METHODS FOR REDUCING SURFACE CHARGES DURING THE MANUFACTURE OF MICROELECTROMECHANICAL SYSTEMS DEVICES
    3.
    发明申请
    METHODS FOR REDUCING SURFACE CHARGES DURING THE MANUFACTURE OF MICROELECTROMECHANICAL SYSTEMS DEVICES 失效
    微电子系统设备制造过程中减少表面电荷的方法

    公开(公告)号:US20080029481A1

    公开(公告)日:2008-02-07

    申请号:US11462026

    申请日:2006-08-02

    IPC分类号: C03C25/68 B44C1/22 H01L47/00

    摘要: Provided herein are methods for preventing the formation and accumulation of surface-associated charges, and deleterious effects associated therewith, during the manufacture of a MEMS device. In some embodiments, methods provided herein comprise etching a sacrificial material in the presence of an ionized gas, wherein the ionized gas neutralizes charged species produced during the etching process and allows for their removal along with other etching byproducts. Also disclosed are microelectromechanical devices formed by methods of the invention, and visual display devices incorporating such devices.

    摘要翻译: 本文提供了在制造MEMS器件期间防止表面相关电荷的形成和累积以及与其相关的有害影响的方法。 在一些实施例中,本文提供的方法包括在存在电离气体的情况下蚀刻牺牲材料,其中电离气体中和在蚀刻工艺期间产生的带电物质,并允许其与其它蚀刻副产物一起去除。 还公开了通过本发明的方法形成的微机电装置以及包括这种装置的视觉显示装置。

    Electromechanical devices having support structures
    5.
    发明授权
    Electromechanical devices having support structures 有权
    具有支撑结构的机电装置

    公开(公告)号:US08344470B2

    公开(公告)日:2013-01-01

    申请号:US13099221

    申请日:2011-05-02

    IPC分类号: H01L31/0232

    摘要: Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, both rivets and posts may be used. In certain embodiments, these support structures are formed from rigid inorganic materials, such as metals or oxides. In certain embodiments, etch barriers may also be deposited to facilitate the use of materials in the formation of support structures which are not selectively etchable with respect to other components within the MEMS device.

    摘要翻译: MEMS器件的实施例包括通过间隙与导电固定层间隔开的导电可移动层,并且由导电可移动层中的上凹部的刚性支撑结构或铆钉支撑,或由导电可移动层中的凹陷下方的柱支撑。 在某些实施例中,可以使用铆钉和柱。 在某些实施方案中,这些支撑结构由诸如金属或氧化物的刚性无机材料形成。 在某些实施例中,还可以沉积蚀刻阻挡层以促进材料在形成相对于MEMS器件内的其它部件不能选择性蚀刻的支撑结构的形成中的使用。

    Analog interferometric modulator device with electrostatic actuation and release
    10.
    发明授权
    Analog interferometric modulator device with electrostatic actuation and release 失效
    具有静电驱动和释放的模拟干涉式调制器装置

    公开(公告)号:US07649671B2

    公开(公告)日:2010-01-19

    申请号:US11444567

    申请日:2006-06-01

    IPC分类号: G02B26/00 G02B26/08 G02F1/29

    CPC分类号: G02B26/001

    摘要: A microelectromechanical system (MEMS) device includes a first electrode, a second electrode electrically insulated from the first electrode, and a third electrode electrically insulated from the first electrode and the second electrode. The MEMS device also includes a support structure which separates the first electrode from the second electrode and a reflective element located and movable between a first position and a second position. The reflective element is in contact with a portion of the device when in the first position and is not in contact with the portion of the device when in the second position. An adhesive force is generated between the reflective element and the portion when the reflective element is in the first position. Voltages applied to the first electrode, the second electrode, and the third electrode at least partially reduce or counteract the adhesive force.

    摘要翻译: 微机电系统(MEMS)装置包括第一电极,与第一电极电绝缘的第二电极和与第一电极和第二电极电绝缘的第三电极。 MEMS器件还包括将第一电极与第二电极分开的支撑结构和位于第一位置和第二位置之间并可移动的反射元件。 反射元件在处于第一位置时与装置的一部分接触,并且当处于第二位置时不与装置的部分接触。 当反射元件处于第一位置时,在反射元件和部分之间产生粘合力。 施加到第一电极,第二电极和第三电极的电压至少部分地减小或抵消粘附力。