公开(公告)号：US20110018075A1

公开(公告)日：2011-01-27

申请号：US12572277

申请日：2009-10-02

申请人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Sheah Chen ,  Jing-Yuan Lin ,  Li-Chi Pan ,  Tzong-Che Ho

发明人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Sheah Chen ,  Jing-Yuan Lin ,  Li-Chi Pan ,  Tzong-Che Ho

IPC分类号： H01L29/84 ,  H01L23/02

CPC分类号： B81B7/007 ,  B81B2201/0292 ,  B81B2207/093 ,  H01L2224/16225

摘要： A sensing device comprises a substrate having an upper surface, a sensor member, at least an external conductive wire, and a standing-ring member. The sensor member, the external conductive wire and the stand-ring member are on the upper surface. The sensor member is located at the central area on the upper surface, and the standing-ring member surrounds the sensor member. The standing-ring member and the sensor member are electrically connected through the at least an external conductive wire.

摘要翻译： 感测装置包括具有上表面的基底，传感器构件，至少外部导电线和驻环构件。 传感器构件，外部导电线和支架构件在上表面上。 传感器构件位于上表面的中央区域，并且立环构件围绕传感器构件。 站立环构件和传感器构件通过至少一个外部导线电连接。

公开(公告)号：US09133018B2

公开(公告)日：2015-09-15

申请号：US12572277

申请日：2009-10-02

申请人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Sheah Chen ,  Jing-Yuan Lin ,  Li-Chi Pan ,  Tzong-Che Ho

发明人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Sheah Chen ,  Jing-Yuan Lin ,  Li-Chi Pan ,  Tzong-Che Ho

IPC分类号： B81B7/00

CPC分类号： B81B7/007 ,  B81B2201/0292 ,  B81B2207/093 ,  H01L2224/16225

摘要： A sensing device comprises a substrate having an upper surface, a sensor member, at least an external conductive wire, and a standing-ring member. The sensor member, the external conductive wire and the stand-ring member are on the upper surface. The sensor member is located at the central area on the upper surface, and the standing-ring member surrounds the sensor member. The standing-ring member and the sensor member are electrically connected through the at least an external conductive wire.

摘要翻译： 感测装置包括具有上表面的基底，传感器构件，至少外部导电线和驻环构件。 传感器构件，外部导电线和支架构件在上表面上。 传感器构件位于上表面的中央区域，并且立环构件围绕传感器构件。 站立环构件和传感器构件通过至少一个外部导线电连接。

公开(公告)号：US20120260747A1

公开(公告)日：2012-10-18

申请号：US13154426

申请日：2011-06-06

申请人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Tzong-Che Ho ,  Li-Chi Pan

发明人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Tzong-Che Ho ,  Li-Chi Pan

IPC分类号： G01N1/00

CPC分类号： B81C1/00293 ,  B81C2203/0118 ,  G01D11/245 ,  G01L19/0092 ,  G01L19/147 ,  G01P1/023 ,  H01L23/315 ,  H01L2924/0002 ,  H01L2924/00

摘要： A sensing device can be provided with sealed and open-type chambers in various conditions for accommodating different types of sensing structural components by stacking multiple substrates, wherein the condition of a sealed chamber depends on condition taken in substrate bonding process. Owing to sealing a channel of the sealed chamber by the substrate, superior sealing performance is achieved as compared to those adopting solder or sealing material, and thus the condition of the sealed chamber can be finely controlled.

摘要翻译： 感测装置可以设置有各种条件的密封和开放式室，用于通过堆叠多个基板来容纳不同类型的感测结构部件，其中密封室的状态取决于在基板接合过程中采取的条件。 由于通过基板密封密封室的通道，与使用焊料或密封材料的密封室相比，实现了优异的密封性能，因此可以精细地控制密封室的状态。

公开(公告)号：US08763457B2

公开(公告)日：2014-07-01

申请号：US13154426

申请日：2011-06-06

申请人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Tzong-Che Ho ,  Li-Chi Pan

发明人： Lung-Tai Chen ,  Yu-Wen Hsu ,  Tzong-Che Ho ,  Li-Chi Pan

IPC分类号： G01D11/24

CPC分类号： B81C1/00293 ,  B81C2203/0118 ,  G01D11/245 ,  G01L19/0092 ,  G01L19/147 ,  G01P1/023 ,  H01L23/315 ,  H01L2924/0002 ,  H01L2924/00

摘要： A sensing device can be provided with sealed and open-type chambers in various conditions for accommodating different types of sensing structural components by stacking multiple substrates, wherein the condition of a sealed chamber depends on condition taken in substrate bonding process. Owing to sealing a channel of the sealed chamber by the substrate, superior sealing performance is achieved as compared to those adopting solder or sealing material, and thus the condition of the sealed chamber can be finely controlled.

摘要翻译： 感测装置可以设置有各种条件的密封和开放式室，用于通过堆叠多个基板来容纳不同类型的感测结构部件，其中密封室的状态取决于在基板接合过程中采取的条件。 由于通过基板密封密封室的通道，与使用焊料或密封材料的密封室相比，实现了优异的密封性能，因此可以精细地控制密封室的状态。

公开(公告)号：US20120154068A1

公开(公告)日：2012-06-21

申请号：US13115112

申请日：2011-05-25

申请人： Yu-Wen Hsu ,  Lung-Tai Chen ,  Tzung-Ching Lee ,  Chao-Ta Huang

发明人： Yu-Wen Hsu ,  Lung-Tai Chen ,  Tzung-Ching Lee ,  Chao-Ta Huang

IPC分类号： H03B5/32 ,  H01L21/822

CPC分类号： H03H9/0547 ,  H03H3/02

摘要： A crystal oscillator includes a cover, a crystal blank and an Integrated Circuit (IC) chip. The cover has a surface, a cavity formed in the surface, a plurality of conductive contacts and a conductive sealing ring. The conductive contacts are disposed on the surface, and the conductive sealing ring is disposed on the surface and surrounds the conductive contacts. The IC chip is connected to the conductive contacts and the conductive sealing ring, and forms a hermetic chamber with the cover and the conductive sealing ring. The crystal blank is located in the hermetic chamber, and is electrically connected to the IC chip. Furthermore, a method for manufacturing a crystal oscillator is also provided.

摘要翻译： 晶体振荡器包括盖，晶体空白和集成电路（IC）芯片。 盖具有表面，形成在表面中的空腔，多个导电触点和导电密封环。 导电触点设置在表面上，并且导电密封环设置在表面上并且围绕导电触点。 IC芯片连接到导电触点和导电密封环，并与盖和导电密封环形成密封室。 晶体坯料位于密封室中，并与IC芯片电连接。 此外，还提供了一种用于制造晶体振荡器的方法。

公开(公告)号：US20130099331A1

公开(公告)日：2013-04-25

申请号：US13327681

申请日：2011-12-15

申请人： Lung-Tai Chen ,  Shih-Chieh Lin ,  Yu-Wen Hsu

发明人： Lung-Tai Chen ,  Shih-Chieh Lin ,  Yu-Wen Hsu

IPC分类号： H01L29/66 ,  H01L21/02

CPC分类号： B81B7/007 ,  B81B2207/097 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure and a process for a microelectromechanical system (MEMS)-based sensor are provided. The structure for a MEMS-based sensor includes a substrate chip. A first insulating layer covers a top surface of the substrate chip. A device layer is disposed on a top surface of the first insulating layer. The device layer includes a periphery region and a sensor component region. The periphery region and a sensor component region have an air trench therebetween. The component region includes an anchor component and a moveable component. A second insulating layer is disposed on a top surface of the device layer, bridging the periphery region and a portion of the anchor component. A conductive pattern is disposed on the second insulating layer, electrically connecting to the anchor component.

摘要翻译： 提供了一种用于基于微机电系统（MEMS）的传感器的结构和工艺。 基于MEMS的传感器的结构包括衬底芯片。 第一绝缘层覆盖衬底芯片的顶表面。 器件层设置在第一绝缘层的顶表面上。 器件层包括外围区域和传感器部件区域。 周边区域和传感器部件区域之间具有空气沟槽。 组件区域包括锚构件和可移动构件。 第二绝缘层设置在器件层的顶表面上，桥接外围区域和锚固部件的一部分。 导电图案设置在第二绝缘层上，与导电组件电连接。

公开(公告)号：US08643125B2

公开(公告)日：2014-02-04

申请号：US13327681

申请日：2011-12-15

申请人： Lung-Tai Chen ,  Shih-Chieh Lin ,  Yu-Wen Hsu

发明人： Lung-Tai Chen ,  Shih-Chieh Lin ,  Yu-Wen Hsu

IPC分类号： H01L29/78

CPC分类号： B81B7/007 ,  B81B2207/097 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure and a process for a microelectromechanical system (MEMS)-based sensor are provided. The structure for a MEMS-based sensor includes a substrate chip. A first insulating layer covers a top surface of the substrate chip. A device layer is disposed on a top surface of the first insulating layer. The device layer includes a periphery region and a sensor component region. The periphery region and a sensor component region have an air trench therebetween. The component region includes an anchor component and a moveable component. A second insulating layer is disposed on a top surface of the device layer, bridging the periphery region and a portion of the anchor component. A conductive pattern is disposed on the second insulating layer, electrically connecting to the anchor component.

摘要翻译： 提供了一种用于基于微机电系统（MEMS）的传感器的结构和工艺。 基于MEMS的传感器的结构包括衬底芯片。 第一绝缘层覆盖衬底芯片的顶表面。 器件层设置在第一绝缘层的顶表面上。 器件层包括外围区域和传感器部件区域。 周边区域和传感器部件区域之间具有空气沟槽。 组件区域包括锚构件和可移动构件。 第二绝缘层设置在器件层的顶表面上，桥接外围区域和锚固部件的一部分。 导电图案设置在第二绝缘层上，与导电组件电连接。

公开(公告)号：US08421543B2

公开(公告)日：2013-04-16

申请号：US13115112

申请日：2011-05-25

申请人： Yu-Wen Hsu ,  Lung-Tai Chen ,  Tzung-Ching Lee ,  Chao-Ta Huang

发明人： Yu-Wen Hsu ,  Lung-Tai Chen ,  Tzung-Ching Lee ,  Chao-Ta Huang

IPC分类号： H03B1/00 ,  H03B5/32 ,  H01L41/053

CPC分类号： H03H9/0547 ,  H03H3/02

摘要： A crystal oscillator includes a cover, a crystal blank and an Integrated Circuit (IC) chip. The cover has a surface, a cavity formed in the surface, a plurality of conductive contacts and a conductive sealing ring. The conductive contacts are disposed on the surface, and the conductive sealing ring is disposed on the surface and surrounds the conductive contacts. The IC chip is connected to the conductive contacts and the conductive sealing ring, and forms a hermetic chamber with the cover and the conductive sealing ring. The crystal blank is located in the hermetic chamber, and is electrically connected to the IC chip. Furthermore, a method for manufacturing a crystal oscillator is also provided.

摘要翻译： 晶体振荡器包括盖，晶体空白和集成电路（IC）芯片。 盖具有表面，形成在表面中的空腔，多个导电触点和导电密封环。 导电触点设置在表面上，并且导电密封环设置在表面上并且围绕导电触点。 IC芯片连接到导电触点和导电密封环，并与盖和导电密封环形成密封室。 晶体坯料位于密封室中，并与IC芯片电连接。 此外，还提供了一种用于制造晶体振荡器的方法。

公开(公告)号：US09563102B2

公开(公告)日：2017-02-07

申请号：US14676216

申请日：2015-04-01

申请人： Yu-Wen Hsu ,  Ying-Che Lo ,  Lu-Po Liao ,  Chia-Yu Wu

发明人： Yu-Wen Hsu ,  Ying-Che Lo ,  Lu-Po Liao ,  Chia-Yu Wu

IPC分类号： G02F2/00 ,  G01C19/5712 ,  B81B7/00 ,  G01C19/5776

CPC分类号： G02F2/00 ,  B81B7/008 ,  G01C19/5776

摘要： This invention provides a signal processing method of multiple micro-electro-mechanical system devices. The signal processing method includes: providing at least two MEMS devices; applying driving or modulating signals of different frequencies to the MEMS devices such that the MEMS devices generate respective MEMS signals with respective frequencies; and combining the MEMS signals with respective frequencies into one or more multi-frequency signals and outputting the multi-frequency signals, wherein a number of the multi-frequency signals is less than a number of the MEMS signals with respective frequencies. This invention also provides a combo MEMS device integrating two or more MEMS devices and two or more vibration sources.

摘要翻译： 本发明提供了一种多个微机电系统装置的信号处理方法。 信号处理方法包括：提供至少两个MEMS器件; 将不同频率的信号驱动或调制到MEMS器件，使得MEMS器件以相应的频率产生相应的MEMS信号; 以及将所述MEMS信号与各个频率组合成一个或多个多频信号并输出​​所述多频信号，其中所述多频信号的数目小于具有相应频率的多个MEMS信号。 本发明还提供集成两个或多个MEMS器件和两个或更多个振动源的组合MEMS器件。

公开(公告)号：US20100058864A1

公开(公告)日：2010-03-11

申请号：US12550394

申请日：2009-08-30

申请人： Yu-Wen Hsu ,  Hsin-Tang Chien ,  Sheah Chen

发明人： Yu-Wen Hsu ,  Hsin-Tang Chien ,  Sheah Chen

IPC分类号： G01P15/125

CPC分类号： G01P15/125 ,  G01P15/18 ,  G01P2015/0814 ,  G01P2015/082 ,  G01P2015/0831

摘要： A multi-axis capacitive accelerometer is disclosed. A first mass is disposed and held by an anchor supported by a substrate, wherein the first mass is asymmetrically suspended on the anchor by means of two cantilevers, so that the first mass rotates about a rotation axis, for sensing the acceleration in a first direction perpendicular to the substrate. A second mass is disposed in the first mass and suspended on the first mass by means of a set of springs to sense the acceleration in a second direction parallel to the substrate. Furthermore, a third mass can be disposed in the second mass, wherein the third mass is suspended on the second mass by means of another set of springs to sense the acceleration in a third direction. The first direction, the second direction and the third direction are mutually orthogonal to each other.

摘要翻译： 公开了一种多轴电容加速度计。 第一质量块被由衬底支撑的锚固件设置和保持，其中第一质量块通过两个悬臂不对称地悬挂在锚固件上，使得第一质量块围绕旋转轴线旋转，以感测第一方向上的加速度 垂直于衬底。 第二质量块通过一组弹簧设置在第一质量体中并悬挂在第一质量块上，以在平行于衬底的第二方向上感测加速度。 此外，第三质量可以设置在第二质量块中，其中通过另一组弹簧将第三质量块悬挂在第二质量块上以感测在第三方向上的加速度。 第一方向，第二方向和第三方向相互正交。