Vertical power MOS device with increased ruggedness and method of
fabrication
    1.
    发明授权
    Vertical power MOS device with increased ruggedness and method of fabrication 失效
    垂直功率MOS器件具有增强的耐用性和制造方法

    公开(公告)号:US5374571A

    公开(公告)日:1994-12-20

    申请号:US72802

    申请日:1993-06-07

    摘要: A semiconductor device of improved ruggedness is provided which comprises a semiconductor substrate having a region of a first conductivity type on a major surface thereof; a first base region of opposite conductivity type formed selectively within said regions of first conductivity type; a second base region of opposite conductivity type formed selectively within said first base region and having a higher impurity concentration than that of said first base region; a source region of one conductivity type formed within said first and second base regions and overlying said second base region; and a polysilicon gate electrode opposed to a channel region with a gate insulating layer interposed therebetween; wherein the second base region and the source region are formed substantially entirely within the first base region; the second base region is smaller in depth than the first base region and is formed at a distance sufficiently close to the channel region to effectively reduce parasitic resistance in the first base region, the lateral edges of the second base region being substantially aligned with the lateral edges of the gate electrode; the first base region and the source region are formed by sequential implantation through the polysilicon gate electrode region using edges of the polysilicon gate electrode as a self-aligned mask, followed by implantation of the second base region without substantial lateral diffusion using the polysilicon gate electrode as a mask; and the polysilicon gate electrode is of a thickness sufficient to mask for selected depths of implantation in the first base region.

    摘要翻译: 提供了一种具有改善的耐用性的半导体器件,其包括在其主表面上具有第一导电类型的区域的半导体衬底; 在所述第一导电类型的区域内选择性地形成相反导电类型的第一基区; 选择性地形成在所述第一基极区内并具有比所述第一基极区更高的杂质浓度的相反导电类型的第二基极区; 在所述第一和第二基极区域内形成并覆盖所述第二基极区域的一种导电类型的源极区域; 以及与沟槽区域相对的多晶硅栅电极,栅极绝缘层插入其间; 其中所述第二基极区域和所述源极区域基本上完全形成在所述第一基极区域内; 所述第二基极区域的深度小于所述第一基极区域,并且形成在足够接近所述沟道区域的距离处,以有效地减小所述第一基极区域中的寄生电阻,所述第二基极区域的侧向边缘基本上与所述侧向 栅电极的边缘; 通过使用多晶硅栅极的边缘作为自对准掩模通过多晶硅栅电极区域的顺序注入形成第一基极区域和源极区域,然后使用多晶硅栅极电极注入第二基极区域而没有实质的横向扩散 作为面具; 并且所述多晶硅栅电极具有足以掩盖所述第一基极区域中所选择的深度植入的厚度。

    Vertical power MOS device with increased ruggedness and method of
fabrication
    2.
    发明授权
    Vertical power MOS device with increased ruggedness and method of fabrication 失效
    垂直功率MOS器件具有增强的耐用性和制造方法

    公开(公告)号:US5268586A

    公开(公告)日:1993-12-07

    申请号:US842853

    申请日:1992-02-25

    摘要: A semiconductor device of improved ruggedness is provided which comprises a semiconductor substrate having a region of a first conductivity type on a major surface thereof; a first base region of opposite conductivity type formed selectively within said regions of first conductivity type; a second base region of opposite conductivity type formed selectively within said first base region and having a higher impurity concentration than that of said first base region; a source region of one conductivity type formed within said first and second base regions and overlying said second base region; and a polysilicon gate electrode opposed to a channel region with a gate insulating layer interposed therebetween; wherein the second base region and the source region are formed substantially entirely within the first base region; the second base region is smaller in depth than the first base region and is formed at a distance sufficiently close to the channel region to effectively reduce parasitic resistance in the first base region, the lateral edges of the second base region being substantially aligned with the lateral edges of the gate electrode; the first base region and the source region are formed by sequential implantation through the polysilicon gate electrode region using the polysilicon gate electrode as a self-aligned mask, followed by implantation of the second base region without substantial lateral diffusion using the polysilicon gate electrode as a mask; and the polysilicon gate electrode is of a thickness sufficient to mask for selected depths of implantation in the first base region.

    摘要翻译: 提供了一种具有改善的耐用性的半导体器件,其包括在其主表面上具有第一导电类型的区域的半导体衬底; 在所述第一导电类型的区域内选择性地形成相反导电类型的第一基区; 选择性地形成在所述第一基极区内并具有比所述第一基极区更高的杂质浓度的相反导电类型的第二基极区; 在所述第一和第二基极区域内形成并覆盖所述第二基极区域的一种导电类型的源极区域; 以及与沟槽区域相对的多晶硅栅电极,栅极绝缘层插入其间; 其中所述第二基极区域和所述源极区域基本上完全形成在所述第一基极区域内; 所述第二基极区域的深度小于所述第一基极区域,并且形成在足够接近所述沟道区域的距离处,以有效地减小所述第一基极区域中的寄生电阻,所述第二基极区域的侧向边缘基本上与所述侧向 栅电极的边缘; 通过使用多晶硅栅电极作为自对准掩模通过多晶硅栅极电极区域的顺序注入形成第一基极区域和源极区域,然后使用多晶硅栅极电极注入第二基极区域,而不会实质上横向扩散 面具; 并且所述多晶硅栅电极具有足以掩盖所述第一基极区域中所选择的深度植入的厚度。

    Lateral silicon carbide semiconductor device having a drift region with
a varying doping level
    4.
    发明授权
    Lateral silicon carbide semiconductor device having a drift region with a varying doping level 失效
    具有具有改变掺杂水平的漂移区域的横向碳化硅半导体器件

    公开(公告)号:US6011278A

    公开(公告)日:2000-01-04

    申请号:US959346

    申请日:1997-10-28

    摘要: A lateral silicon carbide (SiC) semiconductor device includes a SIC substrate of a first conductivity type, a SiC epitaxial layer of the first conductivity type on the substrate and a SiC surface layer on the SiC epitaxial layer. The SiC surface layer has a SiC first region of the first conductivity type, a SiC lateral drift region of a second conductivity type opposite to that of the first conductivity type adjacent the first region and forming a p-n junction therewith, and a SiC second region of the second conductivity type spaced apart from the first region by the drift region. By providing the drift region with a variable doping level which increases in a direction from the first region to the second region, compact SiC semiconductor devices such as high-voltage diodes or MOSFETs can be formed which can operate at high voltages, high temperatures and high frequencies, thus providing a substantial advantage over known devices.

    摘要翻译: 横向碳化硅(SiC)半导体器件包括第一导电类型的SIC衬底,衬底上的第一导电类型的SiC外延层和SiC外延层上的SiC表面层。 SiC表面层具有第一导电类型的SiC第一区域,与第一区域相邻的第二导电类型的第二导电类型的SiC侧向漂移区域并与其形成pn结,以及SiC第二区域 所述第二导电类型与所述第一区域间隔开所述漂移区域。 通过提供具有从第一区域到第二区域的方向增加的可变掺杂水平的漂移区域,可以形成可在高电压,高温和高温下工作的紧凑的SiC半导体器件,例如高压二极管或MOSFET 频率,因此比已知装置提供了显着的优点。

    Method for improving inversion layer mobility in a silicon carbide metal-oxide semiconductor field-effect transistor
    6.
    发明授权
    Method for improving inversion layer mobility in a silicon carbide metal-oxide semiconductor field-effect transistor 有权
    一种提高碳化硅金属氧化物半导体场效应晶体管的反层迁移率的方法

    公开(公告)号:US06559068B2

    公开(公告)日:2003-05-06

    申请号:US09894089

    申请日:2001-06-28

    IPC分类号: H01L21469

    CPC分类号: H01L21/049

    摘要: A method for improving inversion layer mobility in a silicon carbide metal-oxide semiconductor field-effect transistor (MOSFET) is provided. Specifically, the present invention provides a method for applying an oxide layer to a silicon carbide substrate so that the oxide-substrate interface of the resulting SiC MOSFET is improved. The method includes forming the oxide layer in the presence of metallic impurities.

    摘要翻译: 提供了一种用于提高碳化硅金属氧化物半导体场效应晶体管(MOSFET)中的反型层迁移率的方法。 具体地,本发明提供了一种将氧化物层施加到碳化硅衬底上,使得所得SiC MOSFET的氧化物 - 衬底界面得到改善的方法。 该方法包括在金属杂质存在下形成氧化物层。

    Nonvolatile trench memory device and self-aligned method for making such
a device
    7.
    发明授权
    Nonvolatile trench memory device and self-aligned method for making such a device 失效
    非易失性沟槽存储器件和用于制造这种器件的自对准方法

    公开(公告)号:US5229312A

    公开(公告)日:1993-07-20

    申请号:US867595

    申请日:1992-04-13

    CPC分类号: H01L27/11556 H01L27/115

    摘要: A nonvolatile trench memory device such as an EEPROM is made by a method which permits an extremely compact and simple configuration due to the use of precise and efficient self-alignment techniques. Oxide-capped polysilicon mesas, formed integrally with the control gates, form the word lines of the memory device, while drain metallization lines contact drain regions of the device and extend over the oxide-capped word lines to form the bit lines. The resulting device is extremely compact, since the self-aligned process permits tighter tolerances and the unique polysilicon mesa/oxide cap construction permits a more compact configuration.

    High voltage differential sensor having a capacitive attenuator
    9.
    发明授权
    High voltage differential sensor having a capacitive attenuator 失效
    具有电容衰减器的高压差动传感器

    公开(公告)号:US5485292A

    公开(公告)日:1996-01-16

    申请号:US439617

    申请日:1995-05-12

    CPC分类号: G01R15/06

    摘要: A high-voltage differential sensor includes an attenuator formed of two matched monolithic capacitance divider networks. Each divider network is formed of a series connection of monolithically integrated capacitors, which together generate an attenuated differential signal from a high-voltage differential input signal. The attenuated differential signal from the capacitance divider networks is then amplified and fed to a comparator, which generates a first output level when the high-voltage differential input signal is above a selected level, and generates a second output level when the high-voltage differential input signal is below the selected level. By using monolithically integrated capacitors in the divider networks of the attenuator, a simple, compact, low power, high performance high-voltage differential sensor is obtained.

    摘要翻译: 高压差分传感器包括由两个匹配的单片电容分压器网络形成的衰减器。 每个分压网络由单片集成电容器的串联连接形成,它们一起从高电压差分输入信号产生衰减的差分信号。 来自电容分压器网络的衰减的差分信号然后被放大并馈送到比较器,当比较器高电压差分输入信号高于选定电平时,该比较器产生第一输出电平,并且当高压差分 输入信号低于所选电平。 通过在衰减器的分压网络中使用单片集成电容器,可以获得简单,紧凑,低功耗,高性能的高压差分传感器。