公开(公告)号：US09506978B2

公开(公告)日：2016-11-29

申请号：US14847957

申请日：2015-09-08

Applicant: MPI CORPORATION

Inventor： Chung-Tse Lee ,  Chien-Chou Wu ,  Yi-Ming Chan

IPC: G01R31/28 ,  G01R1/04

CPC classification number: G01R31/2889 ,  G01R1/0408 ,  G01R1/0416

Abstract: An apparatus for probing die electricity includes a substrate, a converting plate, a needle module and a reinforcement structure. The converting plate includes two opposite surfaces respectively having a plurality of first and second conductive elements. The needle module has a plurality of needles respectively and electrically connected to the plurality second conductive elements. The reinforcement structure is made from a polymer gel and disposed between the converting plate and the substrate.

Abstract translation: 用于探测电力的装置包括基板，转换板，针模块和加强结构。 转换板包括分别具有多个第一和第二导电元件的两个相对表面。 针模组分别具有多个针并与多个第二导电元件电连接。 加强结构由聚合物凝胶制成并且设置在转换板和基底之间。

公开(公告)号：US20150033553A1

公开(公告)日：2015-02-05

申请号：US14515537

申请日：2014-10-16

Applicant: MPI CORPORATION

Inventor： Chien-Chou Wu ,  Ming-Chi Chen ,  Tsung-Yi Chen ,  Chung-Che Li

IPC: G01R3/00 ,  G01R31/28

CPC classification number: G01R3/00 ,  B23K2103/42 ,  G01R31/2853 ,  G01R31/2887 ,  G01R31/2889 ,  Y10T29/49004 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49222

Abstract: An assembly method of direct-docking probing device is provided. First, a space transforming plate made by back-end-of-line semiconductor manufacturing process is provided, so the thickness of the space transforming plate is predetermined by the client of probe card manufacturer. Then a reinforcing plate in which a plurality of circuits disposed is provided, which has larger mechanical strength than the space transforming plate. After that the reinforcing plate and the space transforming plate are joined and electrically connected by a plurality of solders so as to form a space transformer. Then, a conductive elastic member and a probe interface board are provided. Thereafter, the space transformer and the conductive elastic member are mounted on the probe interface board. After that, at least one vertical probe assembly having a plurality of vertical probes is mounted on the space transforming plate, and the vertical probes is electrically connected with the space transforming plate.

Abstract translation: 提供了直接对接探测装置的装配方法。 首先，提供由后端半导体制造工艺制成的空间变换板，因此空间变换板的厚度由探针卡制造商的客户预先确定。 然后，设置有设置多个电路的加强板，其具有比空间转换板更大的机械强度。 之后，加强板和空间变换板通过多个焊料接合并电连接，形成空间变换器。 然后，提供导电弹性构件和探针接口板。 此后，空间变压器和导电弹性构件安装在探针接口板上。 之后，具有多个垂直探针的至少一个垂直探针组件安装在空间变换板上，垂直探针与空间转换板电连接。

公开(公告)号：US09648757B2

公开(公告)日：2017-05-09

申请号：US14520772

申请日：2014-10-22

Applicant: MPI CORPORATION

Inventor： Chung-Tse Lee ,  Chien-Chou Wu ,  Tsung-Yi Chen

IPC: H05K3/40 ,  G01R3/00 ,  H05K3/14 ,  H05K3/10 ,  H05K3/32 ,  G01R1/067 ,  G01R1/20 ,  H01R43/20 ,  G01R1/073

CPC classification number: H05K3/4007 ,  G01R1/067 ,  G01R1/07378 ,  G01R1/20 ,  G01R3/00 ,  H01R43/20 ,  H05K3/10 ,  H05K3/143 ,  H05K3/32 ,  H05K3/403 ,  H05K3/4038 ,  H05K2201/09409 ,  H05K2203/0574 ,  H05K2203/1476 ,  Y10T29/49147 ,  Y10T29/49162 ,  Y10T29/49165

Abstract: A method of manufacturing a space transformer includes providing a carrier substrate made for a chip package, forming an insulated layer disposed on the carrier substrate, and forming a conductive block. The carrier substrate is formed with elongated first and second wires. The first wire has an elongated contact which is longer than the width of the first wire. The insulated layer is formed with a hole corresponding in position to the elongated contact. The conductive block is formed with an elongated connecting column located in the hole and connected with the elongated contact, and a cylindrical contact pad exposed at the outside of the insulated layer, larger-sized than the elongated connecting column is connected with the elongated connecting column. As a result, the cylindrical contact pad has sufficient area and structural strength for contact with a probe needle.

公开(公告)号：US09618536B2

公开(公告)日：2017-04-11

申请号：US14294958

申请日：2014-06-03

Applicant: MPI CORPORATION

Inventor： Chia-Yuan Kuo ,  Tien-Chia Li ,  Ming-Chi Chen ,  Chien-Chou Wu ,  Tsung-Yi Chen

IPC: G01D11/00 ,  G01R1/073 ,  G01R1/067

CPC classification number: G01R1/07357 ,  G01R1/0675

Abstract: A probe needle includes a head, a tail and a body connected between the head and the tail and provided with a first flat section curvedly extending from the head towards the tail for providing sufficient deformation when the tail is pressed on a device under test, and a second flat section neighbored to the first flat section for supporting the probe needle in between upper and lower dies. When the probe needles are used in a probe module, the probe needles can be arranged with a pitch same as that of the conventional probe needles even though the probe needles are formed from posts having a relatively greater diameter than that of the posts for making the conventional probe needles, such that the probe needles may have enhanced current withstanding capacity and prolonged lifespan.

公开(公告)号：US20150185254A1

公开(公告)日：2015-07-02

申请号：US14656730

申请日：2015-03-13

Applicant: MPI Corporation

Inventor： Chien-Chou Wu ,  Ming-Chi Chen ,  Chung-Che Li

IPC: G01R3/00 ,  H01F41/00 ,  H01F38/20 ,  H05K3/32 ,  H05K3/24

CPC classification number: G01R3/00 ,  G01R1/07378 ,  H01F38/20 ,  H01F41/00 ,  H05K3/241 ,  H05K3/32 ,  Y10T29/4902 ,  Y10T29/49124

Abstract: A manufacturing method of a probing device is provided. The manufacturing method includes following steps. First, a plurality of space transformers is disposed on a reinforcing plate and the space transformer includes a plurality of first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings are formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer.

Abstract translation: 提供了一种探测装置的制造方法。 制造方法包括以下步骤。 首先，多个空间变压器设置在加强板上，空间变压器包括多个第一焊盘。 然后，空间变压器固定在加强板上。 此后，在空间变压器上形成具有多个开口的光致抗蚀剂膜。 第一垫设置在开口中。 之后，形成金属层并将其覆盖在第一焊盘上。 之后，除去光致抗蚀剂膜，并将金属层平坦化，形成第二焊盘。 之后，加强板与PCB电连接。 此后，设置具有多个探测区域的探头，并且每个探测区域对应于空间变换器之一。 探测区域中的探头与空间变压器的内部电路电连接。

公开(公告)号：US09746495B2

公开(公告)日：2017-08-29

申请号：US14628622

申请日：2015-02-23

Applicant: MPI CORPORATION

Inventor： Chien-Chou Wu ,  Tsung-Yi Chen

IPC: G01R1/067 ,  G01R1/073 ,  G01R3/00

CPC classification number: G01R1/06722 ,  G01R1/06705 ,  G01R1/07342 ,  G01R3/00

Abstract: A probe device includes a spring probe and a probe seat. The spring probe includes a needle and a spring sleeve sleeved onto the needle and provided with at least one spring section and at least one non-spring section. The probe seat includes a plurality of dies stacked together and at least one guiding hole through which the spring probe is inserted. An upper edge and a lower edge of the guiding hole of the probe seat are arranged corresponding in position to the non-spring section of the spring sleeve. As a result, the spring probe is prevented from getting jammed due to the contact of the spring section of the spring sleeve with the upper and lower edges of the guiding hole.

公开(公告)号：US09651578B2

公开(公告)日：2017-05-16

申请号：US14515537

申请日：2014-10-16

Applicant: MPI Corporation

Inventor： Chien-Chou Wu ,  Ming-Chi Chen ,  Tsung-Yi Chen ,  Chung-Che Li

IPC: G01R3/00 ,  G01R31/28 ,  B23K103/00

CPC classification number: G01R3/00 ,  B23K2103/42 ,  G01R31/2853 ,  G01R31/2887 ,  G01R31/2889 ,  Y10T29/49004 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49222

Abstract: An assembly method of direct-docking probing device is provided. First, a space transforming plate made by back-end-of-line semiconductor manufacturing process is provided, so the thickness of the space transforming plate is predetermined by the client of probe card manufacturer. Then a reinforcing plate in which a plurality of circuits disposed is provided, which has larger mechanical strength than the space transforming plate. After that the reinforcing plate and the space transforming plate are joined and electrically connected by a plurality of solders so as to form a space transformer. Then, a conductive elastic member and a probe interface board are provided. Thereafter, the space transformer and the conductive elastic member are mounted on the probe interface board. After that, at least one vertical probe assembly having a plurality of vertical probes is mounted on the space transforming plate, and the vertical probes is electrically connected with the space transforming plate.

公开(公告)号：US09588141B2

公开(公告)日：2017-03-07

申请号：US14628658

申请日：2015-02-23

Applicant: MPI Corporation

Inventor： Tsung-Yi Chen ,  Chien-Chou Wu ,  Tien-Chia Li ,  Ting-Hsin Kuo

IPC: G01R1/067 ,  G01R1/073 ,  G01R3/00

CPC classification number: G01R1/06722 ,  G01R1/06705 ,  G01R1/07342 ,  G01R3/00

Abstract: A probe device includes a spring probe having a spring sleeve with at least a spring section and a connection segment fixed to a needle and having a convex portion protruding over an outer cylinder surface of the spring section, and a probe seat having stacked dies and at least a guiding hole through which the probe is inserted. The dies includes a lower die, a supporting die above the lower die and a non-circular supporting hole at the supporting die. The distance between a supporting surface and a center of the supporting hole is greater than the radius of the outer cylinder surface and smaller than the distance between a guiding surface of the supporting hole and the center, which is greater than the maximum distance between the convex portion and a needle center, thereby preventing the probe receiving external force from exceeding deflection and bending.

Abstract translation: 探针装置包括：弹簧探针，其具有至少弹簧部分的弹簧套筒和固定到针头的连接部分，并且具有突出在弹簧部分的外筒表面上的凸出部分，以及具有堆叠模具的探针座 至少一个引导孔，探针插入该引导孔。 模具包括下模，下模上方的支撑模和在支撑模处的非圆形支撑孔。 支撑面和支撑孔的中心之间的距离大于外筒表面的半径，并且小于支撑孔的引导表面和中心之间的距离，该距离大于凸起 部分和针中心，从而防止探头接收外力超过偏转和弯曲。

公开(公告)号：US09535092B2

公开(公告)日：2017-01-03

申请号：US14605776

申请日：2015-01-26

Applicant: MPI CORPORATION

Inventor： Ting-Hsin Kuo ,  Tsung-Yi Chen ,  Tien-Chia Li ,  Yi-Lung Lee ,  Chien-Chou Wu

IPC: G01R1/067 ,  G01R1/073

CPC classification number: G01R1/06722 ,  G01R1/07307

Abstract: A spring probe includes a needle, a spring sleeve sleeved onto the needle, and a protrusion. The spring sleeve has upper and lower non-spring sections, and at least a spring section therebetween. The needle has a bottom end portion protruding out from the lower non-spring section, and a top end portion located in the upper non-spring section. The protrusion is located at one of the top end portion and the upper non-spring section. The needle is movable relative to the upper non-spring section from an initial position to a connected position where the upper non-spring section is electrically connected with the needle through the protrusion when receiving an external force. As a result, the spring probe effectively prevents signals from being transmitted through the spring section, thereby improving stability of signal transmission and preventing the spring section from fracture.

Abstract translation: 弹簧探针包括针，套在针上的弹簧套和突起。 弹簧套筒具有上下非弹簧部分，并且至少在其间具有弹簧部分。 针具有从下部非弹簧部分突出的底端部分和位于上部非弹簧部分中的顶端部分。 突起位于顶端部分和上部非弹性部分中的一个处。 针可以相对于上部非弹簧部分从初始位置移动到连接位置，在接收外部力时上部非弹簧部分通过突起与针体电连接。 结果，弹簧探针有效地防止信号通过弹簧部分传递，从而提高信号传输的稳定性并防止弹簧部分断裂。

公开(公告)号：US09341648B2

公开(公告)日：2016-05-17

申请号：US13972930

申请日：2013-08-22

Applicant: MPI Corporation

Inventor： Chung-Tse Lee ,  Chien-Chou Wu ,  Tsung-Yi Chen ,  Ming-Chi Chen

IPC: G01R31/00 ,  G01R1/04 ,  G01R3/00 ,  G01R1/073

CPC classification number: G01R1/0491 ,  G01R1/07378 ,  G01R3/00 ,  Y10T29/49126

Abstract: The probe card includes a substrate, at least two IC boards, and a plurality of probe pads. The IC boards are located on the substrate, and a predetermined distance is formed between the IC boards. Each of the IC boards has a plurality of lead connection points. The probe pads are plated on the IC boards, and are respectively connected to the lead connection points to cover the lead connection points. A probe area is surrounded by the probe pads on each of the IC boards. The probe pads are used to abut against plural probes.

Abstract translation: 探针卡包括基板，至少两个IC板和多个探针垫。 IC板位于基板上，并且在IC板之间形成预定距离。 每个IC板具有多个引线连接点。 探针焊盘电镀在IC板上，并分别连接到引线连接点以覆盖引线连接点。 探针区域被每个IC板上的探针焊盘包围。 探针垫用于抵靠多个探针。