摘要:
A transducer (800) is provided where a membrane (830) is formed over a front substrate (615); and a piezoelectric layer (820) is formed over the membrane (830) at an active portion (821) and peripheral portions located adjacent the active portion (821). A patterned conductive layer including first and second electrodes (840, 845) is formed over the piezoelectric layer (820). Further, a back substrate structure is provided having supports (822, 824) located at the peripheral portions adjacent the active portion (821). The height (826) of the supports (822, 824) is greater than a combined height (828) of the patterned piezoelectric layer and the patterned conductive layer. Many transducers may be connected to form an array, where a controller may be provided for controlling the array, such as steering a beam of the array, and processing signals received by the array, for presence or motion detection and/or imaging, for example.
摘要:
A transducer (800) is provided where a membrane (830) is formed over a front substrate (615); and a piezoelectric layer (820) is formed over the membrane (830) at an active portion (821) and peripheral portions located adjacent the active portion (821). A patterned conductive layer including first and second electrodes (840, 845) is formed over the piezoelectric layer (820). Further, a back substrate structure is provided having supports (822, 824) located at the peripheral portions adjacent the active portion (821). The height (826) of the supports (822, 824) is greater than a combined height (828) of the patterned piezoelectric layer and the patterned conductive layer. Many transducers may be connected to form an array, where a controller may be provided for controlling the array, such as steering a beam of the array, and processing signals received by the array, for presence or motion detection and/or imaging, for example.
摘要:
A semiconductor chip (CHP) and a semiconductor chip driver (RDR) communicate with each other in a wireless fashion. To that end, the semiconductor chip driver (RDR) generates an energy flux (FX1; FX2) that is concentrated on a transducer area (AT1; AT2) of the semiconductor chip (CHP). In the semiconductor chip (CHP), a wireless communication interlace (WCI) provides an electrical signal to a signal processing circuit in response to the energy flux (FX1; FX2). The signal processing circuit occupies an area (AS) that is substantially separate from the transducer area (AT1; AT2) on which the energy flux (FX1; FX2) is concentrated.
摘要翻译:半导体芯片(CHP)和半导体芯片驱动器(RDR)以无线方式彼此通信。 为此,半导体芯片驱动器(RDR)产生集中在半导体芯片(CHP)的换能器区域(AT 1; AT 2)上的能量通量(FX1; FX2)。 在半导体芯片(CHP)中,无线通信交错(WCI)响应于能量通量(FX1; FX2)向信号处理电路提供电信号。 信号处理电路占据与能量通量(FX1; FX2)集中的换能器区域(AT 1; AT 2)基本分离的区域(AS)。
摘要:
Consistent with an example embodiment a, DA-converter system comprises the cascade of a multi-bit sigma-delta modulator and a DA-converter. The quantization noise of the sigma-delta modulator is isolated; the isolated quantization noise is word-length reduced in a second noise shaper with frequency independent signal transfer function and the isolated word-length reduced quantization noise is subtracted from the quantization noise of said cascade. In another embodiment, the isolated quantization noise is amplified before and attenuated after the second noise shaper.
摘要:
A mixing system for mixing a plurality of digital audio signals, at least one of which is a noise-shaped oversampled digital audio signal having a predetermined sampling frequency and bit resolution, said system comprising a summing unit for computing a sum signal of said plurality of input signals; a clipping unit having an input for receiving said sum signal, said clipping unit clipping said sum signal; further comprising a filter unit between the input terminals and the clipping unit, arranged to selectively suppress frequency components outside an audio frequency band from the sum signal; and a converter unit arranged to receive a clipped sum signal from the clipping unit and to convert said clipped sum signal into an output signal of said bit resolution, using noise-shaping, the clipping unit being arranged to limit the input values to a range of values that the converter is able to handle in a stable manner.
摘要:
A mixing system for mixing a plurality of digital audio signals, at least one of which is a noise-shaped oversampled digital audio signal having a predetermined sampling frequency and bit resolution, said system comprising a summing unit for computing a sum signal of said plurality of input signals; a clipping unit having an input for receiving said sum signal, said clipping unit clipping said sum signal; further comprising a filter unit between the input terminals and the clipping unit, arranged to selectively suppress frequency components outside an audio frequency band from the sum signal; and a converter unit arranged to receive a clipped sum signal from the clipping unit and to convert said clipped sum signal into an output signal of said bit resolution, using noise-shaping, the clipping unit being arranged to limit the input values to a range of values that the converter is able to handle in a stable manner.
摘要:
Sigma-delta modulation is provided, comprising feeding an input signal to a first SDM, subtracting the output of the first SDM from the input signal, filtering the output of the subtracting to obtain a filtered signal, delaying the input signal, adding the filtered signal to the delayed signal, feeding the output of the adder to a second SDM and providing the output of the second SDM. The first SDM in combination with the subtracting and filtering delivers a correction signal which, by adding it to the input signal, reduces the distortion in the second SDM, which second SDM performs in fact the sigma-delta modulation of the device.
摘要:
An integration substrate for a system in package comprises a through-substrate via and a trench capacitor wherein with a trench filling that includes at least four electrically conductive capacitor-electrode layers in an alternating arrangement with dielectric layers. —The capacitor-electrode layers are alternatingly connected to a respective one of two capacitor terminals provided on the first or second substrate side. The trench capacitor and the through-substrate via are formed in respective trench openings and via openings in the semiconductor substrate, which have an equal lateral extension exceeding 10 micrometer. This structure allows, among other advantages, a particularly cost-effective fabrication of the integration substrate because the via openings and the trench openings in the substrate can be fabricated simultaneously.
摘要:
An audio coding scheme allowing PCM signal to lossless DSD signal expansion for next generation optical disc formats. The method of encoding an input DSD signal includes up-sampling a corresponding PCM signal to the DSD sample rate. Then a set of loop filter parameters for a noise-shaping loop of a sigma-delta modulator are generated, either using a random starting condition of the sigma-delta modulator or including synchronization parameters. This will allow a decoder to regenerate an almost perfect signal, but still it needs a correction signal to be able to bit identically regenerate the DSD input signal. Therefore, a correction signal is generated based on a difference between a sigma-delta modulated version of the up-sampled PCM signal and the input DSD signal, wherein the sigma-delta modulated version of the up-sampled PCM signal is obtained using the set of loop filter parameters. The correction signal may be adapted to be applied to the low bit PCM signal, to the up-sampled PCM signal or to the output bit stream. Finally, an expansion bit stream is generated where an encoded version of the set of loop filter parameters and an encoded version of the correction signal are included. The decoder can reproduce the original DSD signal based on the already available PCM signal and the described expansion bit stream. Thus, the coding scheme enables top quality audio with minimal storage overhead since the already available PCM signal is used in combination with an expansion bit stream. Since only an additional data stream is required to be stored on a disc, e.g. as part of an MPEG stream, DSD functionality is added to existing systems without causing compatibility problems.
摘要:
The chip (100) comprises a network of trench capacitors (102) and an inductor (114), wherein the trench capacitors (102) are coupled in parallel with a pattern of interconnects (113A,B, . . . ) that is designed so as to limit generation of eddy current induced by the inductor (114) in the interconnects (113A,B, . . . ). This allows the use of the chip (100) as a portion of a DC-DC converter, that is integrated in an assembly of a first chip and this—second chip (100). The inductor of this integrated DC-DC converter may be defined elsewhere within the assembly.