摘要:
A command input system, includes: 1) an infrared camera for picking up an image of a sensing area, with which defines a certain part as a back face; 2) an extractor for extracting, based on an image data of the image picked up by the infrared camera, at least one of the following: a) a configuration of a hand, and b) a movement of a hand; and 3) a temperature adjustor for adjusting at least one of a hand temperature and a back face temperature so as to increase a difference between the hand temperature and the back face temperature.
摘要:
A non-contact information input device is provided that can easily and reliably use simple image processing to input information indicated by the shape of a user's hand. The non-contact information input device is configured to detect a user's hand using an imaging section, and to select an operation mode based on a shape of the hand. Then, a distance detecting section of the non-contact information input device is configured to detect a distance from the hand to the imaging section and adjust a parameter used in the operation mode in response to the distance if the parameter is adjustable. Thus, the image processing load is reduced and the parameter is easily and reliably adjusted by adjusting the parameter in the selected operation mode based on the distance detected by the distance detecting section.
摘要:
A semiconductor package, includes: element substrate having first surface, including: functional element on first surface, and extracting electrode on first surface and configured to output a signal of functional element, extracting electrode being disposed around functional element; rim substrate shaped into a frame, and configured to have first junction with element substrate to surround functional element, rim substrate including: first through hole through rim substrate, and connecting electrode which is: formed by packing first through hole with first conductor material, configured to seal signal extracting aperture of extracting electrode, and configured to electrically connect signal extracting aperture with takeout electrode; and cover substrate configured to have second junction with rim substrate to block aperture of rim substrate, cover substrate including: second through hole through cover substrate, and takeout electrode which is: formed by packing second through hole with second conductor material, and configured to take out signal of functional element.
摘要:
A semiconductor package, includes: element substrate having first surface, including: functional element on first surface, and extracting electrode on first surface and configured to output a signal of functional element, extracting electrode being disposed around functional element; rim substrate shaped into a frame, and configured to have first junction with element substrate to surround functional element, rim substrate including: first through hole through rim substrate, and connecting electrode which is: formed by packing first through hole with first conductor material, configured to seal signal extracting aperture of extracting electrode, and configured to electrically connect signal extracting aperture with takeout electrode; and cover substrate configured to have second junction with rim substrate to block aperture of rim substrate, cover substrate including: second through hole through cover substrate, and takeout electrode which is: formed by packing second through hole with second conductor material, and configured to take out signal of functional element.
摘要:
At either of the two terminals of each of a plurality of cells constituting a battery pack, a detection terminal is provided, and malfunction detection circuits each provided in correspondence to one of the cells each detect a malfunction of the corresponding cell based upon the voltage between the detection terminals. When shorting circuits are engaged in operation to short detection terminals corresponding to alternate cells from each other, a disconnection having occurred between a given cell and a corresponding detection terminal is detected based upon signals output from the malfunction detection circuits.
摘要:
An integrated drive motor unit which is integrally constituted of a motor, an inverter and a reducer differential unit arranged in a row, and a frame member. The reducer differential unit is connected to an output shaft of the motor, and distributes torque of the motor to a pair of axles, one of which passes through the inverter. The frame member constitutes a part of the motor and a part of the reducer differential unit, and has a portion surrounding the axle passing through the inverter. The inverter is disposed outside the frame member.
摘要:
A malfunction detection circuit that detects a cell malfunction alternately outputs the results of an overcharge detection executed during an overcharge detection period and the results of an over-discharge detection executed during an over-discharge detection period through time sharing based upon a clock signal. When the cell is in the normal range, the signal level of the signal output during the overcharge detection period is different from the signal level of the signal output during the over-discharge detection period. Thus, in the malfunction detection, the signal generated when an overcharge malfunction has occurred in the cell can be distinguished from the signal generated when an over-discharge malfunction has occurred in the cell.
摘要:
A drive unit for an electric vehicle is comprised of a motor, an inverter which supplies alternating current electric power to the motor, a speed reducer which is connected to the motor, and a cooling system which cools the motor, the inverter and the speed reducer. The speed reducer reduces a revolution speed of a mechanical output of the motor. The cooling system comprises a heat exchanger at which first refrigerant for receiving heat of at least one of the motor and the inverter receives heat of second refrigerant for receiving heat of at least one of the motor and the speed reducer.
摘要:
A power converter that is arranged in series with a motor to form a unitary structure through which an output shaft extends is provided with a plurality of coolers and a power semiconductor module mounted on a cooling surface of at least one of the plurality of coolers to supply electric power to a motor. Each of the plurality of coolers is disposed along an extending direction radially extending from an output shaft to be perpendicular to the output shaft. The cooling surface is provided along such an extending direction.