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17 条记录 (耗时 0.024 秒)

    Smart card
    1.
    发明授权
    Smart card 有权
    智能卡

    公开(公告)号：US06375083B2

    公开(公告)日：2002-04-23

    申请号：US09354131

    申请日：1999-07-15

    申请人： Manfred Fries ,  Frank Püschner ,  Josef Mundigl ,  Jürgen Fischer ,  Detlef Houdeau

    发明人： Manfred Fries ,  Frank Püschner ,  Josef Mundigl ,  Jürgen Fischer ,  Detlef Houdeau

    IPC分类号： G06K1906

    CPC分类号： G06K19/07747 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A smart card with a card carrier on which a data processing circuit and also a connection assembly for the contactless communication of data between the data processing circuit and an external data processing station are provided. In the course of producing a prior art smart card, an integrated circuit is applied to a card carrier made of plastic. Afterwards, a transmitting/receiving coil connected to corresponding terminals of the integrated circuit is applied along the outer edges of the prior art smart card. In the case of the prior art smart card, the fact that defective prior art smart cards have to be destroyed is disadvantageous. According to the invention, the data processing circuit and the connection assembly are provided in a region of at least one module carrier and the card carrier has a region for accommodating the module carrier. This makes it possible firstly to test the completed module carrier in respect of its proper functioning before it is incorporated into a card carrier.

    摘要翻译： 一种具有卡载体的智能卡，其上提供有数据处理电路和数据处理电路与外部数据处理站之间的数据无接触通信的连接组件。 在生产现有技术的智能卡的过程中，将集成电路应用于由塑料制成的卡片载体。 之后，沿着现有技术的智能卡的外边缘施加连接到集成电路的相应端子的发送/接收线圈。 在现有技术的智能卡的情况下，缺陷的现有技术的智能卡必须被销毁的事实是不利的。 根据本发明，数据处理电路和连接组件设置在至少一个模块载体的区域中，并且卡载体具有用于容纳模块载体的区域。 这使得首先可以在完成的模块载体合并到卡载体之前对其正常工作进行测试。

    Sensor device for sensing biometric characteristics, in particular finger minutiae
    5.
    发明授权
    Sensor device for sensing biometric characteristics, in particular finger minutiae 有权
    用于感测生物特征的传感器装置，特别是手指细节

    公开(公告)号：US06347040B1

    公开(公告)日：2002-02-12

    申请号：US09716902

    申请日：2000-11-20

    申请人： Manfred Fries ,  Reinhard Fischbach ,  Detlef Houdeau

    发明人： Manfred Fries ,  Reinhard Fischbach ,  Detlef Houdeau

    IPC分类号： H05K702

    CPC分类号： G06K9/0002 ,  A61B5/1172

    摘要： The sensor device is provided for sensing biometric characteristics, in particular finger minutiae, with a biometric sensor chip. The sensor chip is fastened on a flexible printed circuit board that has a highly flexible substrate layer and conductor tracks applied to the substrate layer. The conductor tracks are in electrical contact with the sensor chip and are led to a terminal region of the flexible printed circuit board. The sensing area of the sensor chip is accessible through an opening in the flexible circuit board and the opening is at least partially surrounded by a grounding frame.

    摘要翻译： 传感器装置用于用生物特征传感器芯片感测生物特征，特别是手指细节。 传感器芯片紧固在柔性印刷电路板上，该印刷电路板具有高度柔性的基底层和施加到基底层的导体迹线。 导体轨道与传感器芯片电接触并被引导到柔性印刷电路板的端子区域。 传感器芯片的感测区域可通过柔性电路板中的开口进入，开口至少部分地被接地框包围。

    Flat carrier with an indicating device
    9.
    发明授权
    Flat carrier with an indicating device 失效
    带有指示装置的平面载体

    公开(公告)号：US06414441B1

    公开(公告)日：2002-07-02

    申请号：US09636534

    申请日：2000-08-10

    申请人： Manfred Fries ,  Wolfgang Friess

    发明人： Manfred Fries ,  Wolfgang Friess

    IPC分类号： G09G310

    CPC分类号： G06K19/07749 ,  G06K19/07336 ,  G06K19/07703 ,  G09F13/22 ,  H05K1/16

    摘要： A flat carrier having a power supply, for example in the form of a coil. The carrier is characterized by an electroluminescent device that contains two flat electrodes lying above one another and an electroluminescent paste located between the electrodes. The electrodes of the electroluminescent device are connected to terminals of the power supply, which can be implemented, for example, as a coil or battery.

    摘要翻译： 具有例如线圈形式的电源的平坦载体。 载体的特征在于电致发光器件，其包含彼此相对的两个平坦电极和位于电极之间的电致发光膏。 电致发光器件的电极连接到电源的端子，其可以例如作为线圈或电池来实现。

    Semiconductor chip with protection against analyzing
    10.
    发明授权
    Semiconductor chip with protection against analyzing 有权
    半导体芯片具有防分析功能

    公开(公告)号：US06201296B1

    公开(公告)日：2001-03-13

    申请号：US09274501

    申请日：1999-03-23

    申请人： Manfred Fries ,  Peter Stampka

    发明人： Manfred Fries ,  Peter Stampka

    IPC分类号： H01L2302

    CPC分类号： H01L23/576 ,  G06F21/86 ,  H01L2924/0002 ,  Y10S257/922 ,  H01L2924/00

    摘要： A copy-protection device for a semiconductor chip with a cover has a resonant oscillating circuit whose elements are located on the chip surface and within the cover. The semiconductor chip also has an evaluation circuit connected to the oscillating circuit. The evaluation circuit disables the semiconductor chip if the oscillating circuit is detuned and thus stopped from resonating. This detuning of the oscillating circuit occurs when the cover is removed, since the cover acts as a dielectric for the capacitor. After the cover has been removed, it is impossible to operate the semiconductor chip, in order to copy or analyze it.

    摘要翻译： 具有盖的半导体芯片的复制保护装置具有谐振振荡电路，其元件位于芯片表面和盖内。 半导体芯片还具有连接到振荡电路的评估电路。 如果振荡电路失谐并因此停止谐振，则评估电路禁用半导体芯片。 当盖被去除时，振荡电路的失谐发生，因为盖用作电容器的电介质。 在盖被去除之后，不可能操作半导体芯片，以便进行复制或分析。