-
公开(公告)号：US20240196530A1
公开(公告)日：2024-06-13
申请号：US18284643
申请日：2022-03-17
CPC分类号： H05K1/111 , H01L24/13 , H01L24/81 , H05K1/0306 , H05K1/036 , H05K3/26 , H01L24/16 , H01L2224/13147 , H01L2224/16238 , H01L2224/80013 , H01L2224/81203 , H01L2924/3511 , H01L2924/3841 , H05K2201/099
摘要： Provided is a method for manufacturing a multilayer substrate capable of suppressing short circuits between bumps and the warpage of substrates. This method includes: providing a first substrate being a rigid substrate including first bumps, and a second substrate or semiconductor device including second bumps, the first bumps and the second bumps being composed of a metal or alloy having a melting point of 600° C. or more, and having a height of 0.3 μm or more; performing cleaning treatment on bonding surfaces of the first bumps and the second bumps under a pressure of 1×10−3 Pa or less, and subsequently stacking the first substrate and the second substrate or semiconductor device so that the bonding surfaces of the first bumps and the second bumps abut each other, and pressure-welding the first bumps and the second bumps at a temperature of 90° C. or less to form a multilayer substrate.
-
公开(公告)号：US20240297064A1
公开(公告)日：2024-09-05
申请号：US18571831
申请日：2022-06-15
IPC分类号： H01L21/683 , H01L21/48 , H01L21/56
CPC分类号： H01L21/6835 , H01L21/4846 , H01L21/568 , H01L2221/68386
摘要： A method for manufacturing a wiring substrate that includes: providing a laminated sheet that includes a release layer and a metal layer in order on a carrier; forming a cut from a surface of the laminated sheet opposite to the carrier so that the cut passes through the inside of an outer edge portion of the laminated sheet and so that the cut penetrates the metal layer and the release layer, and dividing the metal layer and the release layer into a central portion and a peripheral portion with the cut as a boundary; and inserting a thin piece from the cut toward the central portion side of the metal layer or the release layer to form a gap between the metal layer and the carrier in which an insertion angle of the thin piece is greater than 0°.
-
公开(公告)号：US20230420270A1
公开(公告)日：2023-12-28
申请号：US18036271
申请日：2021-08-06
CPC分类号： H01L21/568 , B32B43/006 , B32B2457/08
摘要： There is provided a method for manufacturing a wiring substrate in which damage to a device layer during carrier release can be suppressed, and a photolithography process can be carried out with good accuracy on the device layer after carrier release. This method includes: providing a laminated sheet including a carrier, a release layer, a metal layer, and a device layer in order; making a cut line from a surface of the laminated sheet on the carrier side so that the cut line passes through the carrier, the release layer, and the metal layer when the laminated sheet is seen in a cross-sectional view; and removing outer edge portions outside the cut line in the carrier, the release layer, and the metal layer, thereby exposing part of a surface of the device layer on the metal layer side to form a pressurizable exposed portion for promoting release of the carrier.
-
公开(公告)号：US20230072120A1
公开(公告)日：2023-03-09
申请号：US17797268
申请日：2021-01-21
IPC分类号： C23C14/00 , H05K3/02 , C23C14/06 , C23C14/35 , C23C14/58 , C23C14/18 , C23C14/02 , C03C17/36
摘要： Provided is a carrier-attached metal foil which can suppress the number of foreign matter particles on the surface of a metal layer to enhance circuit formability, and can keep stable releasability even after heating at a high temperature of 240° C. or higher (for example, 260° C.) for a long period of time. The carrier-attached metal foil includes a carrier, a release functional layer provided on the carrier, the release functional layer including a metal oxynitride, and a metal layer provided on the release functional layer.
-
-
-
搜索结果
4 条记录 (耗时 0.036 秒)
