摘要:
A method for writing cells in a memory which reduces errors caused by depleted memory array cells being turned on even when not selected. In the method, nonselected bit lines and nonselected word lines are biased so that the threshold voltage of the nonselected cells increases. In particular, the nonselected bit lines are left floating and the nonselected word lines are set to a zero voltage. Appropriate potentials are applied to the selected word line, selected bit line, and selected source line in order to program the selected cell.
摘要:
In a flash-EEPROM array, the cells in each row are grouped into pairs connected to the same diffused source line and to two different diffused bit lines, and the adjacent pairs of cells are spaced so that, in each row, only one cell is connected to a respective diffused bit line. The array presents global bit lines in the form of metal lines, and each connected to a plurality of diffused local bit lines, at least one for each sector. For each sector and each global bit line, there are provided two diffused local bit lines connected to the same respective global bit line by selection transistors so that only one local bit line is biased each time.
摘要:
To reduce the number of depleted cells and the errors caused thereby, the memory array includes groups of control transistors corresponding to groups of memory cells. The control transistors of each group are NMOS transistors having the drain terminal connected to a control line. Each of the control transistors corresponds to a row portion of the memory array. Each control transistor has a control gate connected to a respective word line and a source region connected by a respective source line to the source regions of the memory cells in the same row and group.
摘要:
To reduce read and write errors caused by depleted memory array cells being turned on even when not selected, the nonselected memory cells are so biased as to present a floating terminal and a terminal at a positive voltage with respect to the substrate region. The threshold voltage of nonselected cells (i.e., the minimum voltage between the gate and source terminals for the cell to be turned on) increases due to a "body effect", whereby the threshold voltage depends on the voltage drop between the source terminal and the substrate. The source line of a selected cell is biased to a positive value greater than that of the bit line of the selected cell. Methods for reading, writing and erasing cells using certain voltage levels are disclosed.
摘要:
To reduce the supply voltage of a nonvolatile memory, a read reference signal is generated having a reference threshold value ranging between the maximum permissible threshold value for erased cells and the minimum permissible threshold value for written cells. To avoid reducing the maximum supply voltage, the characteristic of the read reference signal is composed of two portions: a first portion, ranging between the threshold value and a predetermined value, presents a slope lower than that of the characteristic of the memory cells and a second portion, as of the predetermined value of the supply voltage, presents the same slope as the characteristics of memory cells. The shifted-threshold, two-slope characteristic is achieved by means of virgin cells so biased as to see bias voltages lower than the supply voltage.
摘要:
An electrically erasable and programmable non-volatile memory device comprises at least one memory sector comprising an array of memory cells arranged in rows and first-level columns, the first-level columns being grouped together in groups of first-level columns each coupled to a respective second-level column, first-level selection means for selectively coupling one first-level column for each group to the respective second-level column, second-level selection means for selecting one of the second-level columns, first direct memory access test means activatable in a first test mode for directly coupling a selected memory cell of the array to a respective output terminal of the memory device, redundancy columns of redundancy memory cells for replacing defective columns of memory cells, and a redundancy control circuit comprising defective-address storage means for storing addresses of the defective columns and activating respective redundancy columns when the defective columns are addressed. The redundancy control circuit comprises second direct memory access test means activatable in a second test mode together with the first direct memory access test means for directly coupling memory elements of the defective-address storage means to respective second-level columns of the array, whereby the memory elements of the defective-address storage means can be directly coupled to output terminals of the memory device.
摘要:
The invention relates to a voltage multiplier such as a charge pump circuit. The circuit is realized by a plurality of cascade connected voltage gain stages, each stage comprising a first and a second cell each receiving a pair of clock phase signals and comprising a pair of MOS transistors having first and second conduction terminals and a control terminal. These transistors have their first conduction terminals connected together and to a voltage reference; while the control terminals of each transistor are connected to the second conduction terminal of the other transistor of the same cell. Moreover, the second conduction terminal of the first transistor receives a first phase signal via a first coupling capacitor, and the second conduction terminal of the second transistor receives a second phase signals via a first pumping capacitor. Third and fourth cells are provided having the same structure as the first and the second cell. The third cell is coupled to the first cell by a series connection between their corresponding coupling capacitors and their corresponding pumping capacitors, respectively. The fourth cell is coupled to the second cell by a series connection between their corresponding coupling capacitors and by their corresponding pumping capacitors, respectively.
摘要:
A method for setting the threshold voltage of a reference memory cell of a memory device is described, the reference memory cell being used as a reference current generator for generating a reference current which is compared by a sensing circuit of the memory device with currents sunk by memory cells to be sensed, belonging to a memory matrix of the memory device. The method comprises a first step in which the reference memory cell is submitted to a change in its threshold voltage, and a second step in which the threshold voltage of the reference memory cell is verified. The second step provides for performing a sensing of the reference memory cell using a memory cell with known threshold voltage belonging to the memory matrix as a reference current generator for generating a current which is compared by the sensing circuit with the current sunk by the reference memory cell.
摘要:
A memory cell reading circuit has a reference cell bit line and a matrix cell bit line connected to a supply voltage through respective loads and are furthermore connected by normally-off equalization transistors which are enabled by a first clock signal. The bit lines are further connected by normally-off resistive equalization transistors whose resistance is significant in conducting conditions. The equalization transistors are enabled by a first clock signal and the resistive equalization transistors are enabled by a second clock signal which has a duration that extends longer than the first clock signal. The memory cell reading circuit decreases the "read" time required for a memory cell, such as an EPROM cell, as compared to reading circuits previously used.
摘要:
A sense amplifier circuit for reading and verifying the contents of non-volatile memory cells in a semiconductor integrated device including a memory matrix of electrically programmable and erasable cells. The circuit includes a sense amplifier which has a first input connected to a reference load column incorporating a reference cell, and a second input connected to a second matrix load column incorporating a cell of the memory matrix. The circuit also includes a small matrix of reference cells connected, in parallel with one another, in the reference load column. Also provided is a double current mirror having a first mirror column which is connected to a node in the reference load column connected to the first input, and a second mirror column coupled to the second matrix load column to locally replicate, on the second mirror column, the electric potential at the node during a load equalizing step.