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    Sensing device and manufacturing method thereof
    2.
    发明授权
    Sensing device and manufacturing method thereof 有权
    检测装置及其制造方法

    公开(公告)号：US08763457B2

    公开(公告)日：2014-07-01

    申请号：US13154426

    申请日：2011-06-06

    申请人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Tzong-Che Ho ,  Li-Chi Pan

    发明人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Tzong-Che Ho ,  Li-Chi Pan

    IPC分类号： G01D11/24

    CPC分类号： B81C1/00293 ,  B81C2203/0118 ,  G01D11/245 ,  G01L19/0092 ,  G01L19/147 ,  G01P1/023 ,  H01L23/315 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A sensing device can be provided with sealed and open-type chambers in various conditions for accommodating different types of sensing structural components by stacking multiple substrates, wherein the condition of a sealed chamber depends on condition taken in substrate bonding process. Owing to sealing a channel of the sealed chamber by the substrate, superior sealing performance is achieved as compared to those adopting solder or sealing material, and thus the condition of the sealed chamber can be finely controlled.

    摘要翻译： 感测装置可以设置有各种条件的密封和开放式室，用于通过堆叠多个基板来容纳不同类型的感测结构部件，其中密封室的状态取决于在基板接合过程中采取的条件。 由于通过基板密封密封室的通道，与使用焊料或密封材料的密封室相比，实现了优异的密封性能，因此可以精细地控制密封室的状态。

    Structure and fabrication method of a sensing device
    3.
    发明授权
    Structure and fabrication method of a sensing device 有权
    感测装置的结构和制造方法

    公开(公告)号：US09133018B2

    公开(公告)日：2015-09-15

    申请号：US12572277

    申请日：2009-10-02

    申请人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Sheah Chen ,  Jing-Yuan Lin ,  Li-Chi Pan ,  Tzong-Che Ho

    发明人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Sheah Chen ,  Jing-Yuan Lin ,  Li-Chi Pan ,  Tzong-Che Ho

    IPC分类号： B81B7/00

    CPC分类号： B81B7/007 ,  B81B2201/0292 ,  B81B2207/093 ,  H01L2224/16225

    摘要： A sensing device comprises a substrate having an upper surface, a sensor member, at least an external conductive wire, and a standing-ring member. The sensor member, the external conductive wire and the stand-ring member are on the upper surface. The sensor member is located at the central area on the upper surface, and the standing-ring member surrounds the sensor member. The standing-ring member and the sensor member are electrically connected through the at least an external conductive wire.

    摘要翻译： 感测装置包括具有上表面的基底，传感器构件，至少外部导电线和驻环构件。 传感器构件，外部导电线和支架构件在上表面上。 传感器构件位于上表面的中央区域，并且立环构件围绕传感器构件。 站立环构件和传感器构件通过至少一个外部导线电连接。

    SENSING DEVICE AND MANUFACTURING METHOD THEREOF
    4.
    发明申请
    SENSING DEVICE AND MANUFACTURING METHOD THEREOF 有权
    感应装置及其制造方法

    公开(公告)号：US20120260747A1

    公开(公告)日：2012-10-18

    申请号：US13154426

    申请日：2011-06-06

    申请人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Tzong-Che Ho ,  Li-Chi Pan

    发明人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Tzong-Che Ho ,  Li-Chi Pan

    IPC分类号： G01N1/00

    CPC分类号： B81C1/00293 ,  B81C2203/0118 ,  G01D11/245 ,  G01L19/0092 ,  G01L19/147 ,  G01P1/023 ,  H01L23/315 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A sensing device can be provided with sealed and open-type chambers in various conditions for accommodating different types of sensing structural components by stacking multiple substrates, wherein the condition of a sealed chamber depends on condition taken in substrate bonding process. Owing to sealing a channel of the sealed chamber by the substrate, superior sealing performance is achieved as compared to those adopting solder or sealing material, and thus the condition of the sealed chamber can be finely controlled.

    摘要翻译： 感测装置可以设置有各种条件的密封和开放式室，用于通过堆叠多个基板来容纳不同类型的感测结构部件，其中密封室的状态取决于在基板接合过程中采取的条件。 由于通过基板密封密封室的通道，与使用焊料或密封材料的密封室相比，实现了优异的密封性能，因此可以精细地控制密封室的状态。

    Vacuum hermetic organic packaging carrier
    5.
    发明授权
    Vacuum hermetic organic packaging carrier 有权
    真空密封有机包装载体

    公开(公告)号：US08421216B2

    公开(公告)日：2013-04-16

    申请号：US13111960

    申请日：2011-05-20

    申请人： Lung-Tai Chen ,  Tzong-Che Ho ,  Li-Chi Pan ,  Yu-Wen Fan

    发明人： Lung-Tai Chen ,  Tzong-Che Ho ,  Li-Chi Pan ,  Yu-Wen Fan

    IPC分类号： H01L23/12

    CPC分类号： H01L41/0533 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2924/16152 ,  H01L2924/00014

    摘要： A vacuum hermetic organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and an inorganic hermetic insulation film. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and exposes a portion of the first surface. The inorganic hermetic insulation film at least covers the exposed first surface to achieve an effect of completely hermetically sealing the organic packaging carrier.

    摘要翻译： 提供真空密封有机包装载体。 有机包装载体包括有机基板，导电电路层和无机密封绝缘膜。 有机基板具有第一表面。 导电电路层位于第一表面上并暴露第一表面的一部分。 无机密封绝缘膜至少覆盖暴露的第一表面，以实现完全气密密封有机包装载体的效果。

    CAPACITIVE TRANSDUCER AND FABRICATION METHOD
    7.
    发明申请
    CAPACITIVE TRANSDUCER AND FABRICATION METHOD 有权
    电容式传感器和制造方法

    公开(公告)号：US20110150261A1

    公开(公告)日：2011-06-23

    申请号：US12643417

    申请日：2009-12-21

    申请人： Tzong-Che HO ,  Lung-Tai Chen ,  Yao-Jung Lee ,  Chao-Ta Huang ,  Li-Chi Pan ,  Yu-Sheng Hsieh

    发明人： Tzong-Che HO ,  Lung-Tai Chen ,  Yao-Jung Lee ,  Chao-Ta Huang ,  Li-Chi Pan ,  Yu-Sheng Hsieh

    IPC分类号： H04R9/08 ,  H01G7/00

    CPC分类号： H01G5/011 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00

    摘要： A capacitive transducer and fabrication method are disclosed. The capacitive transducer includes a substrate, a first electrode mounted on the substrate, a cap having a through-hole and a cavity beside the through-hole, a second electrode mounted on the cap across the through-hole. The second electrode is deformable in response to pressure fluctuations applied thereto via the through-hole and defines, together with the first electrode, as a capacitor. The capacitor includes a capacitance variable with the pressure fluctuations and the cavity defines a back chamber for the deformable second electrode.

    摘要翻译： 公开了一种电容式换能器和制造方法。 所述电容式换能器包括基板，安装在所述基板上的第一电极，具有通孔和所述通孔旁边的空腔的盖，穿过所述通孔安装在所述盖上的第二电极。 第二电极响应于通过通孔施加到其上的压力波动而变形，并与第一电极一起限定为电容器。 电容器包括具有压力波动的电容变量，并且空腔限定用于可变形的第二电极的后室。

    Capacitive transducer and fabrication method
    8.
    发明授权
    Capacitive transducer and fabrication method 有权
    电容式传感器及其制造方法

    公开(公告)号：US08693711B2

    公开(公告)日：2014-04-08

    申请号：US12643417

    申请日：2009-12-21

    申请人： Tzong-Che Ho ,  Lung-Tai Chen ,  Yao-Jung Lee ,  Chao-Ta Huang ,  Li-Chi Pan ,  Yu-Sheng Hsieh

    发明人： Tzong-Che Ho ,  Lung-Tai Chen ,  Yao-Jung Lee ,  Chao-Ta Huang ,  Li-Chi Pan ,  Yu-Sheng Hsieh

    IPC分类号： H04R25/00

    CPC分类号： H01G5/011 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00

    摘要： A capacitive transducer and fabrication method are disclosed. The capacitive transducer includes a substrate, a first electrode mounted on the substrate, a cap having a through-hole and a cavity beside the through-hole, a second electrode mounted on the cap across the through-hole. The second electrode is deformable in response to pressure fluctuations applied thereto via the through-hole and defines, together with the first electrode, as a capacitor. The capacitor includes a capacitance variable with the pressure fluctuations and the cavity defines a back chamber for the deformable second electrode.

    摘要翻译： 公开了一种电容式换能器和制造方法。 所述电容式换能器包括基板，安装在所述基板上的第一电极，具有通孔和所述通孔旁边的空腔的盖，穿过所述通孔安装在所述盖上的第二电极。 第二电极响应于通过通孔施加到其上的压力波动而变形，并与第一电极一起限定为电容器。 电容器包括具有压力波动的电容变量，并且空腔限定用于可变形的第二电极的后室。

    VACUUM HERMETIC ORGANIC PACKAGING CARRIER
    9.
    发明申请
    VACUUM HERMETIC ORGANIC PACKAGING CARRIER 有权
    真空有机包装机

    公开(公告)号：US20110297434A1

    公开(公告)日：2011-12-08

    申请号：US13111960

    申请日：2011-05-20

    申请人： Lung-Tai Chen ,  Tzong-Che Ho ,  Li-Chi Pan ,  Yu-Wen Fan

    发明人： Lung-Tai Chen ,  Tzong-Che Ho ,  Li-Chi Pan ,  Yu-Wen Fan

    IPC分类号： H05K1/02

    CPC分类号： H01L41/0533 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2924/16152 ,  H01L2924/00014

    摘要： A vacuum hermetic organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and an inorganic hermetic insulation film. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and exposes a portion of the first surface. The inorganic hermetic insulation film at least covers the exposed first surface to achieve an effect of completely hermetically sealing the organic packaging carrier.

    摘要翻译： 提供真空密封有机包装载体。 有机包装载体包括有机基板，导电电路层和无机密封绝缘膜。 有机基板具有第一表面。 导电电路层位于第一表面上并暴露第一表面的一部分。 无机密封绝缘膜至少覆盖暴露的第一表面，以实现完全气密密封有机包装载体的效果。

    Vacuum hermetic organic packaging carrier and sensor device package
    10.
    发明授权
    Vacuum hermetic organic packaging carrier and sensor device package 有权
    真空密封有机包装载体和传感器装置包装

    公开(公告)号：US07973454B1

    公开(公告)日：2011-07-05

    申请号：US12850643

    申请日：2010-08-05

    申请人： Lung-Tai Chen ,  Tzong-Che Ho ,  Li-Chi Pan ,  Yu-Wen Fan

    发明人： Lung-Tai Chen ,  Tzong-Che Ho ,  Li-Chi Pan ,  Yu-Wen Fan

    IPC分类号： H01L41/053

    CPC分类号： H01L41/0533 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2924/16152 ,  H01L2924/00014

    摘要： A vacuum hermetic organic packaging carrier and a sensor device package are provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and an inorganic hermetic insulation film. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and exposes a portion of the first surface. The inorganic hermetic insulation film at least covers the exposed first surface to achieve an effect of completely hermetically sealing the organic packaging carrier.

    摘要翻译： 提供真空密封有机包装载体和传感器装置包装。 有机包装载体包括有机基板，导电电路层和无机密封绝缘膜。 有机基板具有第一表面。 导电电路层位于第一表面上并暴露第一表面的一部分。 无机密封绝缘膜至少覆盖暴露的第一表面，以实现完全气密密封有机包装载体的效果。