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    CIRCUIT BOARD
    3.
    发明公开
    CIRCUIT BOARD 审中-公开

    公开(公告)号：US20240063104A1

    公开(公告)日：2024-02-22

    申请号：US18268186

    申请日：2021-12-17

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Se Woong NA ,  Sang Il KIM ,  Jung Eun HAN

    IPC: H01L23/498 ,  H05K1/02 ,  H05K3/28 ,  H05K3/38 ,  H01L21/48

    CPC classification number: H01L23/49822 ,  H05K1/0296 ,  H05K3/28 ,  H05K3/381 ,  H01L21/4857

    Abstract: A circuit board according to an embodiment includes an insulating layer; a circuit pattern disposed on the insulating layer; and a protective layer disposed on the insulating layer and the circuit pattern, and including first and second regions having different heights; wherein the circuit pattern includes: a first-first circuit pattern corresponding to the first region of the protective layer; and a first-second circuit pattern corresponding to the second region of the protective layer, wherein a height of the first region of the protective layer is lower than a height of the first-first circuit pattern, wherein a height of the second region of the protective layer is higher than a height of the first-second circuit pattern, wherein a surface of the first-first circuit pattern includes: a first portion in contact with the first region of the protective layer, and a second portion excluding the first portion, and wherein a surface roughness Ra of the first portion is different from a surface roughness Ra of the second portion.

    PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME
    4.
    发明申请
    PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME 有权

    公开(公告)号：US20220262713A1

    公开(公告)日：2022-08-18

    申请号：US17621810

    申请日：2020-06-24

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Se Woong NA ,  Se Ho MYEONG

    IPC: H01L23/498 ,  H01L23/13 ,  H01L21/48 ,  H05K1/18 ,  H05K3/46

    Abstract: A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; and a pad disposed on the first insulating layer and exposed through the cavity; wherein the second insulating layer includes a first portion disposed on an upper surface of the first insulating layer in a region where the cavity is formed; and a second portion other than the first portion, and wherein a thickness of the first portion is smaller than a thickness of the second portion.

    HEAT-RADIATING SUBSTRATE
    5.
    发明申请
    HEAT-RADIATING SUBSTRATE 审中-公开

    公开(公告)号：US20200369935A1

    公开(公告)日：2020-11-26

    申请号：US16959740

    申请日：2018-12-19

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Se Woong NA ,  Jae Man PARK

    IPC: C09K5/14 ,  C09J163/00 ,  C09J11/04 ,  H01L33/64 ,  B32B7/12 ,  B32B15/01 ,  B32B15/20

    Abstract: A heat-radiating substrate according to an embodiment of the present invention comprises: a first metal layer; an insulating layer disposed on the first metal layer and including an epoxy resin and an inorganic filler; and a second metal layer disposed on the insulating layer, wherein the insulating layer comprises: a first region comprising a first surface in contact with the first metal layer; and a second region comprising a second surface in contact with the second metal layer, wherein the inorganic filler comprises a boron nitride aggregate and aluminum oxide, wherein the weight ratio of the aluminum oxide to the total weight of the inorganic filler on the first face is 0.95 to 1.05 times the weight ratio of the aluminum oxide to the total weight of the inorganic filler on the second face.

    LIGHTING DEVICE AND FLAT PANEL DISPLAY HAVING THE LIGHTING DEVICE
    7.
    发明申请
    LIGHTING DEVICE AND FLAT PANEL DISPLAY HAVING THE LIGHTING DEVICE 有权
    具有照明装置的照明装置和平板显示器

    公开(公告)号：US20150009710A1

    公开(公告)日：2015-01-08

    申请号：US14291559

    申请日：2014-05-30

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Min Jae KIM ,  Bi Yi KIM ,  Se Woong NA ,  Hyun Gyu PARK ,  In Hee CHO ,  Man Hue CHOI ,  Seung Kwon HONG

    IPC: F21V8/00

    CPC classification number: G02B6/0073 ,  G02B6/0021 ,  G02B6/0068 ,  G02B6/0091

    Abstract: Provided are a lighting device and a flat panel display having the lighting device, the lighting device, including: a support substrate; a circuit board on the support substrate; light emitting devices mounted on the circuit board; and a light guide plate having a protruding portion protruding to a remaining region except for a region in which the light emitting devices are disposed.

    Abstract translation: 本发明提供一种具有照明装置，照明装置的照明装置和平板显示装置，包括：支撑基板; 支撑基板上的电路板; 安装在电路板上的发光装置; 以及导光板，其具有突出部分，除了设置有发光器件的区域之外的剩余区域。

    CIRCUIT BOARD
    9.
    发明公开
    CIRCUIT BOARD 审中-公开

    公开(公告)号：US20230247769A1

    公开(公告)日：2023-08-03

    申请号：US18009761

    申请日：2021-06-11

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jung Eun HAN ,  Se Woong NA ,  Joon II CHA

    IPC: H05K3/28

    CPC classification number: H05K3/28 ,  H05K2203/1377

    Abstract: A circuit board according to an embodiment includes: an insulating layer including a first region and a second region; a plurality of outer layer circuit patterns disposed on upper surfaces of the first region and the second region of the insulating layer; and a solder resist including a first part disposed on the first region of the insulating layer and a second part disposed on the second region of the insulating layer; wherein the first part includes an upper surface having a curved surface and exposes an upper surface of an outer layer circuit pattern disposed on the first region of the insulating layer, wherein the second part covers an upper surface of an outer layer circuit pattern disposed on the second region of the insulating layer, and wherein at least a part of the upper surface of the first part is positioned lower than the upper surface of the outer layer circuit pattern.

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