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Patent Agency Ranking
公开(公告)号：US20170069795A1
公开(公告)日：2017-03-09
申请号：US15356027
申请日：2016-11-18
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Kyoon KIM , Min Gyu NA , Myeong Soo KIM
IPC: H01L33/38 , H01L33/08 , H01L33/12 , H01L33/40 , H01L33/30 , H01L33/42 , H01L33/62 , H01L33/06 , H01L33/14
CPC classification number: H01L33/387 , H01L33/06 , H01L33/08 , H01L33/12 , H01L33/145 , H01L33/30 , H01L33/382 , H01L33/385 , H01L33/405 , H01L33/42 , H01L33/62 , H01L2224/48091 , H01L2924/00014
Abstract: Disclosed are a light emitting device, a method of manufacturing a light emitting device, a light emitting device package and a lighting system. The light emitting device includes a substrate; a first conductive semiconductor layer on the substrate; an active layer on the first conductive semiconductor layer; a second conductive semiconductor layer on the active layer; a contact layer on the second conductive semiconductor layer; an insulating layer on the contact layer; a first branch electrode electrically connected to the first conductive semiconductor layer; a plurality of first via electrodes connected to the first branch electrode and electrically connected to the first conductive semiconductor layer by passing through the insulating layer; a first pad electrode electrically connected to the first branch electrode; a second pad electrode contacts the contact layer by passing through the insulating layer; a second branch electrode connected to the second pad electrode and disposed on the insulating layer; and a plurality of second via electrodes provided through provided through the insulating layer to electrically connect the second branch electrode to the contact layer.
Abstract translation: 公开了发光器件，制造发光器件的方法，发光器件封装和照明系统。 发光装置包括：基板; 在所述基板上的第一导电半导体层; 在第一导电半导体层上的有源层; 在所述有源层上的第二导电半导体层; 第二导电半导体层上的接触层; 接触层上的绝缘层; 电连接到第一导电半导体层的第一分支电极; 多个第一通孔电极，连接到第一分支电极，并通过绝缘层与第一导电半导体层电连接; 电连接到第一分支电极的第一焊盘电极; 第二焊盘电极通过绝缘层与接触层接触; 连接到所述第二焊盘电极并设置在所述绝缘层上的第二分支电极; 以及设置成穿过所述绝缘层设置的电连接所述第二分支电极与所述接触层的多个第二通孔电极。
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2.发明申请公开(公告)号：US20150048405A1
公开(公告)日：2015-02-19
申请号：US14496490
申请日：2014-09-25
Applicant: LG Innotek Co., Ltd.
Inventor： Sung Kyoon KIM , Woo Sik LIM , Myeong Soo KIM , Sung Ho CHOO , Min Gyu NA
CPC classification number: H01L33/58 , H01L33/007 , H01L33/20 , H01L33/382 , H01L33/387 , H01L33/405 , H01L33/42 , H01L2224/48091 , H01L2933/0016 , H01L2924/00014
Abstract: Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a substrate, a light emitting structure layer, a second electrode, a first electrode, a contact portion, and a first electrode layer. The first electrode is disposed in the substrate from a lower part of the substrate to a lower part of a first conductive type semiconductor layer in a region under an active layer. The contact portion is wider than the first electrode and makes contact with the lower part of the first conductive type semiconductor layer. The first electrode layer is disposed under the substrate and connected to the first electrode.
Abstract translation: 提供了一种发光器件，发光器件封装和照明系统。 发光器件包括衬底，发光结构层，第二电极，第一电极，接触部分和第一电极层。 第一电极在有源层下方的区域中从基板的下部到第一导电型半导体层的下部设置在基板中。 接触部分比第一电极宽，并与第一导电型半导体层的下部接触。 第一电极层设置在基板下方并连接到第一电极。
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公开(公告)号：US20210098649A1
公开(公告)日：2021-04-01
申请号：US16500216
申请日：2018-04-03
Applicant: LG INNOTEK CO., LTD.
Inventor： Yong Nam PARK , June O SONG , Myeong Soo KIM , Seong Jun PARK
Abstract: Disclosed in an embodiment are a semiconductor device and a semiconductor device package including the same, the semiconductor device comprising: a semiconductor structure including a first light emitting unit and a second light emitting unit; a first electrode for electrically connecting a first conductive type semiconductor layer of the first light emitting unit with a first conductive type semiconductor layer of the second light emitting unit; and a second electrode for electrically connecting a second conductive type semiconductor layer of the first light emitting unit with a second conductive type semiconductor layer of the second light emitting unit, wherein: the first electrode includes a first pad arranged on the first light emitting unit, a first branch electrode arranged on the first light emitting unit, and a first extension electrode arranged on the second light emitting unit; the second electrode includes a second pad arranged on the second light emitting unit, a second branch electrode arranged on the second light emitting unit, and a second extension electrode arranged on the first light emitting unit; the semiconductor structure includes a first spacing section which extends in a first direction and comparts the first light emitting unit and the second light emitting unit; and the first pad and the second pad are not overlapped in the first direction and a second direction which is perpendicular to the first direction.
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公开(公告)号：US20160043280A1
公开(公告)日：2016-02-11
申请号：US14661115
申请日：2015-03-18
Applicant: LG INNOTEK CO., LTD.
Inventor： Ji Hyung MOON , Myeong Soo KIM , Chung Song KIM
CPC classification number: H01L33/387 , H01L33/38 , H01L33/382 , H01L33/405 , H01L33/44
Abstract: Disclosed are a light emitting device, a method of fabricating the same, a light emitting device package, and a lighting system. The light emitting device may include a substrate, a first conductive semiconductor layer on the substrate, an active layer on the first conductive semiconductor layer, a second conductive semiconductor layer on the active layer, an ohmic layer on the second conductive semiconductor layer, an insulating layer on the ohmic layer, a first branch electrode electrically connected with the first conductive semiconductor layer, a first pad electrode connected with the first branch electrode for electrical connection with the first conductive semiconductor layer, a second pad electrode in contact with the ohmic layer through the insulating layer, a second branch electrode connected with the second pad electrode on the insulating layer, and a second through electrode passing through the insulating layer to connect the second branch electrode with the ohmic layer.
Abstract translation: 公开了一种发光器件，其制造方法，发光器件封装和照明系统。 发光器件可以包括衬底，衬底上的第一导电半导体层，第一导电半导体层上的有源层，有源层上的第二导电半导体层，第二导电半导体层上的欧姆层，绝缘层 与所述第一导电半导体层电连接的第一分支电极，与所述第一分支电极连接以与所述第一导电半导体层电连接的第一焊盘电极，与所述欧姆层通过的第二焊盘电极 绝缘层，与绝缘层上的第二焊盘电极连接的第二分支电极和穿过绝缘层的第二贯通电极，以将第二分支电极与欧姆层连接。
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公开(公告)号：US20160126413A1
公开(公告)日：2016-05-05
申请号：US14930164
申请日：2015-11-02
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Kyoon KIM , Min Gyu NA , Myeong Soo KIM
CPC classification number: H01L33/387 , H01L33/06 , H01L33/08 , H01L33/12 , H01L33/145 , H01L33/30 , H01L33/382 , H01L33/385 , H01L33/405 , H01L33/42 , H01L33/62 , H01L2224/48091 , H01L2924/00014
Abstract: Disclosed are a light emitting device, a method of manufacturing a light emitting device, a light emitting device package and a lighting system. The light emitting device includes a substrate; a first conductive semiconductor layer on the substrate; an active layer on the first conductive semiconductor layer; a second conductive semiconductor layer on the active layer; a contact layer on the second conductive semiconductor layer; an insulating layer on the contact layer; a first branch electrode electrically connected to the first conductive semiconductor layer; a plurality of first via electrodes connected to the first branch electrode and electrically connected to the first conductive semiconductor layer by passing through the insulating layer; a first pad electrode electrically connected to the first branch electrode; a second pad electrode contacts the contact layer by passing through the insulating layer; a second branch electrode connected to the second pad electrode and disposed on the insulating layer; and a plurality of second via electrodes provided throughprovided through the insulating layer to electrically connect the second branch electrode to the contact layer.
Abstract translation: 公开了发光器件，制造发光器件的方法，发光器件封装和照明系统。 发光装置包括：基板; 在所述基板上的第一导电半导体层; 在第一导电半导体层上的有源层; 在所述有源层上的第二导电半导体层; 第二导电半导体层上的接触层; 接触层上的绝缘层; 电连接到第一导电半导体层的第一分支电极; 多个第一通孔电极，连接到第一分支电极，并通过绝缘层与第一导电半导体层电连接; 电连接到第一分支电极的第一焊盘电极; 第二焊盘电极通过绝缘层与接触层接触; 连接到所述第二焊盘电极并设置在所述绝缘层上的第二分支电极; 以及通过绝缘层提供的多个第二通孔电极，以将第二分支电极电连接到接触层。
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