公开(公告)号：US20100171201A1

公开(公告)日：2010-07-08

申请号：US12349197

申请日：2009-01-06

申请人： M. Todd Wyant ,  Jeffrey G. Holloway ,  Anthony L. Coyle

发明人： M. Todd Wyant ,  Jeffrey G. Holloway ,  Anthony L. Coyle

IPC分类号： H01L23/52 ,  H01R43/00

CPC分类号： H01L23/49568 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/10253 ,  Y10T29/49002 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of a semiconductor device and method provide a quad flat no-lead semiconductor package which can have an arrangement of both chip-on-lead (COL) style leads and a die pad for supporting a die, and can also provide non-COL leads, both COL leads and a leadframe power pad, COL leads which have varying lengths to reduce stress resulting from thermal mismatch between a semiconductor die and leads, and a die pad with a curved, meandering edge to reduce stress resulting from thermal mismatch between the semiconductor die and the die pad.

摘要翻译： 半导体器件和方法的实施例提供四引脚扁平无引线半导体封装，其可以具有引线引线（COL）型引线和用于支撑管芯的管芯焊盘的布置，并且还可以提供非COL引线 ，COL引线和引线框功率垫，COL引线，其具有不同的长度以减少由半导体管芯和引线之间的热失配引起的应力，以及具有弯曲的曲折边缘的管芯焊盘，以减少由半导体之间的热失配引起的应力 模具和模具垫。

公开(公告)号：US20070296056A1

公开(公告)日：2007-12-27

申请号：US11426591

申请日：2006-06-27

申请人： Anthony L. Coyle ,  Reynaldo C. Javier ,  Jeffrey G. Holloway

发明人： Anthony L. Coyle ,  Reynaldo C. Javier ,  Jeffrey G. Holloway

IPC分类号： H01L29/00

CPC分类号： H01L24/85 ,  H01F17/0006 ,  H01F17/02 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48092 ,  H01L2224/4813 ,  H01L2224/48599 ,  H01L2224/85 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/00014

摘要： An electronic device has a semiconductor chip (101) with a surface and an electric circuit including terminals on the surface. The circuit has a first (103) and a second terminal (104) with a metallurgical composition for wire bonding. The chip has a conductive wire (120) above the chip surface, which has a length and a first and a second end; the first end is attached to the first terminal and the second end to the second terminal. The wire is shaped to form at least one sequence of a concave and a convex portion. The sequence may be configured to form a loop, or multiple wire loops resulting in a spiraling wire coil. The number, shape, and spatial sequence of the loops control the electrical inductance of the wire; the inductance is selected to fine-tune the high frequency characteristics of the circuit.

摘要翻译： 电子设备具有表面和包括端子在内的电路的半导体芯片（101）。 电路具有用于引线接合的冶金组合物的第一（103）和第二端子（104）。 芯片具有在芯片表面上方的导线（120），其具有长度和第一和第二端; 第一端附接到第一端子，第二端部连接到第二端子。 导线成形为形成至少一个凹部和凸部的序列。 该顺序可以被配置为形成环路，或者多个线环形成螺旋线圈。 回路的数量，形状和空间顺序控制电线的电感; 选择电感来微调电路的高频特性。

公开(公告)号：US20070273010A1

公开(公告)日：2007-11-29

申请号：US11754456

申请日：2007-05-29

申请人： Jeffrey G. Holloway ,  Steven A. Kummerl ,  Bernhard P. Lange

发明人： Jeffrey G. Holloway ,  Steven A. Kummerl ,  Bernhard P. Lange

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L23/49568 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/14 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2924/01068 ,  H01L2924/181 ,  H01L2924/00

摘要： The semiconductor device whose structure is formed from a die attached to a leadframe comprises a die having an attachment member, and a leadframe having a recess configured to receive a corresponding attachment member so as to establish a connection between the die and the leadframe.

摘要翻译： 其结构由附接到引线框架的管芯形成的半导体器件包括具有附接构件的管芯，以及具有凹部的引线框架，该引线框架被配置为接收相应的附接构件，以便建立管芯和引线框架之间的连接。