Abstract:
A data storage device that includes an array of resistive memory cells. The resistive memory cells may include a magnetic tunnel junction (MTJ) and a thin-film diode. The device may include a circuit that is electrically connected to the array and that is also capable of monitoring a signal current flowing through a selected memory cell. Once the signal current has been monitored, the circuit is capable of comparing the signal current to an average reference current in order to determine which of a first resistance state and a second resistance state the selected memory cell is in. Also, a method for operating the data storage device.
Abstract:
A data storage device that includes an array of resistive memory cells. The resistive memory cells may include a magnetic tunnel junction (MTJ) and a thin-film diode. The device may include a circuit that is electrically connected to the array and that is also capable of monitoring a signal current flowing through a selected memory cell. Once the signal current has been monitored, the circuit is capable of comparing the signal current to an average reference current in order to determine which of a first resistance state and a second resistance state the selected memory cell is in. Also, a method for operating the data storage device.
Abstract:
A spin dependent tunneling (“SDT”) junction of a memory cell for a Magnetic Random Access Memory (“MRAM”) device includes a pinned ferromagnetic layer, followed by an insulating tunnel barrier and a sense ferromagnetic layer. During fabrication of the MRAM device, after formation of the pinned layer but before formation of the insulating tunnel barrier, an exposed surface of the pinned layer is flattened. The exposed surface of the pinned layer may be flattened by an ion etching process.
Abstract:
A memory cell includes a conductor clad with ferromagnetic material; first and second spacer layers on opposite sides of the clad conductor; a first data layer on the first spacer layer; and a second data layer on the second spacer layer.
Abstract:
A method and system for minimizing a leaked current within an array of memory cells as well as a method and system for differentiating a resistive value within a sensed memory cell during a read operation are disclosed. The memory array includes a plurality of bit lines and word lines that are cross-coupled via a plurality of memory cells. Each memory cell is limited in providing a conductive path in a first direction only by way of a unidirectional element. Such unidirectional elements typically comprise of diodes. The apparatus utilizes the diodes to form a current path from the bit line to the word line having passed through the diode and resistive memory cell. Further, a differential sense amplifier is utilized to differentiate the sensed current during a read operation from a reference value after an equipotential value is placed across the array to limit leakage current from developing within adjoining word and bit lines during a sense operation of a given memory cell.
Abstract:
A random access memory (memory) includes one or more planes of memory arrays stacked on top of each other. Each plane may be manufactured separately, and each array within the plane may be enabled/disabled separately. In this manner, each memory array within the plane can be individually tested, and defective memory arrays may be sorted out, which increases the final yield and quality. A memory plane may be stacked on top of each other and on top of an active circuit plane to make a large capacity memory device. The memory may be volatile or non-volatile by using appropriate memory cells as base units. Also, the memory plane may be fabricated separately from the active circuitry. Thus the memory plane does not require a silicon substrate, and may be formed from a glass substrate for example. Further, each memory plane may be individually selected (or enabled) via plane memory select transistors. The array may be individually selected (or enable) via array select transistor. These transistors may be formed from amorphous silicon transistor(s) and/or thin-film transistor(s). The data bus, array select bus, and the plane select bus provide electrical connections between the memory planes and the active circuit plane via side contact pads on each plane. 3-D memory for large storage capacity. The memory may be formed from one or more planes with each plane including one or more memory arrays. Each memory array of each plane may be separately enabled or disabled. The memory array may be formed on silicon or non-silicon based substrate. An active circuit plane may be shared among the memory arrays and planes to perform read and write functions.
Abstract:
A memory device includes memory cells having a re-writeable element and a write-once element in series with the re-writeable element. The re-writeable element is programmable between a high resistance state and a low resistance state. The write-once element can be an anti-fuse element that is programmable from a high resistance state to a low resistance state, or a fuse element that is programmable from a low resistance state to a high resistance state. The two possible states for the re-writeable element and the two possible states for the write-once element allow the memory cells to store four different bits.
Abstract:
A magnetic field bias is applied to memory cells of an MRAM device during a write operation. The magnetic field bias, which may be applied by a permanent magnet or an electromagnet, can improve reproducibility of memory cell switching.
Abstract:
A method for making magnetic random access memories (MRAM) isolates each and every memory cell in an MRAM array during operation until selected. Some embodiments use series connected diodes for such electrical isolation. Only a selected one of the memory cells will then conduct current between respective ones of the bit and word lines. A better, more uniform distribution of read and data-write data access currents results to all the memory cells. In another embodiment, this improvement is used to increase the number of rows and columns to support a larger data array. In a further embodiment, such improvement is used to increase operating margins and reduce necessary data-write voltages and currents.