公开(公告)号：US20240355667A1

公开(公告)日：2024-10-24

申请号：US18758576

申请日：2024-06-28

Applicant: LAM RESEARCH CORPORATION

Inventor： Haoquan YAN ,  Robert Griffith O'NEILL ,  Raphael CASAES ,  Jon MCCHESNEY ,  Alex PATERSON

IPC: H01L21/687 ,  H01J37/02 ,  H01J37/20 ,  H01J37/32 ,  H01L21/67

CPC classification number: H01L21/68742 ,  H01J37/023 ,  H01J37/20 ,  H01J37/32623 ,  H01J37/32642 ,  H01J37/32715 ,  H01L21/67069 ,  H01L21/68735

Abstract: An edge ring arrangement for a processing chamber includes a first ring configured to surround and overlap a radially outer edge of an upper plate of a pedestal arranged in the processing chamber, a second ring arranged below the first moveable ring, wherein a portion of the first ring overlaps the second ring, a first actuator configured to actuate a first pillar to selectively move the first ring to a raised position and a lowered position relative to the pedestal, and a second actuator configured to actuate a second pillar to selectively move the second ring to a raised position and a lowered position relative to the pedestal.

公开(公告)号：US20240355597A1

公开(公告)日：2024-10-24

申请号：US18682869

申请日：2022-08-19

Applicant: Lam Research Corporation

Inventor： Chih-Yang CHANG ,  Raphael CASAES ,  Seokmin YUN ,  Shih-Yuan CHENG ,  Chih-Min LIN ,  Shuogang HUANG ,  Anurag Kumar MISHRA

IPC: H01J37/32 ,  H01L21/3213

CPC classification number: H01J37/32862 ,  H01J37/32422 ,  H01J37/3244 ,  H01J37/32926 ,  H01J37/32082 ,  H01J2237/334 ,  H01L21/32136

Abstract: An apparatus for ion beam etching is provided. An ion extractor separates a plasma source chamber from a process chamber. A gas inlet provides gas to the plasma source chamber. An RF power system provides RF power to the plasma source chamber. A process gas source and cleaning gas mixture source are connected to the gas inlet.

公开(公告)号：US20190013232A1

公开(公告)日：2019-01-10

申请号：US16131822

申请日：2018-09-14

Applicant: LAM RESEARCH CORPORATION

Inventor： Haoquan YAN ,  Robert Griffith O'NEILL ,  Raphael CASAES ,  Jon MCCHESNEY ,  Alex PATERSON

IPC: H01L21/687 ,  H01J37/32 ,  H01J37/02 ,  H01L21/67 ,  H01J37/20

Abstract: An edge ring is configured to be raised and lowered relative to a pedestal, via one or more lift pins, in a processing chamber of a substrate processing system. The edge ring includes an upper surface, an annular inner diameter, an annular outer diameter, a lower surface, and at least one feature arranged in the lower surface of the edge ring. At least one inner surface of the at least one feature is sloped.