公开(公告)号：US20170324003A1

公开(公告)日：2017-11-09

申请号：US15319486

申请日：2015-06-08

Applicant: LG INNOTEK CO., LTD.

Inventor： Byung Mok KIM ,  Hiroshi KODAIRA ,  Baek Jun KIM ,  Ha Na KIM ,  Jung Woo LEE ,  Sang Ung HWANG

IPC: H01L33/38 ,  H01L33/60 ,  H05K1/02 ,  H01L51/00 ,  F21V7/05

CPC classification number: H01L33/387 ,  F21V7/05 ,  H01L33/486 ,  H01L33/60 ,  H01L51/0076 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0033 ,  H05K1/0212 ,  H01L2924/00014

Abstract: A light-emitting device package of the embodiments includes a package body; at least one light emitting device above the package body; an adhesive layer between the at least one light emitting device and the package body; and an adhesive-layer-accommodating portion disposed in the package body for accommodating the adhesive layer therein, wherein the adhesive-layer-accommodating portion has a side surface disposed to be inclined at a predetermined angle relative to an imaginary vertical plane that extends in a thickness direction of the package body.

公开(公告)号：US20170117443A1

公开(公告)日：2017-04-27

申请号：US15319318

申请日：2015-05-27

Applicant: LG INNOTEK CO., LTD.

Inventor： Byung Mok KIM ,  Ha Na KIM ,  Hiroshi KODAIRA ,  Baek Jun KIM ,  Jung Woo LEE ,  Sang Ung HWANG

IPC: H01L33/48 ,  H01L33/58

CPC classification number: H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A light-emitting device package according to an embodiment includes a package body including a cavity and a recessed portion formed around the cavity, the recessed portion having at least one concave portion; at least one light-emitting device mounted in the cavity; a light-transmitting member disposed to cover a top of the cavity and configured to transmit light emitted from the at least one light-emitting device; and a bonding member accommodated in the at least one concave portion so as to allow the light-transmitting member and the package body to be bonded to each other in the recessed portion.