利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

30 条记录 (耗时 0.016 秒)

    Semiconductor chip with protection against analyzing
    1.
    发明授权
    Semiconductor chip with protection against analyzing 有权
    半导体芯片具有防分析功能

    公开(公告)号：US06201296B1

    公开(公告)日：2001-03-13

    申请号：US09274501

    申请日：1999-03-23

    申请人： Manfred Fries ,  Peter Stampka

    发明人： Manfred Fries ,  Peter Stampka

    IPC分类号： H01L2302

    CPC分类号： H01L23/576 ,  G06F21/86 ,  H01L2924/0002 ,  Y10S257/922 ,  H01L2924/00

    摘要： A copy-protection device for a semiconductor chip with a cover has a resonant oscillating circuit whose elements are located on the chip surface and within the cover. The semiconductor chip also has an evaluation circuit connected to the oscillating circuit. The evaluation circuit disables the semiconductor chip if the oscillating circuit is detuned and thus stopped from resonating. This detuning of the oscillating circuit occurs when the cover is removed, since the cover acts as a dielectric for the capacitor. After the cover has been removed, it is impossible to operate the semiconductor chip, in order to copy or analyze it.

    摘要翻译： 具有盖的半导体芯片的复制保护装置具有谐振振荡电路，其元件位于芯片表面和盖内。 半导体芯片还具有连接到振荡电路的评估电路。 如果振荡电路失谐并因此停止谐振，则评估电路禁用半导体芯片。 当盖被去除时，振荡电路的失谐发生，因为盖用作电容器的电介质。 在盖被去除之后，不可能操作半导体芯片，以便进行复制或分析。

    Method for producing a chip card contact zone
    2.
    发明授权
    Method for producing a chip card contact zone 有权
    芯片卡接触区的制造方法

    公开(公告)号：US07694888B2

    公开(公告)日：2010-04-13

    申请号：US11560058

    申请日：2006-11-15

    申请人： Frank Pueschner ,  Wolfgang Schindler ,  Peter Stampka

    发明人： Frank Pueschner ,  Wolfgang Schindler ,  Peter Stampka

    IPC分类号： G06K19/06

    CPC分类号： G06K19/077

    摘要： A method for producing a contact zone for a chip card has the following steps. A sheet having a first surface and a second surface opposite the first surface. Forming at least one insulating trench, which extends from the first surface to the second surface. A cluster layer is applied to the first surface. The second surface is connected to a carrier element after the cluster layer has been applied to the first surface.

    摘要翻译： 用于制造芯片卡的接触区域的方法具有以下步骤。 一种具有与第一表面相对的第一表面和第二表面的片材。 形成从第一表面延伸到第二表面的至少一个绝缘沟槽。 将簇层应用于第一表面。 在将簇层施加到第一表面之后，第二表面连接到载体元件。

    Chip card
    3.
    发明授权
    Chip card 有权
    芯片卡

    公开(公告)号：US07240847B2

    公开(公告)日：2007-07-10

    申请号：US11078202

    申请日：2005-03-10

    申请人： Frank Püschner ,  Reinhard Proske ,  Peter Stampka ,  Andreas Müller-Hipper

    发明人： Frank Püschner ,  Reinhard Proske ,  Peter Stampka ,  Andreas Müller-Hipper

    IPC分类号： G06K19/06

    CPC分类号： G06K19/07724 ,  B29C45/14647 ,  B29C45/14836 ,  B29C2045/14844 ,  B29L2031/3456 ,  G06K19/0773 ,  G06K19/07749

    摘要： A contactless chip card and a method for producing a contactless chip card in which a plastic carrier having clearances is provided, on which an antenna coil is arranged on an upper side of the plastic carrier and a device having an integrated circuit is arranged on a rear side of the plastic carrier that is opposite from the upper side, an electrical connection is produced between the coil and the device, the plastic carrier is introduced into an injection mold and a card body is molded onto the rear side of the plastic carrier by the injection-molding process.

    摘要翻译： 一种非接触式芯片卡和一种制造非接触式芯片卡的方法，其中提供了具有间隙的塑料载体，天线线圈布置在塑料载体的上侧，具有集成电路的装置设置在后部 与上侧相反的塑料载体的侧面，在线圈和装置之间产生电连接，塑料载体被引入注射模具中，并且卡体通过塑料载体的后侧模制 注塑工艺。

    Microprocessor, in particular for use in a chip card, with a control unit and with a housing surrounding the control unit
    4.
    发明授权
    Microprocessor, in particular for use in a chip card, with a control unit and with a housing surrounding the control unit 有权
    微处理器，特别是用于芯片卡，具有控制单元和围绕控制单元的壳体

    公开(公告)号：US06185507B2

    公开(公告)日：2001-02-06

    申请号：US09255991

    申请日：1999-02-23

    申请人： Michael Huber ,  Peter Stampka ,  Josef Heitzer

    发明人： Michael Huber ,  Peter Stampka ,  Josef Heitzer

    IPC分类号： G01N2710

    CPC分类号： G07F7/1008 ,  G06F21/86 ,  G06F21/87 ,  G06K19/07 ,  G06K19/0716 ,  G06K19/073 ,  G06K19/07372 ,  G06Q20/341 ,  G07F7/082

    摘要： A microprocessor has a control unit with a housing surrounding the control unit. The invention also relates to a chip card having such a microprocessor that is protected against manipulations. At least one sensor indicates ambient states and is connected to the control unit and is provided in a region of the housing of the microprocessor. The control unit is configured in such a way that it can be placed in an inactive state if a measurement signal that indicates a predetermined ambient state is and/or is not fed to the control unit from the sensor.

    摘要翻译： 微处理器具有控制单元，其具有围绕控制单元的壳体。 本发明还涉及具有这种微处理器的芯片卡，该微处理器被保护以防止操作。 至少一个传感器指示环境状态并且连接到控制单元并且设置在微处理器的壳体的区域中。 如果指示预定环境状态的测量信号和/或没有从传感器馈送到控制单元，则控制单元被配置为使其能够处于非活动状态。

    SECURE EPASS BOOKLET BASED ON DOUBLE CHIP TECHNOLOGY
    6.
    发明申请
    SECURE EPASS BOOKLET BASED ON DOUBLE CHIP TECHNOLOGY 有权
    基于双芯片技术的安全通讯书

    公开(公告)号：US20130278378A1

    公开(公告)日：2013-10-24

    申请号：US13450510

    申请日：2012-04-19

    申请人： Juergen Hoegerl ,  Frank Pueschner ,  Peter Stampka ,  Michael Huber

    发明人： Juergen Hoegerl ,  Frank Pueschner ,  Peter Stampka ,  Michael Huber

    IPC分类号： G06F7/04 ,  G06K19/077

    CPC分类号： G06K7/10158 ,  G06K19/07372 ,  G06K19/07773 ,  G06K19/07794

    摘要： A tamper-evident credential has a radio frequency identification (RFID) package with a first antenna and a subordinate antenna, RFID package defining a first part of the credential. The credential also has a subordinate RFID package defining a second part of the credential. The subordinate RFID package selectively coupled to said subordinate antenna so that an interrogation signal applied to said first antenna package is transmitted to the subordinate RFID package across said subordinate antenna.

    摘要翻译： 防盗证书具有具有第一天线和下级天线的射频识别（RFID）封装，RFID封装限定凭证的第一部分。 凭证还具有定义凭证的第二部分的从属RFID包。 所述下级RFID封装选择性地耦合到所述从属天线，使得施加到所述第一天线封装的询问信号通过所述从属天线传输到所述下级RFID封装。

    Chip card having a contact zone and method of producing such a chip card
    9.
    发明授权
    Chip card having a contact zone and method of producing such a chip card 有权
    具有接触区的芯片卡和制造这种芯片卡的方法

    公开(公告)号：US06364205B1

    公开(公告)日：2002-04-02

    申请号：US09292267

    申请日：1999-04-15

    申请人： Thies Janczek ,  Peter Stampka

    发明人： Thies Janczek ,  Peter Stampka

    IPC分类号： C06K500

    CPC分类号： G06K19/07743 ,  Y10T428/31504

    摘要： A chip card has a contact zone on which an electrically conductive lacquer applied. The electrically conductive lacquer is based on an intrinsically conductive plastic material. Pigments are added to the electrically conductive lacquer. In an alternative embodiment an electrically nonconductive lacquer is applied to the contact zone. Conductive particles are disposed in the electrically nonconductive lacquer. The electrically conductive lacquer forms a covering for the conductive particles. A method of lacquering a contact zone and a method of producing a chip card are also provided.

    摘要翻译： 芯片卡具有接触区，在其上施加导电漆。 导电漆基于本体导电塑料材料。 将颜料加入到导电漆中。 在替代实施例中，将非导电漆施加到接触区。 导电颗粒设置在非导电漆中。 导电漆形成用于导电颗粒的覆盖物。 还提供了一种涂覆接触区域的方法和一种制造芯片卡片的方法。