公开(公告)号：US20180130934A1

公开(公告)日：2018-05-10

申请号：US15863146

申请日：2018-01-05

Applicant: LG INNOTEK CO., LTD.

Inventor： Byung Mok KIM ,  Hiroshi KODAIRA ,  Su Jung JUNG ,  Bo Hee KANG ,  Young Jin NO ,  Yuichiro TANDA ,  Satoshi OZEKI

IPC: H01L33/64 ,  H01L33/58 ,  H01L33/48

CPC classification number: H01L33/642 ,  H01L33/486 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.

公开(公告)号：US20140167095A1

公开(公告)日：2014-06-19

申请号：US14105439

申请日：2013-12-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Byung Mok KIM ,  Young Jin NO ,  Bo Hee KANG ,  Hiroshi KODAIRA

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48455 ,  H01L2224/48997 ,  H01L2224/73265 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2924/15183 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: Disclosed is a light emitting device package including a package body including at least one electrode pad disposed on a surface thereof, a light emitting device disposed on the package body, the light emitting device being electrically connected to the electrode pad through a wire, and a via hole electrode passing through the package body, wherein the wire forms a stitch on at least one of the light emitting device and the electrode pad, the light emitting device package further includes a bonding ball disposed on the stitch, and the via hole electrode non-overlaps the stitch and the bonding ball in a vertical direction.

Abstract translation: 公开了一种发光器件封装，其包括：封装体，其包括设置在其表面上的至少一个电极焊盘;发光器件，其布置在封装主体上，所述发光器件通过导线电连接到所述电极焊盘;以及 通孔电极通过封装体，其中，所述线在所述发光器件和所述电极焊盘中的至少一个上形成针迹，所述发光器件封装还包括设置在所述线圈上的接合球，并且所述通孔电极非 在垂直方向上重新缝合线圈和接合球。