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公开(公告)号：US20180130934A1
公开(公告)日：2018-05-10
申请号：US15863146
申请日：2018-01-05
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok KIM , Hiroshi KODAIRA , Su Jung JUNG , Bo Hee KANG , Young Jin NO , Yuichiro TANDA , Satoshi OZEKI
CPC classification number: H01L33/642 , H01L33/486 , H01L33/58 , H01L2924/0002 , H01L2924/00
Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
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公开(公告)号：US20140167095A1
公开(公告)日：2014-06-19
申请号：US14105439
申请日：2013-12-13
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok KIM , Young Jin NO , Bo Hee KANG , Hiroshi KODAIRA
IPC: H01L33/62
CPC classification number: H01L33/62 , H01L23/3677 , H01L23/49822 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L2224/32245 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48455 , H01L2224/48997 , H01L2224/73265 , H01L2224/85951 , H01L2924/00014 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/15174 , H01L2924/15183 , H01L2924/15787 , H01L2924/181 , H01L2224/45099 , H01L2924/20752 , H01L2924/20753 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
Abstract: Disclosed is a light emitting device package including a package body including at least one electrode pad disposed on a surface thereof, a light emitting device disposed on the package body, the light emitting device being electrically connected to the electrode pad through a wire, and a via hole electrode passing through the package body, wherein the wire forms a stitch on at least one of the light emitting device and the electrode pad, the light emitting device package further includes a bonding ball disposed on the stitch, and the via hole electrode non-overlaps the stitch and the bonding ball in a vertical direction.
Abstract translation: 公开了一种发光器件封装，其包括：封装体，其包括设置在其表面上的至少一个电极焊盘;发光器件，其布置在封装主体上，所述发光器件通过导线电连接到所述电极焊盘;以及 通孔电极通过封装体，其中，所述线在所述发光器件和所述电极焊盘中的至少一个上形成针迹，所述发光器件封装还包括设置在所述线圈上的接合球，并且所述通孔电极非 在垂直方向上重新缝合线圈和接合球。
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公开(公告)号：US20160181479A1
公开(公告)日：2016-06-23
申请号：US14978741
申请日：2015-12-22
Applicant: LG INNOTEK CO., LTD.
Inventor： Baek Jun KIM , Hiroshi KODAIRA , Ki Man KANG , Ha Na KIM , Hyun Don SONG , Jung Woo LEE , Jung Hun OH
CPC classification number: H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2924/16195 , H01L2924/16315 , H01L2933/0058 , H01L2924/00014
Abstract: A light emitting device includes a body having a cavity and a step difference structure around the cavity, a plurality of electrodes in the cavity, a light emitting chip in the cavity, a transparent window having an outer portion provided on the step difference structure to cover the cavity, and an adhesive member between the transparent window and the body. The adhesive member includes a first adhesive member between an outer bottom surface of the transparent window and a bottom of the step difference structure and a second adhesive member between the outer portion of the transparent window and the body.
Abstract translation: 一种发光器件包括具有空腔的腔体和围绕空腔的台阶差分结构，空腔中的多个电极，空腔中的发光芯片，具有设置在台阶差分结构上的外部部分的透明窗口以覆盖 空腔和透明窗与主体之间的粘合构件。 所述粘合部件包括在所述透明窗的外底表面和所述台阶差结构的底部之间的第一粘合构件，以及在所述透明窗的外部与所述主体之间的第二粘合构件。
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公开(公告)号：US20170324003A1
公开(公告)日：2017-11-09
申请号：US15319486
申请日：2015-06-08
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok KIM , Hiroshi KODAIRA , Baek Jun KIM , Ha Na KIM , Jung Woo LEE , Sang Ung HWANG
CPC classification number: H01L33/387 , F21V7/05 , H01L33/486 , H01L33/60 , H01L51/0076 , H01L2224/48091 , H01L2224/73265 , H01L2933/0033 , H05K1/0212 , H01L2924/00014
Abstract: A light-emitting device package of the embodiments includes a package body; at least one light emitting device above the package body; an adhesive layer between the at least one light emitting device and the package body; and an adhesive-layer-accommodating portion disposed in the package body for accommodating the adhesive layer therein, wherein the adhesive-layer-accommodating portion has a side surface disposed to be inclined at a predetermined angle relative to an imaginary vertical plane that extends in a thickness direction of the package body.
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公开(公告)号：US20170117443A1
公开(公告)日：2017-04-27
申请号：US15319318
申请日：2015-05-27
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok KIM , Ha Na KIM , Hiroshi KODAIRA , Baek Jun KIM , Jung Woo LEE , Sang Ung HWANG
CPC classification number: H01L33/483 , H01L33/486 , H01L33/52 , H01L33/58 , H01L2224/48091 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
Abstract: A light-emitting device package according to an embodiment includes a package body including a cavity and a recessed portion formed around the cavity, the recessed portion having at least one concave portion; at least one light-emitting device mounted in the cavity; a light-transmitting member disposed to cover a top of the cavity and configured to transmit light emitted from the at least one light-emitting device; and a bonding member accommodated in the at least one concave portion so as to allow the light-transmitting member and the package body to be bonded to each other in the recessed portion.
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Patent Agency Ranking
公开(公告)号：US20160211429A1
公开(公告)日：2016-07-21
申请号：US15082091
申请日：2016-03-28
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok KIM , Bo Hee KANG , Ha Na KIM , Hiroshi KODAIRA , Yuichiro TANDA , Satoshi OZEKI
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.
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7.发明公开公开(公告)号：US20240278536A1
公开(公告)日：2024-08-22
申请号：US18569894
申请日：2021-06-15
Applicant: Resonac Corporation , LG Innotek Co.,LTD.
Inventor： Kitaru SATO , Takaaki SAKAI , Kenji FURUYA , Hideyuki MAEDA , Hiroshi KODAIRA
CPC classification number: B32B15/08 , H05K1/0373 , H05K1/0393 , B32B2250/02 , B32B2264/1021 , B32B2264/301 , B32B2264/4021 , B32B2379/08 , B32B2457/08 , H05K2201/0154 , H05K2201/05
Abstract: Provided is a bismaleimide composition including: a bismaleimide resin (A) having a structure derived from an aromatic tetracarboxylic acid (a1), a dimer diamine (a2), and a maleic anhydride (a3); and silica particles (B) surface-treated with phenylaminosilane, in which the silica particles (B) have an average particle diameter of 100 nm or less, the silica particles (B) have an maximum aggregation particle size of 20 μm or less, and a content of the silica particles (B) is 15% by mass or less based on a total solid content of the composition.
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公开(公告)号：US20150270463A1
公开(公告)日：2015-09-24
申请号：US14729771
申请日：2015-06-03
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok KIM , Bo Hee KANG , Ha Na KIM , Hiroshi KODAIRA , Yuichiro TANDA , Satoshi OZEKI
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.
Abstract translation: 1.一种发光器件封装，包括包括第一腔和第二腔的封装体，设置在所述第一腔的底表面上的垫，设置在所述第二腔上的发光器件，电连接到所述垫，散热构件插入 散热构件包括主体和布置在主体的部分边缘区域处的扩展部分和设置在封装主体处的电极图案，其中封装体具有设置在上部的下部分的上部和下部 ，其中所述第一腔包括侧表面和底表面，其中所述第二腔设置在所述第一腔的底表面中。
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公开(公告)号：US20140191276A1
公开(公告)日：2014-07-10
申请号：US14149547
申请日：2014-01-07
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok KIM , Hiroshi KODAIRA , Ha Na KIM , Yuichiro TANDA , Satoshi OZEKI
IPC: H01L33/58
CPC classification number: H01L33/58 , H01L33/48 , H01L33/56 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
Abstract: Disclosed is a light emitting device package with improved light extraction efficiency. The light emitting device package includes a substrate, a light emitting device disposed on the substrate, and a light transmission unit disposed above the light emitting device, the light transmission unit being spaced from the light emitting device, wherein a distance between an upper surface of the light emitting device and the light transmission unit is 0.15 mm to 0.35 mm.
Abstract translation: 公开了一种具有改进的光提取效率的发光器件封装。 发光器件封装包括衬底，设置在衬底上的发光器件和设置在发光器件上方的光传输单元，光传输单元与发光器件间隔开，其中， 发光装置和光传输单元为0.15mm至0.35mm。
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公开(公告)号：US20140084182A1
公开(公告)日：2014-03-27
申请号：US14035700
申请日：2013-09-24
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok KIM , Bo Hee KANG , Ha Na KIM , Hiroshi KODAIRA
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: Embodiments provide a light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member inserted into the package body to thermally come into contact with the light emitting device, and a anti-fracture layer placed on the heat dissipation member. The anti-fracture layer vertically overlaps with at least a partial peripheral region of the heat dissipation member.
Abstract translation: 实施例提供了一种发光器件封装，其包括封装体，至少一个放置在封装主体上的电极图案，至少一个电连接到电极图案的发光器件，插入封装主体中以热接触的散热构件 和发光装置，以及设置在散热构件上的抗断裂层。 抗断裂层与散热构件的至少一部分周边区域垂直重叠。
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