公开(公告)号：US06376378B1

公开(公告)日：2002-04-23

申请号：US09415364

申请日：1999-10-08

申请人： Feng Chen ,  Lup San Leong ,  Charles Lin

发明人： Feng Chen ,  Lup San Leong ,  Charles Lin

IPC分类号： H01L21461

CPC分类号： B24B37/042 ,  B24B37/20 ,  H01L21/31053 ,  H01L21/3212

摘要： In one embodiment, a dielectric layer (144, 156) overlying a semiconductor substrate (28) is uniformly polished. During polishing, the perimeter (32) of the semiconductor substrate (28) overlies a peripheral region (16, 48, 66, 86, 120) of a polishing pad (6, 42, 60, 80, 100) and an edge portion (36) of the front surface of semiconductor substrate (28) is not in contact with the front surface (18, 50, 68, 88, 122) of the polishing pad (6, 42, 60, 80, 100), in the peripheral region (16, 48, 66, 86, 120). As a result, the polishing rate at the edge portion (36) of the semiconductor substrate (28) is reduced, and the semiconductor substrate (28) is polished with improved center to edge uniformity. Since the semiconductor substrate (28) is polished with improved center to edge uniformity, die yield is increased because die located within the edge portion (36) of the semiconductor substrate (28) are not over polished.

摘要翻译： 在一个实施例中，覆盖半导体衬底（28）的电介质层（144,156）被均匀抛光。 在抛光期间，半导体衬底（28）的周边（32）覆盖在抛光垫（6,42,60,80,100）和边缘部分（16,48,66,101）周边区域 半导体衬底（28）的前表面的表面（36）不与抛光垫（6,42,60,80,100）的前表面（18,50,68,88,100）接触， 区域（16,48,66,86,120）。 结果，半导体衬底（28）的边缘部分（36）处的抛光速率降低，并且半导体衬底（28）以改善的中心到边缘均匀性被抛光。 由于半导体基板（28）以改善的中心到边缘均匀性被抛光，所以由于位于半导体基板（28）的边缘部分（36）内的模具没有被过度抛光，所以提高了模具的产量。

公开(公告)号：US06964598B1

公开(公告)日：2005-11-15

申请号：US09904828

申请日：2001-07-12

申请人： Lup San Leong ,  Feng Chen ,  Charles Lin

发明人： Lup San Leong ,  Feng Chen ,  Charles Lin

IPC分类号： B24B37/04 ,  H01L21/3105 ,  H01L21/321 ,  B24B49/00 ,  B24B51/00

CPC分类号： B24B37/042 ,  B24B37/20 ,  H01L21/31053 ,  H01L21/3212

摘要： In one embodiment, a semiconductor substrate (38) is uniformly polished using a polishing pad (16) that has a first polishing region (26), a second polishing region (28), and a third polishing region (30). The semiconductor substrate (38) is aligned to the polishing pad (16), such that the center of the semiconductor substrate (38) overlies the second polishing region (28), and the edge of the semiconductor substrate overlies the first polishing region (26) and the third polishing region (30). During polishing, the semiconductor substrate (38) is not radially oscillated over the surface of the polishing pad, and as a result a more uniform polishing rate is achieved across the semiconductor substrate (38). This allows the semiconductor substrate (38) to be uniformly polished from center to edge, and increases die yield because die located on the semiconductor substrate (38) are not over polished.

摘要翻译： 在一个实施例中，使用具有第一抛光区域（26），第二抛光区域（28）和第三抛光区域（30）的抛光垫（16）均匀地抛光半导体衬底（38）。 半导体衬底（38）与抛光垫（16）对准，使得半导体衬底（38）的中心覆盖在第二抛光区域（28）上，并且半导体衬底的边缘覆盖在第一抛光区域（26） ）和第三抛光区域（30）。 在抛光期间，半导体衬底（38）不在抛光垫的表面上径向摆动，结果在半导体衬底（38）上实现了更均匀的抛光速率。 这允许半导体衬底（38）从中心到边缘被均匀抛光，并且由于位于半导体衬底（38）上的裸芯未被抛光，所以提高了裸片的产量。

公开(公告)号：US07156726B1

公开(公告)日：2007-01-02

申请号：US09904981

申请日：2001-07-12

申请人： Feng Chen ,  Lup San Leong ,  Charles Lin

发明人： Feng Chen ,  Lup San Leong ,  Charles Lin

IPC分类号： B24B7/22

CPC分类号： B24B37/26 ,  B24B37/042 ,  B24D7/14

摘要： In one embodiment, a dielectric layer (144, 156) overlying a semiconductor substrate (28) is uniformly polished. During polishing, the perimeter (32) of the semiconductor substrate (28) overlies a peripheral region (16, 48, 66, 86, 120) of a polishing pad (6, 42, 60, 80, 100) and an edge portion (36) of the front surface of semiconductor substrate (28) is not in contact with the front surface (18, 50, 68, 88, 122) of the polishing pad (6, 42, 60, 80, 100), in the peripheral region (16, 48, 66, 86, 120). As a result, the polishing rate at the edge portion (36) of the semiconductor substrate (28) is reduced, and the semiconductor substrate (28) is polished with improved center to edge uniformity. Since the semiconductor substrate (28) is polished with improved center to edge uniformity, die yield is increased because die located within the edge portion (36) of the semiconductor substrate (28) are not over polished.

摘要翻译： 在一个实施例中，覆盖半导体衬底（28）的电介质层（144,156）被均匀抛光。 在抛光期间，半导体衬底（28）的周边（32）覆盖在抛光垫（6,42,60,80,100）和边缘部分（16,48,66,101）周边区域 半导体衬底（28）的前表面的表面（36）不与抛光垫（6,42,60,80,100）的前表面（18,50,68,88,100）接触， 区域（16,48,66,86,120）。 结果，半导体衬底（28）的边缘部分（36）处的抛光速率降低，并且半导体衬底（28）以改善的中心到边缘均匀性被抛光。 由于半导体基板（28）以改善的中心到边缘均匀性被抛光，所以由于位于半导体基板（28）的边缘部分（36）内的模具没有被过度抛光，所以提高了模具的产量。

公开(公告)号：US06443809B1

公开(公告)日：2002-09-03

申请号：US09440722

申请日：1999-11-16

申请人： Lup San Leong ,  Feng Chen ,  Charles Lin

发明人： Lup San Leong ,  Feng Chen ,  Charles Lin

IPC分类号： B24B722

CPC分类号： B24B37/26 ,  B24B37/042 ,  B24D7/14

摘要： In one embodiment, a semiconductor substrate (38) is uniformly polished using a polishing pad (16) that has a first polishing region (26), a second polishing region (28), and a third polishing region (30). The semiconductor substrate (38) is aligned to the polishing pad (16), such that the center of the semiconductor substrate (38) overlies the second polishing region (28), and the edge of the semiconductor substrate overlies the first polishing region (26) and the third polishing region (30). During polishing, the semiconductor substrate (38) is not radially oscillated over the surface of the polishing pad, and as a result a more uniform polishing rate is achieved across the semiconductor substrate (38). This allows the semiconductor substrate (38) to be uniformly polished from center to edge, and increases die yield because die located on the semiconductor substrate (38) are not over polished.

摘要翻译： 在一个实施例中，使用具有第一抛光区域（26），第二抛光区域（28）和第三抛光区域（30）的抛光垫（16）均匀地抛光半导体衬底（38）。 半导体衬底（38）与抛光垫（16）对准，使得半导体衬底（38）的中心覆盖在第二抛光区域（28）上，并且半导体衬底的边缘覆盖在第一抛光区域（26） ）和第三抛光区域（30）。 在抛光期间，半导体衬底（38）不在抛光垫的表面上径向摆动，结果在半导体衬底（38）上实现了更均匀的抛光速率。 这允许半导体衬底（38）从中心到边缘被均匀抛光，并且由于位于半导体衬底（38）上的裸芯未被抛光，所以提高了裸片的产量。

公开(公告)号：USD998609S1

公开(公告)日：2023-09-12

申请号：US29887604

申请日：2023-03-22

申请人： Feng Chen

设计人： Feng Chen

摘要： FIG. 1 is a front, top perspective view of a switch portable dock showing my new design.
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a rear, bottom perspective view; and,
FIG. 9 is a front perspective view thereof, showing the switch portable dock in an open state of use.
The broken lines in the drawings depict portions of the switch portable dock that form no part of the claimed design.

公开(公告)号：US11265438B2

公开(公告)日：2022-03-01

申请号：US16978593

申请日：2018-04-26

申请人： Hewlett-Packard Development Company, L.P. ,  Da Peng Li ,  Zhi Wen Xing ,  Feng Chen

发明人： Da Peng Li ,  Zhi Wen Xing ,  Feng Chen

IPC分类号： H04N1/00 ,  H04N1/10 ,  G06F3/12

摘要： An example device includes a U-shaped body to be placed around a guide on which a scanner carriage is to be guided. A fixed leg of the U-shaped body is attached to a linearly translatable scanner carriage. A free leg of the U-shaped body is not attached to the scanner carriage and has inward facing ribs. The ribs on the free leg of the U-shaped body are positioned to come into contact with the guide to align the scanner carriage with the guide.

公开(公告)号：US10819535B2

公开(公告)日：2020-10-27

申请号：US16217556

申请日：2018-12-12

申请人： Feng Chen ,  Franz-Josef Götz ,  Marcel Kießling ,  An Ninh Nguyen ,  Jürgen Schmitt

发明人： Feng Chen ,  Franz-Josef Götz ,  Marcel Kießling ,  An Ninh Nguyen ,  Jürgen Schmitt

IPC分类号： G06F15/173 ,  H04L12/40 ,  H04L12/46 ,  H04L12/721 ,  H04L12/891 ,  H04L12/841 ,  H04L12/801 ,  H04L12/931

摘要： Methods and systems are provided for improved data packet transmission in a network bridge. Separate data packets received from a plurality of automation components are aggregated into a single data packet stream. The data packet stream is transmitted to another network node, for example, another network bridge.

公开(公告)号：US08934591B2

公开(公告)日：2015-01-13

申请号：US13727849

申请日：2012-12-27

申请人： Lianliang Tai ,  Guangren Li ,  Feng Chen

发明人： Lianliang Tai ,  Guangren Li ,  Feng Chen

IPC分类号： H04L7/00 ,  H04L7/033

CPC分类号： H04L7/0012 ,  H04L7/0338

摘要： The present invention provides a clock and data recovery circuit, including an n-phase clock, a sampling and edge detection unit, an edge determination unit, a clock picking unit and a data picking unit. The sampling and edge detection unit performs spaced sampling on the input serial data using the n-phase clock, and performs edge detection and resampling on the sampled data. The edge determination unit filters the resampled data by the counting units, and obtains the positions of the edges of the serial data according to the counting result of the counting units. The clock picking unit selects a clock from the n clocks that is the farthest away from the edges as the recovered clock. The data picking unit obtains the recovered data according to the recovered clock. The present invention also provides a parallel output circuit.

摘要翻译： 本发明提供一种包括n相时钟，采样和边缘检测单元，边缘确定单元，时钟采集单元和数据采集单元的时钟和数据恢复电路。 采样和边沿检测单元使用n相时钟对输入串行数据执行间隔采样，并对采样数据执行边沿检测和重采样。 边缘确定单元通过计数单元对重采样数据进行滤波，并根据计数单元的计数结果获得串行数据的边沿的位置。 时钟采集单元从距离边缘最远的n个时钟选择时钟作为恢复时钟。 数据采集​​单元根据恢复的时钟获得恢复的数据。 本发明还提供一种并行输出电路。

公开(公告)号：US20140006686A1

公开(公告)日：2014-01-02

申请号：US13992809

申请日：2011-12-30

申请人： Feng Chen ,  Michael P. Mesnier

发明人： Feng Chen ,  Michael P. Mesnier

IPC分类号： G06F3/06

CPC分类号： G06F3/0656 ,  G06F3/0611 ,  G06F3/0679 ,  G06F12/0238 ,  G06F12/0246 ,  G06F12/1009 ,  G06F12/14 ,  G06F12/1433 ,  G06F2212/7205

摘要： Storage class memory may be used in an architecture to achieve high performance, high reliability, high compatibility. In some embodiments, reads may be handled in a conventional way used in a memory based model. However writes do not use a memory based model but instead correspond to a storage based model. The hybrid nature can be achieved by setting the storage class memory to be write protected so that all writes must go through a software based block device interface. In some embodiments, the software based block device interface prevents erroneous writes to the storage class memory.

摘要翻译： 存储类内存可用于架构，以实现高性能，高可靠性，高兼容性。 在一些实施例中，读取可以以基于存储器的模型中使用的常规方式来处理。 但是，写入不使用基于内存的模型，而是对应于基于存储的模型。 可以通过将存储类存储器设置为写保护来实现混合性质，以便所有写操作都必须通过基于软件的块设备接口。 在一些实施例中，基于软件的块设备接口防止对存储类存储器的错误写入。

公开(公告)号：US20140002532A1

公开(公告)日：2014-01-02

申请号：US13977844

申请日：2011-12-30

申请人： Jianmei Huang ,  Tao Yang ,  Feng Chen

发明人： Jianmei Huang ,  Tao Yang ,  Feng Chen

IPC分类号： B41J2/21

CPC分类号： B41J2/21 ,  B41F19/007

摘要： Disclosed is a control method for a digital ink-jet printing device to carry out multicolor ink-jet printing on an intermittent rotary printing device. The method includes: determining whether a current page is the first page; if yes, calculating a length of an image to be printed on the current page by subtracting a distance between an imaging component group and a reference from a length of a page, wherein the reference is the foremost printing imaging component group in a movement direction of a printed body, and acquiring image data of the current page, the length of which is the calculated length, after delaying the distance; if no, acquiring unprinted image data of a previous page, the length of which is the distance, and image data of the current page, the length of which is the calculated length.

摘要翻译： 公开了一种用于在间歇旋转印刷装置上进行多色喷墨打印的数字喷墨打印装置的控制方法。 该方法包括：确定当前页是否是第一页; 如果是，则通过从页面的长度减去成像组件组和参考之间的距离来计算要打印在当前页面上的图像的长度，其中该参考是最前面的打印成像组件在移动方向上 并且在延迟距离之后获取当前页的长度为计算长度的图像数据; 如果没有，则获取其长度为距离的前一页的未打印图像数据，以及当前页的长度是计算长度的当前页的图像数据。