Abstract:
A data storage device that includes an array of resistive memory cells. The resistive memory cells may include a magnetic tunnel junction (MTJ) and a thin-film diode. The device may include a circuit that is electrically connected to the array and that is also capable of monitoring a signal current flowing through a selected memory cell. Once the signal current has been monitored, the circuit is capable of comparing the signal current to an average reference current in order to determine which of a first resistance state and a second resistance state the selected memory cell is in. Also, a method for operating the data storage device.
Abstract:
A data storage device that includes an array of resistive memory cells. The resistive memory cells may include a magnetic tunnel junction (MTJ) and a thin-film diode. The device may include a circuit that is electrically connected to the array and that is also capable of monitoring a signal current flowing through a selected memory cell. Once the signal current has been monitored, the circuit is capable of comparing the signal current to an average reference current in order to determine which of a first resistance state and a second resistance state the selected memory cell is in. Also, a method for operating the data storage device.
Abstract:
A Magnetic Random Access Memory (“MRAM”) device includes an array of memory cells. The device generates reference signals that can be used to determine the resistance states of each memory cell in the array, despite variations in resistance due to manufacturing tolerances and other factors such as temperature gradients across the array, electromagnetic interference and aging.
Abstract:
An operational amplifier includes transistors for providing a controlled current path. At least one of the transistors is in an isolated well in a substrate. Offset of the operational amplifier is corrected by applying a back gate bias voltage to at least one isolated well and changing impedance of the transistors. The proper back gate bias voltage and transistor impedance are determined by incrementally adjusting the back gate bias voltage and then incrementally adjusting the transistor impedance. Calibration values are stored in register memory. Such calibration may be performed by an auto offset calibration process.
Abstract:
Resistance of a selected memory cell in a Magnetic Random Access Memory (“MRAM”) device is sensed by a read circuit including a direct injection charge amplifier, an integrator capacitor and a digital sense amplifier. The direct injection charge amplifier supplies current to the integrator capacitor while maintaining an equipotential voltage on non-selected memory cells in the MRAM device. As the direct injection charge amplifier applies a fixed voltage to the selected memory cell, the sense amplifier measures integration time of a signal on the integrator. The signal integration time indicates whether the memory cell MRAM resistance is at a first state (R) or a second state (R+&Dgr;R).
Abstract:
A Magnetic Random Access Memory (“MRAM”) device includes an array of memory cells. The device generates reference signals that can be used to determine the resistance states of each memory cell in the array, despite variations in resistance due to manufacturing tolerances and other factors such as temperature gradients across the array, electromagnetic interference and aging.
Abstract:
A method for making magnetic random access memories (MRAM) isolates each and every memory cell in an MRAM array during operation until selected. Some embodiments use series connected diodes for such electrical isolation. Only a selected one of the memory cells will then conduct current between respective ones of the bit and word lines. A better, more uniform distribution of read and data-write data access currents results to all the memory cells. In another embodiment, this improvement is used to increase the number of rows and columns to support a larger data array. In a further embodiment, such improvement is used to increase operating margins and reduce necessary data-write voltages and currents.
Abstract:
A method and system for storing and retrieving data using flash memory devices. One example system includes an apparatus within a flash memory configuration. The flash memory configuration includes a plurality of memory cells, where each memory cell has a charge storage capacity for use in implementing digital storage. The apparatus includes a processing arrangement configured to access each of the memory cells in a write operation and a read operation. The apparatus also includes an instruction set for instructing the processor to impose target charge levels for defining a plurality of data values for each of the memory cells. The target charge levels are programmably movable with respect to the charge storage capacity.
Abstract:
A method and system for storing and retrieving data using flash memory devices. One example system includes an apparatus within a flash memory configuration. The flash memory configuration includes a plurality of memory cells, where each memory cell has a charge storage capacity for use in implementing digital storage. The apparatus includes a processing arrangement configured to access each of the memory cells in a write operation and a read operation. The apparatus also includes an instruction set for instructing the processor to impose target charge levels for defining a plurality of data values for each of the memory cells. The target charge levels are programmably movable with respect to the charge storage capacity.
Abstract:
A storage device includes a probe and a storage medium having a plurality of storage cells. The probe is able to form a first structure and a second structure in the storage medium, where a first storage cell containing a transition between the first structure and a second structure contains a data bit having a first state, and where a second storage cell not including a transition between the first structure and the second structure contains a data bit having a second state.