公告)日：2017-07-11
申请号：US14766085
申请日：2014-11-04
Applicant: LG CHEM, LTD.
Inventor： Junghwan Yoon , Jin Hyong Lim , Yong Chan Kim , Ilha Lee , Ki-Hwan Kim
IPC: B32B3/00 , H05K1/09 , G06F3/041 , G06F3/047 , H01L31/02 , H05K1/02 , H05K3/06 , G06F3/044 , H01L31/0224
CPC classification number: H05K1/09 , G06F3/041 , G06F3/044 , G06F3/047 , G06F2203/04103 , H01L31/02008 , H01L31/022425 , H01L31/022466 , H05K1/0274 , H05K3/067 , Y02E10/50 , Y10T29/49158
Abstract: The present specification relates to a conductive structure body and a method for manufacturing the same.
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