SEMICONDUCTOR DEVICE PACKAGE
    3.
    发明申请

    公开(公告)号:US20190074422A1

    公开(公告)日:2019-03-07

    申请号:US16119469

    申请日:2018-08-31

    Abstract: A semiconductor device package includes a resin unit having a first through hole and a second through hole, a conductive body disposed on the resin unit and having a cavity that is concave in a first direction from a top surface of the conductive body toward a bottom surface thereof, and a light-emitting device disposed in the cavity, wherein the conductive body includes a first protrusion and a second protrusion, which protrude in the first direction from the bottom surface of the conductive body, and the first protrusion is disposed inside the first through hole, the second protrusion is disposed inside the second through hole, and a top surface of the resin unit is in contact with the bottom surface of the conductive body.

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