Method of manufacturing signal processing apparatus
    3.
    发明申请
    Method of manufacturing signal processing apparatus 失效
    信号处理装置的制造方法

    公开(公告)号:US20060145789A1

    公开(公告)日:2006-07-06

    申请号:US11360385

    申请日:2006-02-24

    IPC分类号: H01P3/08

    摘要: In a signal processing apparatus for transmitting or processing a signal, a substrate has a recessed portion in a surface of the substrate, a first interconnecting conductor is on the substrate, including at least the recessed portion of the substrate, and a dielectric support film is on the substrate opposite the recessed portion of the substrate with an air space sand between the dielectric support film and the substrate. A second interconnecting conductor is on a part of a surface of the dielectric support film. The apparatus has a simple structure and reduced transmission loss and can be made in a simple manufacturing process.

    摘要翻译: 在用于发送或处理信号的信号处理装置中,基板在基板的表面具有凹部,第一互连导体位于基板上,至少包括基板的凹部,介质载体膜为 在与衬底的凹陷部分相对的衬底上,在电介质支撑膜和衬底之间具有空隙砂。 第二互连导体在电介质支撑膜的表面的一部分上。 该装置结构简单,传输损耗降低,可以在简单的制造过程中进行。

    High frequency apparatus for transmitting or processing high frequency signal
    10.
    发明授权
    High frequency apparatus for transmitting or processing high frequency signal 失效
    用于发送或处理高频信号的高频装置

    公开(公告)号:US07030721B2

    公开(公告)日:2006-04-18

    申请号:US10421780

    申请日:2003-04-24

    IPC分类号: H01F5/00

    摘要: In a high frequency apparatus for transmitting or processing a high frequency signal, a substrate has a recessed portion in a surface of the substrate, a first interconnecting conductor is on the substrate, including at least the recessed portion of the substrate, and a dielectric support film is on the substrate opposite the recessed portion of the substrate with an air space between the dielectric support film and the substrate. A second interconnecting conductor is on a part of a surface of the dielectric support film. The high frequency apparatus has a simple structure and reduced transmission loss and can be made in a simple manufacturing process.

    摘要翻译: 在用于发送或处理高频信号的高频装置中,衬底在衬底的表面中具有凹陷部分,第一互连导体位于衬底上,至少包括衬底的凹部,以及电介质支撑 膜位于与衬底的凹陷部分相对的衬底上,在电介质支撑膜和衬底之间具有空气空间。 第二互连导体在电介质支撑膜的表面的一部分上。 高频装置结构简单,传输损耗降低,可以在简单的制造过程中进行。