公开(公告)号：US20150033553A1

公开(公告)日：2015-02-05

申请号：US14515537

申请日：2014-10-16

Applicant: MPI CORPORATION

Inventor： Chien-Chou Wu ,  Ming-Chi Chen ,  Tsung-Yi Chen ,  Chung-Che Li

IPC: G01R3/00 ,  G01R31/28

CPC classification number: G01R3/00 ,  B23K2103/42 ,  G01R31/2853 ,  G01R31/2887 ,  G01R31/2889 ,  Y10T29/49004 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49222

Abstract: An assembly method of direct-docking probing device is provided. First, a space transforming plate made by back-end-of-line semiconductor manufacturing process is provided, so the thickness of the space transforming plate is predetermined by the client of probe card manufacturer. Then a reinforcing plate in which a plurality of circuits disposed is provided, which has larger mechanical strength than the space transforming plate. After that the reinforcing plate and the space transforming plate are joined and electrically connected by a plurality of solders so as to form a space transformer. Then, a conductive elastic member and a probe interface board are provided. Thereafter, the space transformer and the conductive elastic member are mounted on the probe interface board. After that, at least one vertical probe assembly having a plurality of vertical probes is mounted on the space transforming plate, and the vertical probes is electrically connected with the space transforming plate.

Abstract translation: 提供了直接对接探测装置的装配方法。 首先，提供由后端半导体制造工艺制成的空间变换板，因此空间变换板的厚度由探针卡制造商的客户预先确定。 然后，设置有设置多个电路的加强板，其具有比空间转换板更大的机械强度。 之后，加强板和空间变换板通过多个焊料接合并电连接，形成空间变换器。 然后，提供导电弹性构件和探针接口板。 此后，空间变压器和导电弹性构件安装在探针接口板上。 之后，具有多个垂直探针的至少一个垂直探针组件安装在空间变换板上，垂直探针与空间转换板电连接。

公开(公告)号：US20150185254A1

公开(公告)日：2015-07-02

申请号：US14656730

申请日：2015-03-13

Applicant: MPI Corporation

Inventor： Chien-Chou Wu ,  Ming-Chi Chen ,  Chung-Che Li

IPC: G01R3/00 ,  H01F41/00 ,  H01F38/20 ,  H05K3/32 ,  H05K3/24

CPC classification number: G01R3/00 ,  G01R1/07378 ,  H01F38/20 ,  H01F41/00 ,  H05K3/241 ,  H05K3/32 ,  Y10T29/4902 ,  Y10T29/49124

Abstract: A manufacturing method of a probing device is provided. The manufacturing method includes following steps. First, a plurality of space transformers is disposed on a reinforcing plate and the space transformer includes a plurality of first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings are formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer.

Abstract translation: 提供了一种探测装置的制造方法。 制造方法包括以下步骤。 首先，多个空间变压器设置在加强板上，空间变压器包括多个第一焊盘。 然后，空间变压器固定在加强板上。 此后，在空间变压器上形成具有多个开口的光致抗蚀剂膜。 第一垫设置在开口中。 之后，形成金属层并将其覆盖在第一焊盘上。 之后，除去光致抗蚀剂膜，并将金属层平坦化，形成第二焊盘。 之后，加强板与PCB电连接。 此后，设置具有多个探测区域的探头，并且每个探测区域对应于空间变换器之一。 探测区域中的探头与空间变压器的内部电路电连接。

公开(公告)号：US09651578B2

公开(公告)日：2017-05-16

申请号：US14515537

申请日：2014-10-16

Applicant: MPI Corporation

Inventor： Chien-Chou Wu ,  Ming-Chi Chen ,  Tsung-Yi Chen ,  Chung-Che Li

IPC: G01R3/00 ,  G01R31/28 ,  B23K103/00

CPC classification number: G01R3/00 ,  B23K2103/42 ,  G01R31/2853 ,  G01R31/2887 ,  G01R31/2889 ,  Y10T29/49004 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49222

Abstract: An assembly method of direct-docking probing device is provided. First, a space transforming plate made by back-end-of-line semiconductor manufacturing process is provided, so the thickness of the space transforming plate is predetermined by the client of probe card manufacturer. Then a reinforcing plate in which a plurality of circuits disposed is provided, which has larger mechanical strength than the space transforming plate. After that the reinforcing plate and the space transforming plate are joined and electrically connected by a plurality of solders so as to form a space transformer. Then, a conductive elastic member and a probe interface board are provided. Thereafter, the space transformer and the conductive elastic member are mounted on the probe interface board. After that, at least one vertical probe assembly having a plurality of vertical probes is mounted on the space transforming plate, and the vertical probes is electrically connected with the space transforming plate.