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公开(公告)号:US08455321B2
公开(公告)日:2013-06-04
申请号:US13294526
申请日:2011-11-11
申请人: Li-Shyue Lai , Jing-Cheng Lin
发明人: Li-Shyue Lai , Jing-Cheng Lin
IPC分类号: H01L21/336
CPC分类号: H01L29/785 , H01L29/1054 , H01L29/165 , H01L29/66795
摘要: A method of forming an integrated circuit structure includes forming a first insulation region and a second insulation region in a semiconductor substrate and facing each other; and forming an epitaxial semiconductor region having a reversed T-shape. The epitaxial semiconductor region includes a horizontal plate including a bottom portion between and adjoining the first insulation region and the second insulation region, and a fin over and adjoining the horizontal plate. The bottom of the horizontal plate contacts the semiconductor substrate. The method further includes forming a gate dielectric on a top surface and at least top portions of sidewalls of the fin; and forming a gate electrode over the gate dielectric.
摘要翻译: 形成集成电路结构的方法包括:在半导体衬底中形成第一绝缘区域和第二绝缘区域并彼此面对; 以及形成具有反向T形的外延半导体区域。 外延半导体区域包括水平板,该水平板包括在第一绝缘区域和第二绝缘区域之间并邻接第一绝缘区域之间的底部,以及在水平板上并邻接的鳍状物。 水平板的底部接触半导体衬底。 该方法还包括在鳍的顶表面和至少顶部的顶部形成栅电介质; 以及在所述栅极电介质上形成栅电极。
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公开(公告)号:US20120058628A1
公开(公告)日:2012-03-08
申请号:US13294526
申请日:2011-11-11
申请人: Li-Shyue Lai , Jing-Cheng Lin
发明人: Li-Shyue Lai , Jing-Cheng Lin
IPC分类号: H01L21/20
CPC分类号: H01L29/785 , H01L29/1054 , H01L29/165 , H01L29/66795
摘要: A method of forming an integrated circuit structure includes forming a first insulation region and a second insulation region in a semiconductor substrate and facing each other; and forming an epitaxial semiconductor region having a reversed T-shape. The epitaxial semiconductor region includes a horizontal plate including a bottom portion between and adjoining the first insulation region and the second insulation region, and a fin over and adjoining the horizontal plate. The bottom of the horizontal plate contacts the semiconductor substrate. The method further includes forming a gate dielectric on a top surface and at least top portions of sidewalls of the fin; and forming a gate electrode over the gate dielectric.
摘要翻译: 形成集成电路结构的方法包括:在半导体衬底中形成第一绝缘区域和第二绝缘区域并彼此面对; 以及形成具有反向T形的外延半导体区域。 外延半导体区域包括水平板,该水平板包括在第一绝缘区域和第二绝缘区域之间并邻接第一绝缘区域之间的底部,以及在水平板上并邻接的鳍状物。 水平板的底部接触半导体衬底。 该方法还包括在鳍的顶表面和至少顶部的顶部形成栅电介质; 以及在所述栅极电介质上形成栅电极。
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公开(公告)号:US08058692B2
公开(公告)日:2011-11-15
申请号:US12345332
申请日:2008-12-29
申请人: Li-Shyue Lai , Jing-Cheng Lin
发明人: Li-Shyue Lai , Jing-Cheng Lin
IPC分类号: H01L29/786
CPC分类号: H01L29/785 , H01L29/1054 , H01L29/165 , H01L29/66795
摘要: A method of forming an integrated circuit structure includes forming a first insulation region and a second insulation region in a semiconductor substrate and facing each other; and forming an epitaxial semiconductor region having a reversed T-shape. The epitaxial semiconductor region includes a horizontal plate including a bottom portion between and adjoining the first insulation region and the second insulation region, and a fin over and adjoining the horizontal plate. The bottom of the horizontal plate contacts the semiconductor substrate. The method further includes forming a gate dielectric on a top surface and at least top portions of sidewalls of the fin; and forming a gate electrode over the gate dielectric.
摘要翻译: 形成集成电路结构的方法包括:在半导体衬底中形成第一绝缘区域和第二绝缘区域并彼此面对; 以及形成具有反向T形的外延半导体区域。 外延半导体区域包括水平板,该水平板包括在第一绝缘区域和第二绝缘区域之间并邻接第一绝缘区域之间的底部,以及在水平板上并邻接的鳍状物。 水平板的底部接触半导体衬底。 该方法还包括在鳍的顶表面和至少顶部的顶部形成栅电介质; 以及在所述栅极电介质上形成栅电极。
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公开(公告)号:US20100163842A1
公开(公告)日:2010-07-01
申请号:US12345332
申请日:2008-12-29
申请人: Li-Shyue Lai , Jing-Cheng Lin
发明人: Li-Shyue Lai , Jing-Cheng Lin
CPC分类号: H01L29/785 , H01L29/1054 , H01L29/165 , H01L29/66795
摘要: A method of forming an integrated circuit structure includes forming a first insulation region and a second insulation region in a semiconductor substrate and facing each other; and forming an epitaxial semiconductor region having a reversed T-shape. The epitaxial semiconductor region includes a horizontal plate including a bottom portion between and adjoining the first insulation region and the second insulation region, and a fin over and adjoining the horizontal plate. The bottom of the horizontal plate contacts the semiconductor substrate. The method further includes forming a gate dielectric on a top surface and at least top portions of sidewalls of the fin; and forming a gate electrode over the gate dielectric.
摘要翻译: 形成集成电路结构的方法包括:在半导体衬底中形成第一绝缘区域和第二绝缘区域并彼此面对; 以及形成具有反向T形的外延半导体区域。 外延半导体区域包括水平板,该水平板包括在第一绝缘区域和第二绝缘区域之间并邻接第一绝缘区域之间的底部,以及在水平板上并邻接的鳍状物。 水平板的底部接触半导体衬底。 该方法还包括在鳍的顶表面和至少顶部的顶部形成栅电介质; 以及在所述栅极电介质上形成栅电极。
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公开(公告)号:US08263959B2
公开(公告)日:2012-09-11
申请号:US11746315
申请日:2007-05-09
申请人: Chao-Hsiung Wang , Li-Shyue Lai , Denny Tang , Wen-Chin Lin
发明人: Chao-Hsiung Wang , Li-Shyue Lai , Denny Tang , Wen-Chin Lin
IPC分类号: H01L29/04
CPC分类号: H01L45/06 , H01L45/1233 , H01L45/1273 , H01L45/144 , H01L45/148 , H01L45/1675 , H01L45/1683
摘要: A method of manufacturing a memory device is provided. The method includes forming an electrode over a substrate. The method also includes forming an opening in the electrode to provide a tapered electrode contact surface proximate the opening. The method further includes forming a phase change feature over the electrode and on the tapered electrode contact surface.
摘要翻译: 提供一种制造存储器件的方法。 该方法包括在衬底上形成电极。 该方法还包括在电极中形成开口以提供靠近开口的锥形电极接触表面。 该方法还包括在电极上和锥形电极接触表面上形成相变特征。
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公开(公告)号:US07203129B2
公开(公告)日:2007-04-10
申请号:US10780171
申请日:2004-02-16
申请人: Wen-Chin Lin , Danny D. Tang , Li-Shyue Lai
发明人: Wen-Chin Lin , Danny D. Tang , Li-Shyue Lai
IPC分类号: G11C8/00
CPC分类号: G11C11/16 , G11C2213/72 , G11C2213/74
摘要: In one example, an MRAM memory array includes a plurality of word lines, a plurality of bit lines crossing the word lines, and a plurality of first and second diodes, and magnetic tunnel junction memories. Each first diode includes a cathode, and an anode coupled to each bit line. Each second diode includes an anode, and a cathode coupled to each word line. The magnetic tunnel junction memories include a pinned layer, a free layer, and a non-magnetic layer. The non-magnetic layer is located between the pinned layer and the free layer. Each diode is positioned at crossing points of the bit lines and the word lines and connected between the first diode at the corresponding crossing bit line and the second diode at the corresponding crossing word line.
摘要翻译: 在一个示例中,MRAM存储器阵列包括多个字线,与字线交叉的多个位线,以及多个第一和第二二极管以及磁性隧道结存储器。 每个第一二极管包括阴极和耦合到每个位线的阳极。 每个第二二极管包括阳极和耦合到每个字线的阴极。 磁性隧道结存储器包括钉扎层,自由层和非磁性层。 非磁性层位于被钉扎层和自由层之间。 每个二极管位于位线和字线的交叉点处,并连接在相应交叉位线处的第一二极管和相应交叉字线处的第二二极管之间。
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公开(公告)号:US07170775B2
公开(公告)日:2007-01-30
申请号:US11030453
申请日:2005-01-06
申请人: Wen Chin Lin , Denny D. Tang , Li-Shyue Lai
发明人: Wen Chin Lin , Denny D. Tang , Li-Shyue Lai
IPC分类号: G11C11/00
摘要: A magnetic random access memory (MRAM) cell that includes an MRAM stack and a conductive line for carrying write current associated with the MRAM cell. The conductive line is oriented in a direction that is angularly offset from an easy axis of the MRAM stack by an acute angle, such as about 45 degrees.
摘要翻译: 磁性随机存取存储器(MRAM)单元,其包括用于承载与MRAM单元相关联的写入电流的MRAM堆叠和导线。 导线沿着与MRAM堆叠的容易轴成角度偏移的方向定向为锐角,例如约45度。
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公开(公告)号:US20060146602A1
公开(公告)日:2006-07-06
申请号:US11030453
申请日:2005-01-06
申请人: Wen Lin , Denny Tang , Li-Shyue Lai
发明人: Wen Lin , Denny Tang , Li-Shyue Lai
摘要: A magnetic random access memory (MRAM) cell including an MRAM stack and a conductive line for carrying write current associated with the MRAM cell in a direction that is angularly offset from an easy axis of the MRAM stack by an acute angle, such as about 45 degrees.
摘要翻译: 磁性随机存取存储器(MRAM)单元,其包括MRAM堆叠和用于承载与MRAM单元相关联的写入电流的导线,所述写入电流以与MRAM堆叠的容易轴成角度偏移的方向(例如约45°) 度。
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公开(公告)号:US20050232005A1
公开(公告)日:2005-10-20
申请号:US10827079
申请日:2004-04-19
申请人: Wen Lin , Denny Tang , Li-Shyue Lai
发明人: Wen Lin , Denny Tang , Li-Shyue Lai
CPC分类号: G11C11/16
摘要: An MRAM cell including an MRAM cell stack located over a substrate and first and second write lines spanning at least one side of the MRAM cell stack and defining a projected region of intersection of the MRAM cell stack and the first and second write lines. The MRAM cell stack includes a pinned layer, a tunneling barrier layer, and a free layer, the tunneling barrier layer interposing the pinned layer and the free layer. The first write line extends in a first direction within the projected region of intersection. The second write line extends in a second direction within the projected region of intersection. The first and second directions are angularly offset by an angle ranging between 45 and 90 degrees, exclusively. At least one write line may be perpendicular to the easy axis of free layer, while the other line may be rotated off the easy axis of the free layer by an angle which is larger than zero, such as to compensate for a shifting astroid curve.
摘要翻译: MRAM单元包括位于衬底上的MRAM单元堆叠,以及横跨MRAM单元堆叠的至少一侧的第一和第二写入线,并且定义MRAM单元堆叠与第一和第二写入线之间的投影区域。 MRAM单元堆叠包括钉扎层,隧道势垒层和自由层,隧道势垒层插入被钉扎层和自由层。 第一写入线在投影的交叉区域内沿第一方向延伸。 第二写入线在投影的交叉区域内沿第二方向延伸。 第一和第二方向的角度偏移45度到90度之间的角度。 至少一条写入线可以垂直于自由层的容易轴,而另一条线可以从自由层的容易轴旋转大于零的角度,以补偿移动的星形曲线。
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公开(公告)号:US20130307088A1
公开(公告)日:2013-11-21
申请号:US13475297
申请日:2012-05-18
申请人: Yu-Lin Yang , Tsu-Hsiu Perng , Chih Chieh Yeh , Li-Shyue Lai
发明人: Yu-Lin Yang , Tsu-Hsiu Perng , Chih Chieh Yeh , Li-Shyue Lai
IPC分类号: H01L21/283 , H01L29/78
CPC分类号: H01L27/0886 , H01L29/0649 , H01L29/66545 , H01L29/66795 , H01L29/7845
摘要: A method and device including a substrate having a fin. A metal gate structure is formed on the fin. The metal gate structure includes a stress metal layer formed on the fin such that the stress metal layer extends to a first height from an STI feature, the first height being greater than the fin height. A conduction metal layer is formed on the stress metal layer.
摘要翻译: 一种包括具有翅片的基板的方法和装置。 在翅片上形成金属栅极结构。 金属栅极结构包括形成在翅片上的应力金属层,使得应力金属层从STI特征延伸到第一高度,第一高度大于翅片高度。 在应力金属层上形成导电金属层。
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