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公开(公告)号：US20180040771A1
公开(公告)日：2018-02-08
申请号：US15555428
申请日：2016-02-26
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Kyoon KIM , Min Gyu NA
CPC classification number: H01L33/36 , H01L24/05 , H01L25/0753 , H01L33/08 , H01L33/385 , H01L33/505 , H01L33/507 , H01L33/62 , H01L2224/48091 , H01L2924/12041
Abstract: A light-emitting device includes a substrate, first and second electrode pads, first to M-th light-emitting cells arranged in a line in a first direction between the first and second electrode pads, and first to N-th connection wires for electrically connecting the first to M-th light-emitting cells, wherein each of the first to M-th light-emitting cells comprises a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, wherein the first electrode pad is connected to the second conductive semiconductor layer of the first light-emitting cell while the second electrode pad is connected to the first conductive semiconductor layer of the M-th light-emitting cell, and an n-th connection wire electrically connects the first conductive semiconductor layer of an n-th light-emitting cell to the second conductive semiconductor layer of an (n+1)-th light-emitting cell, which are adjacent to each other.
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2.发明申请公开(公告)号：US20150048405A1
公开(公告)日：2015-02-19
申请号：US14496490
申请日：2014-09-25
Applicant: LG Innotek Co., Ltd.
Inventor： Sung Kyoon KIM , Woo Sik LIM , Myeong Soo KIM , Sung Ho CHOO , Min Gyu NA
CPC classification number: H01L33/58 , H01L33/007 , H01L33/20 , H01L33/382 , H01L33/387 , H01L33/405 , H01L33/42 , H01L2224/48091 , H01L2933/0016 , H01L2924/00014
Abstract: Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a substrate, a light emitting structure layer, a second electrode, a first electrode, a contact portion, and a first electrode layer. The first electrode is disposed in the substrate from a lower part of the substrate to a lower part of a first conductive type semiconductor layer in a region under an active layer. The contact portion is wider than the first electrode and makes contact with the lower part of the first conductive type semiconductor layer. The first electrode layer is disposed under the substrate and connected to the first electrode.
Abstract translation: 提供了一种发光器件，发光器件封装和照明系统。 发光器件包括衬底，发光结构层，第二电极，第一电极，接触部分和第一电极层。 第一电极在有源层下方的区域中从基板的下部到第一导电型半导体层的下部设置在基板中。 接触部分比第一电极宽，并与第一导电型半导体层的下部接触。 第一电极层设置在基板下方并连接到第一电极。
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公开(公告)号：US20170229398A1
公开(公告)日：2017-08-10
申请号：US15519089
申请日：2015-08-11
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Kyoon KIM , Chung Song KIM , Ji Hyung MOON
CPC classification number: H01L23/535 , H01L27/0814 , H01L27/156 , H01L33/02 , H01L33/26 , H01L33/48 , H01L33/62 , H01L2223/58
Abstract: A light emitting device according to an embodiment includes a substrate; first to Mth light emitting cells (where M is a positive integer of two or more) which are arranged on the substrate so as to be spaced apart from each other; and first to (M−1)th interconnection wires which electrically connect the first to Mth light emitting cells in series, wherein an mth light emitting cell (where 1≦m≦M) includes a first conductive type semiconductor layer, an active layer and a second conductive type semiconductor layer, which are sequentially arranged on the substrate, and wherein an nth interconnection wire (where 1≦n≦M−1) interconnects the first conductive type semiconductor of the nth light emitting cell with the second conductive type semiconductor of the (n+1)th light emitting cell, and has a plurality of first branch wires which are spaced apart from each other.
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公开(公告)号：US20160225954A1
公开(公告)日：2016-08-04
申请号：US15007723
申请日：2016-01-27
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Kyoon KIM , Hee Young Beom , Hyun Seoung Ju , Byung Yeon Choi
CPC classification number: H01L33/38 , H01L27/156 , H01L33/06 , H01L33/20 , H01L33/385 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: A light emitting device includes a substrate, a plurality of light emitting cells separated from each other and disposed on the substrate, and a plurality of conductive interconnection layers electrically connecting two neighboring light emitting cells. Each light emitting cell includes a light emitting structure including a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, a first electrode, a second electrode, and an etching area. The light emitting structure further includes a first side surface and a second side surface, and if a width between the first side surface and the second side surface is defined as W, the second electrode is disposed in an area between a position separated from the first side surface by 1 5 W and a position separated from the first side surface of the light emitting structure by 1 2 W .
Abstract translation: 发光器件包括基板，彼此分离并设置在基板上的多个发光单元以及电连接两个相邻的发光单元的多个导电互连层。 每个发光单元包括包括第一导电型半导体层，有源层和第二导电类型半导体层，第一电极，第二电极和蚀刻区域的发光结构。 发光结构还包括第一侧表面和第二侧表面，并且如果第一侧表面和第二侧表面之间的宽度被限定为W，则第二电极设置在与第一侧表面和第二侧表面之间分离的位置之间的区域中 并且通过1 2 W从发光结构的第一侧表面分离出的位置。
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5.发明申请公开(公告)号：US20150034999A1
公开(公告)日：2015-02-05
申请号：US14519780
申请日：2014-10-21
Applicant: LG INNOTEK CO., LTD.
Inventor： Byeong Kyun CHOI , Sung Kyoon KIM , Woo Sik LIM , Sung Ho CHOO
CPC classification number: H01L33/24 , H01L33/08 , H01L33/20 , H01L33/38 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: Provided is a light emitting device. The light emitting device includes a light emitting structure layer comprising a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. A first electrode is connected to the first conductive type semiconductor layer and includes first pad, plurality of first bridge portions and plurality of first contact portions. A current spreading layer is on a top surface of the second conductive type semiconductor layer. An insulation layer is on an upper surface of the first conductive type semiconductor layer and a top surface of the current spreading layer. A second electrode is on a top surface of the current spreading layer. The plurality of first bridge portions are extended from the first pad at an acute angle to each other.
Abstract translation: 提供了一种发光装置。 发光器件包括发光结构层，其包括第一导电类型半导体层，有源层和第二导电类型半导体层。 第一电极连接到第一导电类型半导体层，并且包括第一焊盘，多个第一桥接部分和多个第一接触部分。 电流扩散层位于第二导电类型半导体层的顶表面上。 绝缘层位于第一导电类型半导体层的上表面和电流扩展层的顶表面上。 第二电极位于电流扩展层的顶表面上。 多个第一桥接部分彼此以锐角从第一焊盘延伸。
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Patent Agency Ranking
公开(公告)号：US20130105845A1
公开(公告)日：2013-05-02
申请号：US13662348
申请日：2012-10-26
Applicant: LG Innotek Co., Ltd.
Inventor： Sung Kyoon KIM , Hyun Seoung JU , Gi Seok HONG
IPC: H01L33/60
CPC classification number: H01L27/156 , H01L33/382 , H01L33/46 , H01L2224/13
Abstract: Disclosed is a light emitting device including a light emitting structure including a plurality of light emitting regions comprising a first semiconductor layer, an active layer and a second semiconductor layer, a first distributed bragg reflective layer disposed on the light emitting regions, a first electrode unit disposed on the first semiconductor layer in one of the light emitting regions, a second electrode unit disposed on the second semiconductor layer in another of the light emitting regions, an intermediate pad disposed on the first semiconductor layer or the second semiconductor layer in at least still another of the light emitting regions, and at least one connection electrode disposed on the first distributed bragg reflective layer such that the connection electrode sequentially connects the light emitting regions in series.
Abstract translation: 公开了一种发光器件，其包括发光结构，该发光结构包括多个发光区域，包括第一半导体层，有源层和第二半导体层，设置在发光区域上的第一分布式布拉格反射层，第一电极单元 设置在一个发光区域中的第一半导体层上的第二电极单元，设置在另一个发光区域中的第二半导体层上的第二电极单元，至少静止地设置在第一半导体层或第二半导体层上的中间焊盘 另一个发光区域，以及设置在第一分布式布拉格反射层上的至少一个连接电极，使得连接电极依次顺序连接发光区域。
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公开(公告)号：US20130105827A1
公开(公告)日：2013-05-02
申请号：US13660805
申请日：2012-10-25
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Kyoon KIM , Yun Kyung OH , Sung Ho CHOO
IPC: H01L33/08
CPC classification number: H01L33/405 , H01L27/15 , H01L27/156 , H01L33/06 , H01L33/08 , H01L33/24 , H01L33/32 , H01L33/387 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/12032 , H01L2924/00 , H01L2924/00014
Abstract: Disclosed is a light emitting device including: a light emitting structure including a plurality of light emitting regions including a first semiconductor layer, an active layer and a second semiconductor layer; a first electrode unit disposed on the first semiconductor layer in one of the light emitting regions; a second electrode unit disposed on the second semiconductor layer in another of the light emitting regions; an intermediate pad disposed on the second semiconductor layer in at least still another of the light emitting regions; and at least one connection electrode to sequentially connect the light emitting regions in series, wherein the light emitting regions connected in series are divided into 1st to ith light emitting region groups and areas of light emitting regions that belong to different groups are different (where 1
Abstract translation: 公开了一种发光器件，包括：发光结构，包括多个发光区域，包括第一半导体层，有源层和第二半导体层; 设置在所述发光区域中的所述第一半导体层上的第一电极单元; 第二电极单元，设置在另一个发光区域中的第二半导体层上; 中间焊盘，设置在至少另一个发光区域中的第二半导体层上; 以及至少一个连接电极，以串联连接发光区域，其中串联连接的发光区域分为第一至第三发光区域组，属于不同组的发光区域的区域不同（其中1 i，j，i和j分别是自然数，j是最后的发光区域组）。
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公开(公告)号：US20160293819A1
公开(公告)日：2016-10-06
申请号：US15187053
申请日：2016-06-20
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Kyoon KIM , Young Bong YOO , Sung Ho CHOO
IPC: H01L33/62 , H01L33/30 , H01L25/075 , H01L33/06
CPC classification number: H01L33/62 , H01L25/0753 , H01L27/156 , H01L33/06 , H01L33/08 , H01L33/30 , H01L33/38 , H01L2924/0002 , H01L2924/00
Abstract: A light emitting device includes a substrate, a plurality of light emitting cells disposed on the substrate to be spaced apart from each other, and a connection wire electrically connecting adjacent ones of the light emitting cells. One of the adjacent light emitting cells includes a plurality of first segments, and the other of the adjacent light emitting cells includes a plurality of second segments respectively facing the first segments. A separation distance is provided between first and second segments facing each other, where each of which has an end contacting the connection wire is greater than a separation distance between first and second segments facing each other, and each of which has an end that does not contact the connection wire.
Abstract translation: 发光器件包括基板，设置在基板上以彼此间隔开的多个发光单元，以及连接相邻的发光单元的连接线。 相邻的发光单元中的一个包括多个第一段，并且相邻的发光单元中的另一个包括分别面向第一段的多个第二段。 在彼此面对的第一和第二段之间提供间隔距离，其中每一个具有接触连接线的一端大于彼此面对的第一和第二段之间的间隔距离，并且每个具有不相邻的端部 接触连接线。
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公开(公告)号：US20160126413A1
公开(公告)日：2016-05-05
申请号：US14930164
申请日：2015-11-02
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Kyoon KIM , Min Gyu NA , Myeong Soo KIM
CPC classification number: H01L33/387 , H01L33/06 , H01L33/08 , H01L33/12 , H01L33/145 , H01L33/30 , H01L33/382 , H01L33/385 , H01L33/405 , H01L33/42 , H01L33/62 , H01L2224/48091 , H01L2924/00014
Abstract: Disclosed are a light emitting device, a method of manufacturing a light emitting device, a light emitting device package and a lighting system. The light emitting device includes a substrate; a first conductive semiconductor layer on the substrate; an active layer on the first conductive semiconductor layer; a second conductive semiconductor layer on the active layer; a contact layer on the second conductive semiconductor layer; an insulating layer on the contact layer; a first branch electrode electrically connected to the first conductive semiconductor layer; a plurality of first via electrodes connected to the first branch electrode and electrically connected to the first conductive semiconductor layer by passing through the insulating layer; a first pad electrode electrically connected to the first branch electrode; a second pad electrode contacts the contact layer by passing through the insulating layer; a second branch electrode connected to the second pad electrode and disposed on the insulating layer; and a plurality of second via electrodes provided throughprovided through the insulating layer to electrically connect the second branch electrode to the contact layer.
Abstract translation: 公开了发光器件，制造发光器件的方法，发光器件封装和照明系统。 发光装置包括：基板; 在所述基板上的第一导电半导体层; 在第一导电半导体层上的有源层; 在所述有源层上的第二导电半导体层; 第二导电半导体层上的接触层; 接触层上的绝缘层; 电连接到第一导电半导体层的第一分支电极; 多个第一通孔电极，连接到第一分支电极，并通过绝缘层与第一导电半导体层电连接; 电连接到第一分支电极的第一焊盘电极; 第二焊盘电极通过绝缘层与接触层接触; 连接到所述第二焊盘电极并设置在所述绝缘层上的第二分支电极; 以及通过绝缘层提供的多个第二通孔电极，以将第二分支电极电连接到接触层。
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公开(公告)号：US20170069795A1
公开(公告)日：2017-03-09
申请号：US15356027
申请日：2016-11-18
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Kyoon KIM , Min Gyu NA , Myeong Soo KIM
IPC: H01L33/38 , H01L33/08 , H01L33/12 , H01L33/40 , H01L33/30 , H01L33/42 , H01L33/62 , H01L33/06 , H01L33/14
CPC classification number: H01L33/387 , H01L33/06 , H01L33/08 , H01L33/12 , H01L33/145 , H01L33/30 , H01L33/382 , H01L33/385 , H01L33/405 , H01L33/42 , H01L33/62 , H01L2224/48091 , H01L2924/00014
Abstract: Disclosed are a light emitting device, a method of manufacturing a light emitting device, a light emitting device package and a lighting system. The light emitting device includes a substrate; a first conductive semiconductor layer on the substrate; an active layer on the first conductive semiconductor layer; a second conductive semiconductor layer on the active layer; a contact layer on the second conductive semiconductor layer; an insulating layer on the contact layer; a first branch electrode electrically connected to the first conductive semiconductor layer; a plurality of first via electrodes connected to the first branch electrode and electrically connected to the first conductive semiconductor layer by passing through the insulating layer; a first pad electrode electrically connected to the first branch electrode; a second pad electrode contacts the contact layer by passing through the insulating layer; a second branch electrode connected to the second pad electrode and disposed on the insulating layer; and a plurality of second via electrodes provided through provided through the insulating layer to electrically connect the second branch electrode to the contact layer.
Abstract translation: 公开了发光器件，制造发光器件的方法，发光器件封装和照明系统。 发光装置包括：基板; 在所述基板上的第一导电半导体层; 在第一导电半导体层上的有源层; 在所述有源层上的第二导电半导体层; 第二导电半导体层上的接触层; 接触层上的绝缘层; 电连接到第一导电半导体层的第一分支电极; 多个第一通孔电极，连接到第一分支电极，并通过绝缘层与第一导电半导体层电连接; 电连接到第一分支电极的第一焊盘电极; 第二焊盘电极通过绝缘层与接触层接触; 连接到所述第二焊盘电极并设置在所述绝缘层上的第二分支电极; 以及设置成穿过所述绝缘层设置的电连接所述第二分支电极与所述接触层的多个第二通孔电极。
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