公开(公告)号：US20130307088A1

公开(公告)日：2013-11-21

申请号：US13475297

申请日：2012-05-18

申请人： Yu-Lin Yang ,  Tsu-Hsiu Perng ,  Chih Chieh Yeh ,  Li-Shyue Lai

发明人： Yu-Lin Yang ,  Tsu-Hsiu Perng ,  Chih Chieh Yeh ,  Li-Shyue Lai

IPC分类号： H01L21/283 ,  H01L29/78

CPC分类号： H01L27/0886 ,  H01L29/0649 ,  H01L29/66545 ,  H01L29/66795 ,  H01L29/7845

摘要： A method and device including a substrate having a fin. A metal gate structure is formed on the fin. The metal gate structure includes a stress metal layer formed on the fin such that the stress metal layer extends to a first height from an STI feature, the first height being greater than the fin height. A conduction metal layer is formed on the stress metal layer.

摘要翻译： 一种包括具有翅片的基板的方法和装置。 在翅片上形成金属栅极结构。 金属栅极结构包括形成在翅片上的应力金属层，使得应力金属层从STI特征延伸到第一高度，第一高度大于翅片高度。 在应力金属层上形成导电金属层。

公开(公告)号：US08921218B2

公开(公告)日：2014-12-30

申请号：US13475297

申请日：2012-05-18

申请人： Yu-Lin Yang ,  Tsu-Hsiu Perng ,  Chih Chieh Yeh ,  Li-Shyue Lai

发明人： Yu-Lin Yang ,  Tsu-Hsiu Perng ,  Chih Chieh Yeh ,  Li-Shyue Lai

IPC分类号： H01L21/283 ,  H01L29/78

CPC分类号： H01L27/0886 ,  H01L29/0649 ,  H01L29/66545 ,  H01L29/66795 ,  H01L29/7845

摘要： A method and device including a substrate having a fin. A metal gate structure is formed on the fin. The metal gate structure includes a stress metal layer formed on the fin such that the stress metal layer extends to a first height from an STI feature, the first height being greater than the fin height. A conduction metal layer is formed on the stress metal layer.

摘要翻译： 一种包括具有翅片的基板的方法和装置。 在翅片上形成金属栅极结构。 金属栅极结构包括形成在翅片上的应力金属层，使得应力金属层从STI特征延伸到第一高度，第一高度大于翅片高度。 在应力金属层上形成导电金属层。

公开(公告)号：US07960213B2

公开(公告)日：2011-06-14

申请号：US12693712

申请日：2010-01-26

申请人： Yu-Lin Yang

发明人： Yu-Lin Yang

IPC分类号： H01L21/00 ,  H01L21/44

CPC分类号： H01L23/49575 ,  H01L23/49524 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/37599 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73219 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  Y10S257/923 ,  H01L2924/00 ,  H01L2224/37099

摘要： An electronic package structure and method use a conductive strip to bond die-to-die, die-to-lead, chip carrier-to-lead, or lead-to-lead. A conductive strip may carry greater current than a bonding wire, and thus may replace several bonding wires. The bonding of the conductive strip may be carried out by an SMT process, and thus requires lower cost than wire bonding processes. A conductive strip may be bonded to more than two dice or leads to save more bonding wires. A conductive strip is stronger than a bonding wire, and thus lowers the possibility of being broken.

摘要翻译： 电子封装结构和方法使用导电条来将芯片到管芯，管芯到引线，芯片载体与引线或引线对引线接合。 导电带可以承载比接合线更大的电流，并且因此可以代替多个接合线。 导电带的接合可以通过SMT工艺进行，因此比引线键合工艺要低。 导电条可以结合到多于两个的骰子或导线上以节省更多的接合线。 导电条比接合线更强，从而降低破损的可能性。

公开(公告)号：US20100108669A1

公开(公告)日：2010-05-06

申请号：US12458655

申请日：2009-07-20

申请人： Yu-Lin Yang

发明人： Yu-Lin Yang

IPC分类号： B65D6/00

CPC分类号： B65D11/1873

摘要： An assembly box structure includes two first side boards and two second side boards. Symmetric protruding portions are outwardly extended from two short sides of the first side boards. Symmetric recession portions are inwardly caved at two sides of a longer edge of the second side board. The protruding portion of one side of the first side board is embedded with the recession portion of the second side board through the two first side boards interlaced and assembled to the two second side boards, thereby rapidly assembling the hollow box body. Side bottom boards are extended from the bottoms of the first and second side boards. A plurality of through holes is arranged according to the proper distance spaced at interval. A plurality of expansion cylinders is at the periphery of the bottom of a bottom board, and corresponds to the through holes of each side bottom board.

摘要翻译： 组装盒结构包括两个第一侧板和两个第二侧板。 对称突出部分从第一侧板的两个短边向外延伸。 对称的凹陷部分在第二侧板的较长边缘的两侧向内凹陷。 第一侧板的一侧的突出部分通过两个第一侧板被嵌入第二侧板的凹陷部分，并将其组装到两个第二侧板上，从而快速组装中空箱体。 侧底板从第一和第二侧板的底部延伸。 多个通孔按照间隔隔开的适当距离排列。 多个膨胀圆筒位于底板的底部的周边，并且对应于每个侧板底板的通孔。

公开(公告)号：US20090289058A1

公开(公告)日：2009-11-26

申请号：US12230729

申请日：2008-09-04

申请人： Yu-Lin Yang

发明人： Yu-Lin Yang

IPC分类号： B65D6/00

CPC分类号： B65D11/1873 ,  B65D21/083

摘要： A box assembly includes a plurality of boards connected to each other and each of the boards includes a plurality of first flips on one side thereof and second flips on another side thereof. Each first flip is cooperated with a first slit which opens downward and each second flip is cooperated with a second slit which opens upward. When connecting two boards, the first flips are inserted into the second slits and the second flips are inserted into the first slits. The first and second flips may extend at angle from the boards so as to obtain a polygonal box.

摘要翻译： 盒组件包括彼此连接的多个板，并且每个板在其一侧上包括多个第一翻转，而在其另一侧上包括第二翻转。 每个第一翻转件与向下开口的第一狭缝配合，并且每个第二翻转件与向上打开的第二狭缝配合。 当连接两个板时，第一翻转被插入到第二个狭缝中，并且第二翻转被插入到第一个狭缝中。 第一和第二翻转可以与板的角度延伸以获得多边形盒。

公开(公告)号：US07528495B2

公开(公告)日：2009-05-05

申请号：US11550304

申请日：2006-10-17

申请人： Yu-Lin Yang

发明人： Yu-Lin Yang

IPC分类号： H01L23/522 ,  H01L23/528

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/13008 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/136 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A chip structure including a substrate, at least one chip bonding pad, a passivation layer, at least one compliant bump, and at least one redistribution conductive trace is provided. The substrate has an active surface whereon the chip bonding pad is disposed. The passivation layer is disposed on the active surface and exposes the chip bonding pad. The compliant bump has a top surface and a side surface. At least part of the compliant bump is disposed on the passivation layer. One end of the redistribution conductive trace is electrically connected to the chip bonding pad and the other end thereof covers part of the side surface and at least part of the top surface of the compliant bump. Therefore, the chip bonding pad of the chip structure can be electrically connected to the corresponding electrical contact of the carrier through the compliant bump and the redistribution conductive trace.

摘要翻译： 提供了一种芯片结构，其包括衬底，至少一个芯片焊盘，钝化层，至少一个顺应性凸块和至少一个再分布导电迹线。 衬底具有其上设置有芯片焊盘的有源表面。 钝化层设置在有源表面上并使芯片接合焊盘露出。 柔性凸块具有顶表面和侧表面。 柔性凸块的至少一部分设置在钝化层上。 再分布导电迹线的一端电连接到芯片接合焊盘，另一端覆盖侧表面的一部分和柔性凸块的顶表面的至少一部分。 因此，芯片结构的芯片焊盘可以通过顺应性凸块和再分布导电迹线电连接到载体的相应电接触。

公开(公告)号：US20080197507A1

公开(公告)日：2008-08-21

申请号：US12068773

申请日：2008-02-12

申请人： Yu-Lin Yang

发明人： Yu-Lin Yang

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L23/49575 ,  H01L23/49524 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/37599 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73219 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  Y10S257/923 ,  H01L2924/00 ,  H01L2224/37099

摘要： An electronic package structure and method use a conductive strip to bond die-to-die, die-to-lead, chip carrier-to-lead, or lead-to-lead. A conductive strip may carry greater current than a bonding wire, and thus may replace several bonding wires. The bonding of the conductive strip may be carried out by an SMT process, and thus requires lower cost than wire bonding processes. A conductive strip may be bonded to more than two dice or leads to save more bonding wires. A conductive strip is stronger than a bonding wire, and thus lowers the possibility of being broken.

摘要翻译： 电子封装结构和方法使用导电条来将芯片到管芯，管芯到引线，芯片载体与引线或引线对引线接合。 导电带可以承载比接合线更大的电流，并且因此可以代替多个接合线。 导电带的接合可以通过SMT工艺进行，因此比引线键合工艺要低。 导电条可以结合到多于两个的骰子或导线上以节省更多的接合线。 导电条比接合线更强，从而降低破损的可能性。

公开(公告)号：US08097952B2

公开(公告)日：2012-01-17

申请号：US12693704

申请日：2010-01-26

申请人： Yu-Lin Yang

发明人： Yu-Lin Yang

IPC分类号： H01L23/495 ,  H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49575 ,  H01L23/49524 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/37599 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73219 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  Y10S257/923 ,  H01L2924/00 ,  H01L2224/37099

摘要： An electronic package structure and method use a conductive strip to bond die-to-die, die-to-lead, chip carrier-to-lead, or lead-to-lead. A conductive strip may carry greater current than a bonding wire, and thus may replace several bonding wires. The bonding of the conductive strip may be carried out by an SMT process, and thus requires lower cost than wire bonding processes. A conductive strip may be bonded to more than two dice or leads to save more bonding wires. A conductive strip is stronger than a bonding wire, and thus lowers the possibility of being broken.

摘要翻译： 电子封装结构和方法使用导电条来将芯片到管芯，管芯到引线，芯片载体与引线或引线对引线接合。 导电带可以承载比接合线更大的电流，并且因此可以代替多个接合线。 导电带的接合可以通过SMT工艺进行，因此比引线键合工艺要低。 导电条可以结合到多于两个的骰子或导线上以节省更多的接合线。 导电条比接合线更强，从而降低破损的可能性。

公开(公告)号：US20180306742A1

公开(公告)日：2018-10-25

申请号：US15495136

申请日：2017-04-24

申请人： Yu-Lin Yang ,  Chun-Hao Chang ,  Min-Da Wu ,  Hung-Der Su ,  Da-Hong Qian

发明人： Yu-Lin Yang ,  Chun-Hao Chang ,  Min-Da Wu ,  Hung-Der Su ,  Da-Hong Qian

IPC分类号： G01N27/22 ,  B01L3/00

CPC分类号： G01N27/22 ,  B01L3/502 ,  B01L3/508 ,  B01L2200/12 ,  B01L2300/0627 ,  B01L2300/0645 ,  B01L2300/0663 ,  B01L2300/0887 ,  B01L2300/161 ,  G01N27/226

摘要： The invention provides a bio-detection device, including a carrier, a plurality of spacers, an electronic circuit, and a package layer, wherein an open platform is formed. The carrier includes a test region and a signal transmission wiring, wherein the test region is configured to carry a fluid under test. The spacers are located on the test region and electrically connected to two different voltage levels to form a capacitor for sensing a capacitance of the fluid. The spacers are connected to the signal transmission wiring. The electronic circuit receives and processes a sensing signal corresponding to the capacitance of the fluid. The package layer covers a portion of the carrier but does not cover the test region. The open platform is formed whereby a user can easily put in the fluid. The open platform has a bottom which includes the test region, and an area of the open platform is defined by the spacers and the package layer.

公开(公告)号：US08659128B2

公开(公告)日：2014-02-25

申请号：US13043782

申请日：2011-03-09

申请人： Yu-Lin Yang ,  Lih-Ming Doong

发明人： Yu-Lin Yang ,  Lih-Ming Doong

IPC分类号： H01L23/495

CPC分类号： H01L23/4334 ,  H01L23/49572 ,  H01L2224/16245 ,  H01L2224/73253

摘要： A flip chip package structure includes a chip placed under a lead frame, a bump on the upper surface of the chip that is electrically connected to the lead of the lead frame, and a backside metal on the lower surface of the chip that is exposed outside an encapsulant encapsulating the chip and a portion of the lead frame.

摘要翻译： 倒装芯片封装结构包括放置在引线框架下面的芯片，芯片上表面上的电连接到引线框架的引线的凸起，以及在外部暴露在芯片的下表面上的背面金属 密封剂封装芯片和引线框架的一部分。