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188 条记录 (耗时 0.022 秒)

    Multichip package, methods of manufacture thereof and articles comprising the same
    1.
    发明授权
    Multichip package, methods of manufacture thereof and articles comprising the same 有权
    多芯片封装，其制造方法和包含该多芯片封装的制品

    公开(公告)号：US07745898B2

    公开(公告)日：2010-06-29

    申请号：US11960903

    申请日：2007-12-20

    申请人： Levi A. Campbell ,  Casimer M. DeCusatis

    发明人： Levi A. Campbell ,  Casimer M. DeCusatis

    IPC分类号： H01L23/10 ,  H01L23/24

    CPC分类号： G02B6/4201 ,  G02B6/4249 ,  G02B6/4268 ,  H01S5/02208 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02407 ,  H01S5/423

    摘要： Disclosed herein is a multichip package comprising an optoelectronics assembly; a socket that houses the optoelectronics assembly; the socket being in electrical communication with the optoelectronics assembly; a plate having a first surface and a second surface; the first surface being opposedly disposed to the second surface; a portion of the first surface contacting a portion of the socket to provide thermal contact between the socket and the plate; a serpentine channel being disposed between the plate and the socket to provide a passage for a communication cable that is in operative communication with the optoelectronics assembly; and a heat exchanger in thermal contact with the plate; the heat exchanger being operative to cool the multichip package.

    摘要翻译： 本文公开了一种包括光电组件的多芯片封装; 容纳光电组件的插座; 插座与光电组件电连通; 具有第一表面和第二表面的板; 所述第一表面相对地设置在所述第二表面上; 所述第一表面的一部分接触所述插座的一部分以提供所述插座和所述板之间的热接触; 蛇形通道设置在板和插座之间，以提供与光电子组件可操作地通信的通信电缆的通道; 和与该板热接触的热交换器; 所述热交换器可操作以冷却所述多芯片封装。

    MULTICHIP PACKAGE, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME
    2.
    发明申请
    MULTICHIP PACKAGE, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME 有权
    多媒体包装及其制造方法及其相关文章

    公开(公告)号：US20090161709A1

    公开(公告)日：2009-06-25

    申请号：US11960903

    申请日：2007-12-20

    申请人： Levi A. Campbell ,  Casimer M. DeCusatis

    发明人： Levi A. Campbell ,  Casimer M. DeCusatis

    IPC分类号： H01S5/024 ,  H01L23/48 ,  H01L21/58

    CPC分类号： G02B6/4201 ,  G02B6/4249 ,  G02B6/4268 ,  H01S5/02208 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02407 ,  H01S5/423

    摘要： Disclosed herein is a multichip package comprising an optoelectronics assembly; a socket that houses the optoelectronics assembly; the socket being in electrical communication with the optoelectronics assembly; a plate having a first surface and a second surface; the first surface being opposedly disposed to the second surface; a portion of the first surface contacting a portion of the socket to provide thermal contact between the socket and the plate; a serpentine channel being disposed between the plate and the socket to provide a passage for a communication cable that is in operative communication with the optoelectronics assembly; and a heat exchanger in thermal contact with the plate; the heat exchanger being operative to cool the multichip package.

    摘要翻译： 本文公开了一种包括光电组件的多芯片封装; 容纳光电组件的插座; 插座与光电组件电连通; 具有第一表面和第二表面的板; 所述第一表面相对地设置在所述第二表面上; 所述第一表面的一部分接触所述插座的一部分以提供所述插座和所述板之间的热接触; 蛇形通道设置在板和插座之间，以提供与光电子组件可操作地通信的通信电缆的通道; 和与该板热接触的热交换器; 所述热交换器可操作以冷却所述多芯片封装。

    Enhanced separation of injection molded microlenses for high volume manufacturing
    7.
    发明授权
    Enhanced separation of injection molded microlenses for high volume manufacturing 有权
    增强注射成型微透镜的分离，用于大批量生产

    公开(公告)号：US09079369B2

    公开(公告)日：2015-07-14

    申请号：US12603565

    申请日：2009-10-21

    申请人： Casimer M. DeCusatis ,  Lawrence Jacobowitz

    发明人： Casimer M. DeCusatis ,  Lawrence Jacobowitz

    IPC分类号： B29D11/00 ,  B29C33/44 ,  B29C37/00 ,  B29C35/08

    CPC分类号： B29D11/00365 ,  B29C33/44 ,  B29C35/0888 ,  B29C37/0003 ,  B29C37/0067 ,  B29C2035/0827 ,  B29D11/00201

    摘要： A method and system for enhanced demolding of injection molded optical devices are disclosed. In one embodiment the system includes a metal moldplate without a coat of release layer and a curing device that generates high intensity pulses of UV light. The method includes: providing a moldplate made of a predetermined moldplate material; directly injecting optical material into cavities of a moldplate without a release layer; rapidly curing the injected optical material with high intensity pulses of UV light such that a predetermined optical device is formed; and separating the thus formed optical device from the cavities of the moldplate due to a differential thermal expansion between the optical device material and the moldplate material.

    摘要翻译： 公开了一种用于注射成型的光学器件的增强脱模的方法和系统。 在一个实施例中，系统包括没有剥离层的金属模板和产生高强度的UV光脉冲的固化装置。 该方法包括：提供由预定的模板材料制成的模板; 将光学材料直接注入到没有剥离层的模板的空腔中; 以高强度UV光脉冲快速固化注入的光学材料，从而形成预定的光学装置; 并且由于光学装置材料和模板材料之间的热膨胀差异，将由此形成的光学装置与模板的空腔分离。

    Hash collision reduction system
    9.
    发明授权
    Hash collision reduction system 有权
    哈希碰撞减少系统

    公开(公告)号：US08762399B2

    公开(公告)日：2014-06-24

    申请号：US13475990

    申请日：2012-05-20

    申请人： Jean L. Calvignac ,  Casimer M. DeCusatis ,  Fabrice J. Verplanken ,  Daniel Wind

    发明人： Jean L. Calvignac ,  Casimer M. DeCusatis ,  Fabrice J. Verplanken ,  Daniel Wind

    IPC分类号： G06F17/30

    CPC分类号： G06F17/30002 ,  G06F17/30949 ,  H04L9/00 ,  H04L9/3236 ,  H04L45/7453

    摘要： An improved computer system that can include a controller having a computer processor, the controller to reduce insertion times and/or collisions when interfacing with new components introduced to the controller. The system may also include a collision avoidance apparatus that reduces hashing collisions by using a plurality of tables and a plurality of keys per bucket. The system may further include a hash apparatus in communication with the controller to map the plurality of keys to the plurality of tables where the hash apparatus uses a single hash logic to provide an avalanche effect when one key is changed which results in nearly half of bits changing in the plurality of tables.

    摘要翻译： 一种改进的计算机系统，其可以包括具有计算机处理器的控制器，所述控制器在与引入到控制器的新组件接口时减少插入时间和/或冲突。 该系统还可以包括通过使用多个表和每个桶的多个密钥来减少散列冲突的冲突避免装置。 该系统还可以包括与控制器通信的散列装置，以将多个密钥映射到多个表，其中散列装置使用单个散列逻辑以在一个密钥改变时提供雪崩效应，这导致几乎一半的比特 改变多个表。