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    Electronic fuse with conformal fuse element formed over a freestanding dielectric spacer
    1.
    发明申请
    Electronic fuse with conformal fuse element formed over a freestanding dielectric spacer 失效
    具有保形熔丝元件的电子保险丝，形成在独立电介质垫片上

    公开(公告)号：US20070210890A1

    公开(公告)日：2007-09-13

    申请号：US11372387

    申请日：2006-03-09

    申请人： Louis Hsu ,  Jack Mandelman ,  William Tonti ,  Chih-Chao Yang

    发明人： Louis Hsu ,  Jack Mandelman ,  William Tonti ,  Chih-Chao Yang

    IPC分类号： H01H85/04

    CPC分类号： H01L23/5256 ,  H01L2924/0002 ,  Y10T29/49107 ,  H01L2924/00

    摘要： An electronic fuse for an integrated circuit and a method of fabrication thereof are presented. The electronic fuse has a first terminal portion and a second terminal portion interconnected by a fuse element. The fuse element has a convex upper surface and a lower surface with a radius of curvature at a smallest surface area of curvature less than or equal to 100 nanometers. Fabricating the electronic fuse includes forming an at least partially freestanding dielectric spacer above a supporting structure, and then conformably forming the fuse element of the fuse over at least a portion of the freestanding dielectric spacer, with the fuse element characterized as noted above. The dielectric spacer may remain in place as a thermally insulating layer underneath the fuse element, or may be removed to form a void underneath the fuse element.

    摘要翻译： 本发明提供一种用于集成电路的电子熔断器及其制造方法。 电子熔断器具有由熔丝元件互连的第一端子部分和第二端子部分。 保险丝元件具有凸起的上表面和具有小于或等于100纳米的曲率的最小表面积的曲率半径的下表面。 制造电子熔断器包括在支撑结构之上形成至少部分独立的介电隔离物，然后在独立电介质隔离物的至少一部分上顺应地形成熔丝的熔丝元件，其中熔丝元件的特征如上所述。 电介质间隔物可以保留在熔丝元件下面的绝热层的适当位置，或者可以被去除以在熔丝元件下面形成空隙。

    Storage Elements with Disguised Configurations and Methods of Using the Same
    3.
    发明申请
    Storage Elements with Disguised Configurations and Methods of Using the Same 审中-公开
    具有伪装配置的存储元件及其使用方法

    公开(公告)号：US20080067608A1

    公开(公告)日：2008-03-20

    申请号：US11928663

    申请日：2007-10-30

    申请人： Louis Hsu ,  Jack Mandelman ,  William Tonti ,  Chih-Chao Yang

    发明人： Louis Hsu ,  Jack Mandelman ,  William Tonti ,  Chih-Chao Yang

    IPC分类号： H01L27/06

    CPC分类号： H01L23/585 ,  H01L23/5256 ,  H01L27/101 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

    摘要： In a first aspect, a first apparatus is provided. The first apparatus is an element of an integrated circuit (IC) having (1) a metal-oxide-semiconductor field-effect transistor (MOSFET) having source/drain diffusion regions; (2) an electrical fuse (eFuse) coupled to the MOSFET such that a portion of the eFuse serves as a gate region of the MOSFET; and (3) an implanted region coupled to the source/drain diffusion regions of the MOSFET such that a path between the source/drain diffusion regions functions as a short circuit or an open circuit. In another aspect, a design structure embodied in a machine readable medium for designing manufacturing, or testing a design is provided. Numerous other aspects are provided.

    摘要翻译： 在第一方面中，提供了一种第一装置。 第一装置是具有（1）具有源极/漏极扩散区域的金属氧化物半导体场效应晶体管（MOSFET）的集成电路（IC）的元件; （2）耦合到所述MOSFET的电熔丝（eFuse），使得所述eFuse的一部分用作所述MOSFET的栅极区域; 和（3）耦合到MOSFET的源极/漏极扩散区域的注入区域，使得源极/漏极扩散区域之间的路径用作短路或开路。 在另一方面，提供了体现在用于设计制造的机器可读介质或测试设计中的设计结构。 提供了许多其他方面。

    CMOS compatible shallow-trench efuse structure and method
    4.
    发明申请
    CMOS compatible shallow-trench efuse structure and method 失效
    CMOS兼容浅沟槽结构和方法

    公开(公告)号：US20070120218A1

    公开(公告)日：2007-05-31

    申请号：US11290890

    申请日：2005-11-30

    申请人： Louis Hsu ,  Jack Mandelman ,  William Tonti ,  Chih-Chao Yang

    发明人： Louis Hsu ,  Jack Mandelman ,  William Tonti ,  Chih-Chao Yang

    IPC分类号： H01L29/00

    CPC分类号： H01L23/5256 ,  H01L21/268 ,  H01L21/84 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor structure including at least one e-fuse embedded within a trench that is located in a semiconductor substrate (bulk or semiconductor-on-insulator) is provided. In accordance with the present invention, the e-fuse is in electrical contact with a dopant region that is located within the semiconductor substrate. The present invention also provides a method of fabricating such a semiconductor structure in which the embedded e-fuse is formed substantially at the same time with the trench isolation regions.

    摘要翻译： 提供了包括位于半导体衬底（主体或绝缘体中半导体）的沟槽内的至少一个电子熔丝的半导体结构。 根据本发明，电熔丝与位于半导体衬底内的掺杂区电接触。 本发明还提供一种制造这种半导体结构的方法，其中嵌入式电熔丝基本上与沟槽隔离区域同时形成。

    Design Structures Incorporating Interconnect Structures with Liner Repair Layers
    5.
    发明申请
    Design Structures Incorporating Interconnect Structures with Liner Repair Layers 有权
    将连接结构与衬管修复层结合在一起的设计结构

    公开(公告)号：US20080059924A1

    公开(公告)日：2008-03-06

    申请号：US11875345

    申请日：2007-10-19

    申请人： Louis Hsu ,  Jack Mandelman ,  William Tonti ,  Chih-Chao Yang

    发明人： Louis Hsu ,  Jack Mandelman ,  William Tonti ,  Chih-Chao Yang

    IPC分类号： G06F17/50

    CPC分类号： H01L23/53238 ,  H01L21/76814 ,  H01L21/76844 ,  H01L21/76846 ,  H01L21/76868 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Design structure embodied in a machine readable medium for designing, manufacturing, or testing a design. The design structure includes an interconnect structure with a liner formed on roughened dielectric material in an insulating layer and a conformal liner repair layer bridging that breaches in the liner. The conformal liner repair layer is formed of a conductive material, such as a cobalt-containing material. The conformal liner repair layer may be particularly useful for repairing discontinuities in a conductive liner disposed on roughened dielectric material bordering the trenches and vias of damascene interconnect structures.

    摘要翻译： 用于设计，制造或测试设计的机器可读介质中体现的设计结构。 该设计结构包括互连结构，其具有在绝缘层中的粗糙化介电材料上形成的衬垫和桥接该衬里中的破损的保形衬里修复层。 保形衬里修复层由诸如含钴材料的导电材料形成。 保形衬里修复层可能特别适用于修复布置在与镶嵌互连结构的沟槽和通孔相邻的粗糙化介电材料上的导电衬垫中的不连续性。

    Electrically programmable fuse structures with terminal portions residing at different heights, and methods of fabrication thereof
    6.
    发明申请
    Electrically programmable fuse structures with terminal portions residing at different heights, and methods of fabrication thereof 失效
    具有位于不同高度的端子部分的电可编程熔丝结构及其制造方法

    公开(公告)号：US20070210411A1

    公开(公告)日：2007-09-13

    申请号：US11372334

    申请日：2006-03-09

    申请人： William Hovis ,  Louis Hsu ,  Jack Mandelman ,  William Tonti ,  Chih-Chao Yang

    发明人： William Hovis ,  Louis Hsu ,  Jack Mandelman ,  William Tonti ,  Chih-Chao Yang

    IPC分类号： H01L21/82 ,  H01L29/00

    CPC分类号： H01L23/5256 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Electrically programmable fuse structures for an integrated circuit and methods of fabrication thereof are presented, wherein the electrically programmable fuse has a first terminal portion and a second terminal portion interconnected by a fuse element. The first terminal portion and the second terminal portion reside at different heights relative to a supporting surface of the fuse structure, and the interconnecting fuse element transitions between the different heights of the first terminal portion and the second terminal portion. The first and second terminal portions are oriented parallel to the supporting surface, while the fuse element includes a portion oriented orthogonal to the supporting surface, and includes at least one right angle bend where transitioning from at least one of the first and second terminal portions to the orthogonal oriented portion of the fuse element.

    摘要翻译： 提出了用于集成电路的电可编程熔丝结构及其制造方法，其中电可编程熔丝具有由熔丝元件互连的第一端子部分和第二端子部分。 第一端子部分和第二端子部分相对于熔丝结构的支撑表面驻留在不同的高度处，并且互连熔丝元件在第一端子部分和第二端子部分的不同高度之间转变。 第一端子部分和第二端子部分平行于支撑表面定向，而熔丝元件包括垂直于支撑表面定向的部分，并且包括至少一个直角弯曲部，其从第一和第二端子部分中的至少一个过渡到 保险丝元件的正交取向部分。

    Programmable anti-fuse structures, methods for fabricating programmable anti-fuse structures, and methods of programming anti-fuse structures
    7.
    发明申请
    Programmable anti-fuse structures, methods for fabricating programmable anti-fuse structures, and methods of programming anti-fuse structures 审中-公开
    可编程反熔丝结构，制造可编程反熔丝结构的方法以及编程反熔丝结构的方法

    公开(公告)号：US20070205485A1

    公开(公告)日：2007-09-06

    申请号：US11366879

    申请日：2006-03-02

    申请人： Louis Hsu ,  Jack Mandelman ,  William Tonti ,  Chih-Chao Yang

    发明人： Louis Hsu ,  Jack Mandelman ,  William Tonti ,  Chih-Chao Yang

    IPC分类号： H01L29/00

    CPC分类号： H01L27/1203 ,  H01L21/84 ,  H01L23/5252 ,  H01L27/101 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Programmable anti-fuse structures for semiconductor device constructions, fabrication methods for forming anti-fuse structures during semiconductor device fabrication, and programming methods for anti-fuse structures. The programmable anti-fuse structure comprises first and second terminals and an anti-fuse layer electrically coupled with the first and second terminals. An electrically-conductive diffusion layer is disposed between the first terminal and the anti-fuse layer. The diffusion layer inhibits diffusion of conductive material from the first terminal to the anti-fuse layer when the anti-fuse structure is unprogrammed, but permits diffusion of the conductive material when a programming voltage is applied between the first and second terminals during operation. Advantageously, the first terminal may be composed of metal and the anti-fuse layer may be composed of a semiconductor. The methods of fabricating the anti-fuse structure do not require an additional lithographic mask but instead rely on damascene process steps used to fabricate interconnection structures for neighboring active devices.

    摘要翻译： 用于半导体器件结构的可编程抗熔丝结构，在半导体器件制造期间形成抗熔丝结构的制造方法以及用于抗熔丝结构的编程方法。 可编程反熔丝结构包括第一和第二端子以及与第一和第二端子电耦合的抗熔丝层。 导电扩散层设置在第一端子和反熔丝层之间。 当反熔丝结构未编程时，扩散层抑制导电材料从第一端子到抗熔丝层的扩散，但是当在操作期间在第一和第二端子之间施加编程电压时允许导电材料的扩散。 有利地，第一端子可以由金属构成，并且抗熔丝层可以由半导体构成。 制造抗熔丝结构的方法不需要额外的光刻掩模，而是依赖用于制造相邻有源器件的互连结构的镶嵌工艺步骤。

    A REAL-TIME ADAPTIVE SRAM ARRAY FOR HIGH SEU IMMUNITY
    9.
    发明申请
    A REAL-TIME ADAPTIVE SRAM ARRAY FOR HIGH SEU IMMUNITY 有权
    实时自适应SRAM阵列高SEU免疫

    公开(公告)号：US20070211527A1

    公开(公告)日：2007-09-13

    申请号：US11308215

    申请日：2006-03-13

    申请人： Louis Hsu ,  Jack Mandelman ,  Robert Wong ,  Chih-Chao Yang

    发明人： Louis Hsu ,  Jack Mandelman ,  Robert Wong ,  Chih-Chao Yang

    IPC分类号： G11C16/04

    CPC分类号： G11C11/4125

    摘要： A system and method for automatically adjusting one or more electrical parameters in a memory device, e.g., SRAM arrays. The system and method implements an SRAM sensing sub-array for accelerated collection of fail rate data for use in determining the operating point for optimum tradeoff between single event upset immunity and performance of a primary SRAM array. The accelerated fail rate data is input to an algorithm implemented for setting the SEU sensitivity of a primary SRAM memory array to a predetermined fail rate in an ionizing particle environment. The predetermined fail rate is maintained on a real-time basis in order to provide immunity to SEU consistent with optimum performance.

    摘要翻译： 一种用于自动调整存储器件（例如SRAM阵列）中的一个或多个电参数的系统和方法。 该系统和方法实现SRAM感测子阵列，用于加速收集故障率数据，用于确定单个事件不起作息和主SRAM阵列性能之间的最佳权衡的操作点。 将加速失败率数据输入到在电离粒子环境中将初级SRAM存储器阵列的SEU灵敏度设定为预定故障率的算法。 为了提供符合最佳性能的SEU的免疫力，实时地维持预定的故障率。

    DIELECTRIC MATERIAL WITH A REDUCED DIELECTRIC CONSTANT AND METHODS OF MANUFACTURING THE SAME
    10.
    发明申请
    DIELECTRIC MATERIAL WITH A REDUCED DIELECTRIC CONSTANT AND METHODS OF MANUFACTURING THE SAME 失效
    具有降低介电常数的介电材料及其制造方法

    公开(公告)号：US20080054487A1

    公开(公告)日：2008-03-06

    申请号：US11928913

    申请日：2007-10-30

    申请人： Louis Hsu ,  Jack Mandelman ,  Chih-Chao Yang

    发明人： Louis Hsu ,  Jack Mandelman ,  Chih-Chao Yang

    IPC分类号： H01L23/48

    CPC分类号： H01L21/31695 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02238 ,  H01L21/02252 ,  H01L21/31633 ,  H01L21/7682 ,  H01L21/76831

    摘要： In a first aspect, a first method of manufacturing a dielectric material with a reduced dielectric constant is provided. The first method includes the steps of (1) forming a dielectric material layer including a trench on a substrate; and (2) forming a cladding region in the dielectric material layer by forming a plurality of air gaps in the dielectric material layer along at least one of a sidewall and a bottom of the trench so as to reduce an effective dielectric constant of the dielectric material. Numerous other aspects are provided.

    摘要翻译： 在第一方面，提供了制造介电常数降低的介电材料的第一种方法。 第一种方法包括以下步骤：（1）在衬底上形成包括沟槽的电介质材料层; 以及（2）通过沿着沟槽的侧壁和底部中的至少一个形成电介质材料层中的多个气隙，从而在电介质材料层中形成包层区域，从而降低电介质材料的有效介电常数 。 提供了许多其他方面。