摘要:
A photolithography lens system is disclosed. The system has several elements perpendicularly aligned to an optical axis. The elements include a light source that generates an exposing light, a first lens that has a front focal plane and a pupil plane, and a binary mask between the light source and the first lens. The binary mask is placed at the front focal plane of the first lens. A pupil filter is placed at the pupil plane. Finally, a second lens is provided that has a front focal plane at substantially the same position as the pupil plane. The second lens also has a back focal plane where a semiconductor wafer is placed.
摘要:
A photolithography lens system is disclosed. The system has several elements all perpendicularly aligned to an optical axis. The elements include a light source that generates an exposing light, a first lens that has a front focal plane and a pupil plane, and a binary mask between the light source and the first lens. The binary mask is placed at the front focal plane of the first lens. A pupil filter is placed at the pupil plane. Finally, a second lens is provided that has a front focal plane at substantially the same position as the pupil plane. The second lens also has a back focal plane where a semiconductor wafer is placed.
摘要:
A photolithography lens system is disclosed. The system has several elements all perpendicularly aligned to an optical axis. The elements include a light source that generates an exposing light, a first lens that has a front focal plane and a pupil plane, and a binary mask between the light source and the first lens. The binary mask is placed at the front focal plane of the first lens. A pupil filter is placed at the pupil plane. Finally, a second lens is provided that has a front focal plane at substantially the same position as the pupil plane. The second lens also has a back focal plane where a semiconductor wafer is placed.
摘要:
A microchip may include an optical signal routing system. The optical routing system may include a distribution waveguide coupled to a light source and signaling waveguides interconnecting source and destination locations. A directional coupler may be used to couple and modulate light from the distribution waveguide to a signaling waveguide at a source location. A photodetector may be used to convert light signals from the source location into electrical signals at the destination.
摘要:
An integrated optoelectrical package for optoelectrical integrated circuits (ICs) is disclosed. The package includes a package substrate having contact receiving members on an upper surface. The contact receiving members are electrically connected to contacts on the lower surface. An optoelectronic receiver package and an optoelectronic transmitter package are each electrically mounted to respective first and second subsets of the contact receiving members. Input and output waveguide arrays are formed atop the substrate package and are optically coupled to the optoelectronic receiver package and the optoelectronic transmitter package, respectively. The contacts on the lower surface of the package substrate are designed to contact and engage the contact receiving members of a standard printed circuit board (PCB).
摘要:
A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has an optical waveguide structures in addition to electrical connections. An optically active device is flip-chip bonded directly to an integrated circuit using solder bump technology. The optically active device has a lens attached to it to facilitate optical coupling to the optical waveguide. The integrated circuit is flip-chip bonded to a Ball Grid Array (BGA) package. The BGA package is bonded to the PCB using solder reflow technology.
摘要:
An optical bus interconnects two or more processors in a multiprocessor system. One or more electrical-to-optical (“E-O”) transmitters are optically coupled to the optical bus using optical couplers. The E-O transmitters receive electrical signals from the processors and convert the electrical signals to optical signals to be guided onto the optical bus. Optical-to-electrical (“O-E”) receivers are also coupled to the optical bus using the optical couplers. The O-E receivers receive optical signals from the optical bus and convert the optical signals to electrical signals for the processors.
摘要:
A microchip includes optical layers with integrated waveguides and modulators. A continuous wave light beam coupled to incoming waveguide(s) is modulated and transmitted off-chip by outgoing waveguides coupled to optical interconnects.
摘要:
A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has an optical waveguide structure in addition to electrical connections. An optically active device is flip-chip bonded directly to an integrated circuit using solder bump technology. The optically active device has a lens directly attached to it to facilitate optical coupling to the optical waveguide. The integrated circuit is flip-chip bonded to a Ball Grid Array (BGA) package. The BGA package is bonded to the PCB using solder reflow technology.
摘要:
A microchip may include an optical clocking system. The optical clocking system may include a ring resonator which multiplies the frequency of light pulses from a light source for use as optical clocking signals and distribution waveguides to distribute the optical clocking signals to different regions of the microchip.