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17 条记录 (耗时 0.019 秒)

    Smart card
    2.
    发明授权
    Smart card 有权
    智能卡

    公开(公告)号：US06375083B2

    公开(公告)日：2002-04-23

    申请号：US09354131

    申请日：1999-07-15

    申请人： Manfred Fries ,  Frank Püschner ,  Josef Mundigl ,  Jürgen Fischer ,  Detlef Houdeau

    发明人： Manfred Fries ,  Frank Püschner ,  Josef Mundigl ,  Jürgen Fischer ,  Detlef Houdeau

    IPC分类号： G06K1906

    CPC分类号： G06K19/07747 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A smart card with a card carrier on which a data processing circuit and also a connection assembly for the contactless communication of data between the data processing circuit and an external data processing station are provided. In the course of producing a prior art smart card, an integrated circuit is applied to a card carrier made of plastic. Afterwards, a transmitting/receiving coil connected to corresponding terminals of the integrated circuit is applied along the outer edges of the prior art smart card. In the case of the prior art smart card, the fact that defective prior art smart cards have to be destroyed is disadvantageous. According to the invention, the data processing circuit and the connection assembly are provided in a region of at least one module carrier and the card carrier has a region for accommodating the module carrier. This makes it possible firstly to test the completed module carrier in respect of its proper functioning before it is incorporated into a card carrier.

    摘要翻译： 一种具有卡载体的智能卡，其上提供有数据处理电路和数据处理电路与外部数据处理站之间的数据无接触通信的连接组件。 在生产现有技术的智能卡的过程中，将集成电路应用于由塑料制成的卡片载体。 之后，沿着现有技术的智能卡的外边缘施加连接到集成电路的相应端子的发送/接收线圈。 在现有技术的智能卡的情况下，缺陷的现有技术的智能卡必须被销毁的事实是不利的。 根据本发明，数据处理电路和连接组件设置在至少一个模块载体的区域中，并且卡载体具有用于容纳模块载体的区域。 这使得首先可以在完成的模块载体合并到卡载体之前对其正常工作进行测试。

    Flat carrier with an indicating device
    7.
    发明授权
    Flat carrier with an indicating device 失效
    带有指示装置的平面载体

    公开(公告)号：US06414441B1

    公开(公告)日：2002-07-02

    申请号：US09636534

    申请日：2000-08-10

    申请人： Manfred Fries ,  Wolfgang Friess

    发明人： Manfred Fries ,  Wolfgang Friess

    IPC分类号： G09G310

    CPC分类号： G06K19/07749 ,  G06K19/07336 ,  G06K19/07703 ,  G09F13/22 ,  H05K1/16

    摘要： A flat carrier having a power supply, for example in the form of a coil. The carrier is characterized by an electroluminescent device that contains two flat electrodes lying above one another and an electroluminescent paste located between the electrodes. The electrodes of the electroluminescent device are connected to terminals of the power supply, which can be implemented, for example, as a coil or battery.

    摘要翻译： 具有例如线圈形式的电源的平坦载体。 载体的特征在于电致发光器件，其包含彼此相对的两个平坦电极和位于电极之间的电致发光膏。 电致发光器件的电极连接到电源的端子，其可以例如作为线圈或电池来实现。

    Semiconductor chip with protection against analyzing
    8.
    发明授权
    Semiconductor chip with protection against analyzing 有权
    半导体芯片具有防分析功能

    公开(公告)号：US06201296B1

    公开(公告)日：2001-03-13

    申请号：US09274501

    申请日：1999-03-23

    申请人： Manfred Fries ,  Peter Stampka

    发明人： Manfred Fries ,  Peter Stampka

    IPC分类号： H01L2302

    CPC分类号： H01L23/576 ,  G06F21/86 ,  H01L2924/0002 ,  Y10S257/922 ,  H01L2924/00

    摘要： A copy-protection device for a semiconductor chip with a cover has a resonant oscillating circuit whose elements are located on the chip surface and within the cover. The semiconductor chip also has an evaluation circuit connected to the oscillating circuit. The evaluation circuit disables the semiconductor chip if the oscillating circuit is detuned and thus stopped from resonating. This detuning of the oscillating circuit occurs when the cover is removed, since the cover acts as a dielectric for the capacitor. After the cover has been removed, it is impossible to operate the semiconductor chip, in order to copy or analyze it.

    摘要翻译： 具有盖的半导体芯片的复制保护装置具有谐振振荡电路，其元件位于芯片表面和盖内。 半导体芯片还具有连接到振荡电路的评估电路。 如果振荡电路失谐并因此停止谐振，则评估电路禁用半导体芯片。 当盖被去除时，振荡电路的失谐发生，因为盖用作电容器的电介质。 在盖被去除之后，不可能操作半导体芯片，以便进行复制或分析。

    Method for producing an optoelectronic component
    9.
    发明授权
    Method for producing an optoelectronic component 有权
    光电子元件的制造方法

    公开(公告)号：US07179680B2

    公开(公告)日：2007-02-20

    申请号：US10695580

    申请日：2003-10-28

    申请人： Manfred Fries

    发明人： Manfred Fries

    IPC分类号： H01L21/00 ,  H01L29/06 ,  H01L31/113 ,  H01L23/02 ,  H01L23/28 ,  H01L23/29

    CPC分类号： G02B6/4204 ,  G02B6/4255 ,  G02B6/4259 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

    摘要： An optoelectronic component with an optoelectronic transducer is produced with the novel method. The optoelectronic component has a coupling region, which is formed in a radiation-transparent molding of the optoelectronic component. On the base of a clearance of the coupling region, the optoelectronic component has a radiation-optical functional surface, which is formed from the housing material and introduced into the molding with the aid of a profile milling cutter.

    摘要翻译： 利用新型方法制造出具有光电转换器的光电子元件。 光电子部件具有耦合区域，其形成在光电子部件的辐射透明模制中。 在耦合区域的间隙的基础上，光电子部件具有辐射光学功能表面，该表面由壳体材料形成，并借助轮廓铣刀引入模制件中。

    Configuration of a flat carrier with a chip module in a padded envelope and method of arranging the configuration
    10.
    发明授权
    Configuration of a flat carrier with a chip module in a padded envelope and method of arranging the configuration 失效
    配置带有封装信封中的芯片模块的扁平载体以及配置方法

    公开(公告)号：US06971519B2

    公开(公告)日：2005-12-06

    申请号：US10306181

    申请日：2002-11-27

    申请人： Manfred Fries

    发明人： Manfred Fries

    IPC分类号： B42D15/02 ,  B42D15/10 ,  B65D27/02 ,  G06K17/00 ,  G06K19/00 ,  G06K19/077 ,  G07B17/00 ,  B65D85/48

    CPC分类号： G06K19/07728 ,  B65D27/02 ,  G06K19/077 ,  G06K2017/0038 ,  G07B17/00467 ,  G07B2017/00491

    摘要： A configuration of a flat carrier with a chip module in a padded envelope, which can be transported in a transport device in the direction of one of the envelope's side edges, includes disposing the chip module in the padded envelope such that wire connections in the chip module extend over a side of the semiconductor chip that runs parallel to the transport device. Such a configuration is made possible by the fact that the flat carrier is applied in a standard way to a further carrier, which is folded in a suitable way.

    摘要翻译： 具有芯片模块的扁平载体的结构可以在填充的封套中，其可以沿着封套的侧边之一的方向在输送装置中输送，包括将芯片模块设置在填充的封套中，使得芯片中的导线连接 模块在平行于传送装置延伸的半导体芯片的一侧延伸。 这样的配置可以通过以标准方式施加到另一个以适当方式折叠的另外的载体的事实成为可能。