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公开(公告)号：US08680658B2
公开(公告)日：2014-03-25
申请号：US12130663
申请日：2008-05-30
IPC分类号： H01L23/495
CPC分类号： H01L23/49524 , H01L23/4334 , H01L23/49551 , H01L23/49562 , H01L23/49568 , H01L23/544 , H01L24/28 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2223/54486 , H01L2224/32245 , H01L2224/37011 , H01L2224/371 , H01L2224/40095 , H01L2224/40245 , H01L2224/451 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/73219 , H01L2224/73221 , H01L2224/83801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/05599
摘要： A clip for a semiconductor device package may include two or more separate electrically conductive fingers electrically connected to each other by one or more electrically conductive bridges. A first end of at least finger is adapted for electrical contact with a lead frame. The bridges are adapted to provide electrical connection to a top semiconductor region of a semiconductor device and may also to provide heat dissipation path when a top surface of the fingers is exposed. A semiconductor device package may include the clip along with a semiconductor device and a lead frame. The semiconductor device may have a first and semiconductor regions on top and bottom surfaces respectively. The clip may be electrically connected to the top semiconductor region at the bridges and electrically connected to the lead frame at a first end of at least one of the fingers.
摘要翻译： 用于半导体器件封装的夹子可以包括通过一个或多个导电桥彼此电连接的两个或更多个分离的导电指状物。 至少手指的第一端适于与引线框架电接触。 桥适于提供与半导体器件的顶部半导体区域的电连接，并且还可以在手指的顶表面暴露时提供散热路径。 半导体器件封装可以包括夹子以及半导体器件和引线框架。 半导体器件可以分别在顶表面和底表面上具有第一半导体区域和半导体区域。 夹子可以在桥接处电连接到顶部半导体区域，并且在至少一个手指的第一端处电连接到引线框架。
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公开(公告)号：US20090236708A1
公开(公告)日：2009-09-24
申请号：US12474107
申请日：2009-05-28
IPC分类号： H01L23/495 , H01L23/34
CPC分类号： H01L23/49524 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/37011 , H01L2224/371 , H01L2224/40095 , H01L2224/40245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, and a semiconductor die coupled to the leadframe, the semiconductor die having a plurality of metallized source contacts. A bridged source plate interconnection has a bridge portion, valley portions disposed on either side of the bridge portion, plane portions disposed on either side of the valley portions and the bridge portion, and a connection portion depending from one of the plane portions, the bridged source plate interconnection connecting the source lead with the plurality of metallized source contacts. The bridge portion is disposed in a plane above the plane of the valley portions while the plane portions are disposed in a plane intermediate the plane of the bridge portion and the plane of the valley portions.
摘要翻译： 公开了半导体封装。 封装包括具有漏极，源极和栅极引线的引线框架，以及耦合到引线框架的半导体管芯，半导体管芯具有多个金属化源极触点。 桥接源极板互连具有桥接部分，设置在桥接部分的任一侧上的谷部分，设置在谷部分和桥接部分两侧的平面部分以及从平面部分之一悬挂的连接部分， 将源极引线与多个金属化源触点连接的源极板互连。 桥面部分设置在平坦部分的平面上方的平面中，而平面部分设置在桥接部分的平面和谷部的平面之间的平面中。
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公开(公告)号：US20110227205A1
公开(公告)日：2011-09-22
申请号：US12726892
申请日：2010-03-18
申请人： Jun Lu , Ming Sun , Yueh-Se Ho , Kai Liu , Lei Shi
发明人： Jun Lu , Ming Sun , Yueh-Se Ho , Kai Liu , Lei Shi
IPC分类号： H01L23/52 , H01L21/60 , H01L23/538
CPC分类号： H01L21/56 , H01L23/3107 , H01L23/49524 , H01L23/49537 , H01L23/49562 , H01L23/49575 , H01L24/29 , H01L24/37 , H01L24/38 , H01L24/40 , H01L24/41 , H01L24/83 , H01L24/84 , H01L24/97 , H01L2224/2919 , H01L2224/32245 , H01L2224/37011 , H01L2224/371 , H01L2224/4007 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/40249 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/73263 , H01L2224/83 , H01L2224/83801 , H01L2224/8385 , H01L2224/8485 , H01L2224/92 , H01L2224/97 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0781 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2224/84 , H01L2924/0665 , H01L2924/00 , H01L2924/00015 , H01L2924/00012 , H01L2924/00014
摘要： The present invention features a lead-frame package, having a first, second, third and fourth electrically conductive structures with a pair of semiconductor dies disposed therebetween defining a stacked structure. The first and second structures are spaced-apart from and in superimposition with the first structure. A semiconductor die is disposed between the first and second structures. The semiconductor die has contacts electrically connected to the first and second structures. A part of the third structure lies in a common plane with a portion of the second structure. The third structure is coupled to the semiconductor die. An additional semiconductor die is attached to one of the first and second structures. The fourth structure is in electrical contact with the additional semiconductor die. A molding compound is disposed to encapsulate a portion of said package with a sub-portion of the molding compound being disposed in the volume.
摘要翻译： 本发明的特征在于具有第一，第二，第三和第四导电结构的引线框架封装，其中设置在其间的一对半导体管芯限定堆叠结构。 第一和第二结构与第一结构隔开并与第一结构重叠。 半导体管芯设置在第一和第二结构之间。 半导体管芯具有电连接到第一和第二结构的触点。 第三结构的一部分位于具有第二结构的一部分的共同平面中。 第三结构耦合到半导体管芯。 附加的半导体管芯附接到第一和第二结构中的一个。 第四结构与附加的半导体管芯电接触。 设置模塑料以封装所述包装的一部分，其中模制化合物的一部分设置在体积中。
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公开(公告)号：US08513784B2
公开(公告)日：2013-08-20
申请号：US12726892
申请日：2010-03-18
申请人： Jun Lu , Ming Sun , Yueh-Se Ho , Kai Liu , Lei Shi
发明人： Jun Lu , Ming Sun , Yueh-Se Ho , Kai Liu , Lei Shi
IPC分类号： H01L23/495 , H01L23/48
CPC分类号： H01L21/56 , H01L23/3107 , H01L23/49524 , H01L23/49537 , H01L23/49562 , H01L23/49575 , H01L24/29 , H01L24/37 , H01L24/38 , H01L24/40 , H01L24/41 , H01L24/83 , H01L24/84 , H01L24/97 , H01L2224/2919 , H01L2224/32245 , H01L2224/37011 , H01L2224/371 , H01L2224/4007 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/40249 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/73263 , H01L2224/83 , H01L2224/83801 , H01L2224/8385 , H01L2224/8485 , H01L2224/92 , H01L2224/97 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0781 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2224/84 , H01L2924/0665 , H01L2924/00 , H01L2924/00015 , H01L2924/00012 , H01L2924/00014
摘要： The present invention features a lead-frame package, having a first, second, third and fourth electrically conductive structures with a pair of semiconductor dies disposed therebetween defining a stacked structure. The first and second structures are spaced-apart from and in superimposition with the first structure. A semiconductor die is disposed between the first and second structures. The semiconductor die has contacts electrically connected to the first and second structures. A part of the third structure lies in a common plane with a portion of the second structure. The third structure is coupled to the semiconductor die. An additional semiconductor die is attached to one of the first and second structures. The fourth structure is in electrical contact with the additional semiconductor die. A molding compound is disposed to encapsulate a portion of said package with a sub-portion of the molding compound being disposed in the volume.
摘要翻译： 本发明的特征在于具有第一，第二，第三和第四导电结构的引线框架封装，其中设置在其间的一对半导体管芯限定堆叠结构。 第一和第二结构与第一结构隔开并与第一结构重叠。 半导体管芯设置在第一和第二结构之间。 半导体管芯具有电连接到第一和第二结构的触点。 第三结构的一部分位于具有第二结构的一部分的共同平面中。 第三结构耦合到半导体管芯。 附加的半导体管芯附接到第一和第二结构中的一个。 第四结构与附加的半导体管芯电接触。 设置模塑料以封装所述包装的一部分，其中模制化合物的一部分设置在体积中。
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公开(公告)号：US08053874B2
公开(公告)日：2011-11-08
申请号：US12321761
申请日：2009-01-23
IPC分类号： H01L23/495
CPC分类号： H01L23/49524 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/41 , H01L2224/32245 , H01L2224/37011 , H01L2224/4007 , H01L2224/40095 , H01L2224/40245 , H01L2224/40249 , H01L2224/4103 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, a semiconductor die coupled to the leadframe, the semiconductor die having a plurality of metalized source areas and a metalized gate area, a patterned source connection having a plurality of dimples formed thereon coupling the source lead to the semiconductor die metalized source areas, a patterned gate connection having a dimple formed thereon coupling the gate lead to the semiconductor die metalized gate area, a semiconductor die drain area coupled to the drain lead, and an encapsulant covering at least a portion of the semiconductor die and drain, source and gate leads.
摘要翻译： 公开了半导体封装。 该封装包括具有漏极，源极和栅极引线的引线框架，耦合到引线框架的半导体管芯，具有多个金属化源极区域和金属化栅极区域的半导体管芯，具有形成在其上的多个凹坑的图案化源极连接， 源极引导到半导体芯片金属化源极区域，具有形成在其上的凹坑的图案化栅极连接将栅极引线耦合到半导体管芯金属化栅极区域，耦合到漏极引线的半导体管芯漏极区域和覆盖至少一部分的密封剂 的半导体管芯和漏极，源极和栅极引线。
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公开(公告)号：US20070290336A1
公开(公告)日：2007-12-20
申请号：US11799467
申请日：2007-04-30
IPC分类号： H01L23/48
CPC分类号： H01L23/49524 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/41 , H01L2224/32245 , H01L2224/37011 , H01L2224/4007 , H01L2224/40095 , H01L2224/40245 , H01L2224/40249 , H01L2224/4103 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, a semiconductor die coupled to the leadframe, the semiconductor die having a plurality of metalized source areas and a metalized gate area, a patterned source connection having a plurality of dimples formed thereon coupling the source lead to the semiconductor die metalized source areas, a patterned gate connection having a dimple formed thereon coupling the gate lead to the semiconductor die metalized gate area, a semiconductor die drain area coupled to the drain lead, and an encapsulant covering at least a portion of the semiconductor die and drain, source and gate leads.
摘要翻译： 公开了半导体封装。 该封装包括具有漏极，源极和栅极引线的引线框架，耦合到引线框架的半导体管芯，具有多个金属化源极区域和金属化栅极区域的半导体管芯，具有形成在其上的多个凹坑的图案化源极连接， 源极引导到半导体芯片金属化源极区域，具有形成在其上的凹坑的图案化栅极连接将栅极引线耦合到半导体管芯金属化栅极区域，耦合到漏极引线的半导体管芯漏极区域和覆盖至少一部分的密封剂 的半导体管芯和漏极，源极和栅极引线。
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公开(公告)号：US07683464B2
公开(公告)日：2010-03-23
申请号：US11799467
申请日：2007-04-30
IPC分类号： H01L23/495
CPC分类号： H01L23/49524 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/41 , H01L2224/32245 , H01L2224/37011 , H01L2224/4007 , H01L2224/40095 , H01L2224/40245 , H01L2224/40249 , H01L2224/4103 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, a semiconductor die coupled to the leadframe, the semiconductor die having a plurality of metalized source areas and a metalized gate area, a patterned source connection having a plurality of dimples formed thereon coupling the source lead to the semiconductor die metalized source areas, a patterned gate connection having a dimple formed thereon coupling the gate lead to the semiconductor die metalized gate area, a semiconductor die drain area coupled to the drain lead, and an encapsulant covering at least a portion of the semiconductor die and drain, source and gate leads.
摘要翻译： 公开了半导体封装。 该封装包括具有漏极，源极和栅极引线的引线框架，耦合到引线框架的半导体管芯，具有多个金属化源极区域和金属化栅极区域的半导体管芯，具有形成在其上的多个凹坑的图案化源极连接， 源极引导到半导体芯片金属化源极区域，具有形成在其上的凹坑的图案化栅极连接将栅极引线耦合到半导体管芯金属化栅极区域，耦合到漏极引线的半导体管芯漏极区域和覆盖至少一部分的密封剂 的半导体管芯和漏极，源极和栅极引线。
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公开(公告)号：US20090294934A1
公开(公告)日：2009-12-03
申请号：US12130663
申请日：2008-05-30
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49524 , H01L23/4334 , H01L23/49551 , H01L23/49562 , H01L23/49568 , H01L23/544 , H01L24/28 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2223/54486 , H01L2224/32245 , H01L2224/37011 , H01L2224/371 , H01L2224/40095 , H01L2224/40245 , H01L2224/451 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/73219 , H01L2224/73221 , H01L2224/83801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/05599
摘要： A clip for a semiconductor device package may include two or more separate electrically conductive fingers electrically connected to each other by one or more electrically conductive bridges. A first end of at least finger is adapted for electrical contact with a lead frame. The bridges are adapted to provide electrical connection to a top semiconductor region of a semiconductor device and may also to provide heat dissipation path when a top surface of the fingers is exposed. A semiconductor device package may include the clip along with a semiconductor device and a lead frame. The semiconductor device may have a first and semiconductor regions on top and bottom surfaces respectively. The clip may be electrically connected to the top semiconductor region at the bridges and electrically connected to the lead frame at a first end of at least one of the fingers.
摘要翻译： 用于半导体器件封装的夹子可以包括通过一个或多个导电桥彼此电连接的两个或更多个分离的导电指状物。 至少手指的第一端适于与引线框架电接触。 桥适于提供与半导体器件的顶部半导体区域的电连接，并且还可以在手指的顶表面暴露时提供散热路径。 半导体器件封装可以包括夹子以及半导体器件和引线框架。 半导体器件可以分别在顶表面和底表面上具有第一半导体区域和半导体区域。 夹子可以在桥接处电连接到顶部半导体区域，并且在至少一个手指的第一端处电连接到引线框架。
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公开(公告)号：US20090218673A1
公开(公告)日：2009-09-03
申请号：US12321761
申请日：2009-01-23
IPC分类号： H01L23/48
CPC分类号： H01L23/49524 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/41 , H01L2224/32245 , H01L2224/37011 , H01L2224/4007 , H01L2224/40095 , H01L2224/40245 , H01L2224/40249 , H01L2224/4103 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, a semiconductor die coupled to the leadframe, the semiconductor die having a plurality of metalized source areas and a metalized gate area, a patterned source connection having a plurality of dimples formed thereon coupling the source lead to the semiconductor die metalized source areas, a patterned gate connection having a dimple formed thereon coupling the gate lead to the semiconductor die metalized gate area, a semiconductor die drain area coupled to the drain lead, and an encapsulant covering at least a portion of the semiconductor die and drain, source and gate leads.
摘要翻译： 公开了半导体封装。 该封装包括具有漏极，源极和栅极引线的引线框架，耦合到引线框架的半导体管芯，具有多个金属化源极区域和金属化栅极区域的半导体管芯，具有形成在其上的多个凹坑的图案化源极连接， 源极引导到半导体芯片金属化源极区域，具有形成在其上的凹坑的图案化栅极连接将栅极引线耦合到半导体管芯金属化栅极区域，耦合到漏极引线的半导体管芯漏极区域和覆盖至少一部分的密封剂 的半导体管芯和漏极，源极和栅极引线。
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公开(公告)号：US20080087992A1
公开(公告)日：2008-04-17
申请号：US11906136
申请日：2007-09-28
IPC分类号： H01L23/495
CPC分类号： H01L23/49524 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/37011 , H01L2224/371 , H01L2224/40095 , H01L2224/40245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, and a semiconductor die coupled to the leadframe, the semiconductor die having a plurality of metalized source contacts. A bridged source plate interconnection has a bridge portion, valley portions disposed on either side of the bridge portion, plane portions disposed on either side of the valley portions and the bridge portion, and a connection portion depending from one of the plane portions, the bridged source plate interconnection connecting the source lead with the plurality of metalized source contacts. The bridge portion is disposed in a plane above the plane of the valley portions while the plane portions are disposed in a plane intermediate the plane of the bridge portion and the plane of the valley portions.
摘要翻译： 公开了半导体封装。 封装包括具有漏极，源极和栅极引线的引线框架以及耦合到引线框架的半导体管芯，该半导体管芯具有多个金属化源极触点。 桥接源极板互连具有桥接部分，设置在桥接部分的任一侧上的谷部分，设置在谷部分和桥接部分两侧的平面部分以及从平面部分之一悬挂的连接部分， 将源极引线与多个金属化源触点连接的源极板互连。 桥面部分设置在平坦部分的平面上方的平面中，而平面部分设置在桥接部分的平面和谷部的平面之间的平面中。
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