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1.
公开(公告)号:US20110006663A1
公开(公告)日:2011-01-13
申请号:US12795356
申请日:2010-06-07
申请人: Margaret L. Tuma , Joseph S. Collura , Henry Helvajian , Michael D. Pocha , Glenn A. Meyer , Charles F. McConaghy , Barry L. Olsen , William W. Hansen
发明人: Margaret L. Tuma , Joseph S. Collura , Henry Helvajian , Michael D. Pocha , Glenn A. Meyer , Charles F. McConaghy , Barry L. Olsen , William W. Hansen
IPC分类号: H01K1/14
摘要: An ultraminiature light source using a double-spiral shaped tungsten filament includes end contact portions which are separated to allow for radial and length-wise unwinding of the spiral. The double-spiral filament is spaced relatively far apart at the end portions thereof so that contact between portions of the filament upon expansion is avoided. The light source is made by fabricating a double-spiral ultraminiature tungsten filament from tungsten foil and housing the filament in a ceramic package having a reflective bottom and a well wherein the filament is suspended. A vacuum furnace brazing process attaches the filament to contacts of the ceramic package. Finally, a cover with a transparent window is attached onto the top of the ceramic package by solder reflow in a second vacuum furnace process to form a complete hermetically sealed package.
摘要翻译: 使用双螺旋形钨丝的超微型光源包括端部接触部分,其被分离以允许螺旋的径向和纵向展开。 双螺旋丝在其端部处间隔相对较远,从而避免了在膨胀时细丝部分之间的接触。 光源通过从钨箔制造双螺旋超薄钨丝制成,并将灯丝容纳在具有反射底部和阱的陶瓷封装中,其中灯丝被悬挂。 真空炉钎焊工艺将灯丝连接到陶瓷封装的触点。 最后,通过在第二真空炉工艺中通过回流焊接将具有透明窗口的盖子附接到陶瓷封装的顶部,以形成完整的密封封装。
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2.
公开(公告)号:US07755292B1
公开(公告)日:2010-07-13
申请号:US11625545
申请日:2007-01-22
申请人: Margaret L. Tuma , Joseph S. Collura , Henry Helvajian , Michael D. Pocha , Glenn A. Meyer , Charles F. McConaghy , Barry L. Olsen , William W Hansen
发明人: Margaret L. Tuma , Joseph S. Collura , Henry Helvajian , Michael D. Pocha , Glenn A. Meyer , Charles F. McConaghy , Barry L. Olsen , William W Hansen
摘要: An ultraminiature light source using a double-spiral shaped tungsten filament includes end contact portions which are separated to allow for radial and length-wise unwinding of the spiral. The double-spiral filament is spaced relatively far apart at the end portions thereof so that contact between portions of the filament upon expansion is avoided. The light source is made by fabricating a double-spiral ultraminiature tungsten filament from tungsten foil and housing the filament in a ceramic package having a reflective bottom and a well wherein the filament is suspended. A vacuum furnace brazing process attaches the filament to contacts of the ceramic package. Finally, a cover with a transparent window is attached onto the top of the ceramic package by solder reflow in a second vacuum furnace process to form a complete hermetically sealed package.
摘要翻译: 使用双螺旋形钨丝的超微型光源包括端部接触部分,其被分离以允许螺旋的径向和纵向展开。 双螺旋丝在其端部处间隔相对较远,从而避免了在膨胀时细丝部分之间的接触。 光源通过从钨箔制造双螺旋超薄钨丝制成,并将灯丝容纳在具有反射底部和阱的陶瓷封装中,其中灯丝被悬挂。 真空炉钎焊工艺将灯丝连接到陶瓷封装的触点。 最后,通过在第二真空炉工艺中通过回流焊接将具有透明窗口的盖子附接到陶瓷封装的顶部,以形成完整的密封封装。
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公开(公告)号:US08264134B2
公开(公告)日:2012-09-11
申请号:US12795356
申请日:2010-06-07
申请人: Margaret L. Tuma , Joseph S. Collura , Henry Helvajian , Michael D. Pocha , Glenn A. Meyer , Charles F. McConaghy , Barry L. Olsen , William W Hansen
发明人: Margaret L. Tuma , Joseph S. Collura , Henry Helvajian , Michael D. Pocha , Glenn A. Meyer , Charles F. McConaghy , Barry L. Olsen , William W Hansen
摘要: An ultraminiature light source using a double-spiral shaped tungsten filament includes end contact portions which are separated to allow for radial and length-wise unwinding of the spiral. The double-spiral filament is spaced relatively far apart at the end portions thereof so that contact between portions of the filament upon expansion is avoided. The light source is made by fabricating a double-spiral ultraminiature tungsten filament from tungsten foil and housing the filament in a ceramic package having a reflective bottom and a well wherein the filament is suspended. A vacuum furnace brazing process attaches the filament to contacts of the ceramic package. Finally, a cover with a transparent window is attached onto the top of the ceramic package by solder reflow in a second vacuum furnace process to form a complete hermetically sealed package.
摘要翻译: 使用双螺旋形钨丝的超微型光源包括端部接触部分,其被分离以允许螺旋的径向和纵向展开。 双螺旋丝在其端部处间隔相对较远,从而避免了在膨胀时细丝部分之间的接触。 光源通过从钨箔制造双螺旋超薄钨丝制成,并将灯丝容纳在具有反射底部和阱的陶瓷封装中,其中灯丝被悬挂。 真空炉钎焊工艺将灯丝连接到陶瓷封装的触点。 最后,通过在第二真空炉工艺中通过回流焊接将具有透明窗口的盖子附接到陶瓷封装的顶部,以形成完整的密封封装。
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公开(公告)号:US06932933B2
公开(公告)日:2005-08-23
申请号:US09821918
申请日:2001-03-30
CPC分类号: B81C1/00492 , B44C1/227 , B44C1/228 , B81C2201/0133 , B81C2201/0143 , C03C23/0025
摘要: A laser direct write method creates true three dimensional structures within photocerams using an focused pulsed ultraviolet laser with a wavelength in a weakly absorbing region of the photoceram material. A critical dose of focused laser UV light selectively exposes embedded volumes of the material for subsequent selective etching. The photoceram material exposure is nonlinear with the laser fluence and the critical dose depends on the square of the per shot fluence and the number of pulses. The laser light is focused to a focal depth for selective volumetric exposure of the material within a focal volume within the remaining collateral volumes that is critically dosed for selecting etching and batch fabrication of highly defined embedded structures.
摘要翻译: 激光直接写入方法使用在光致抗蚀剂材料的弱吸收区域中具有波长的聚焦脉冲紫外激光器在光泽内产生真正的三维结构。 聚焦激光UV光的关键剂量选择性地暴露了材料的嵌入体积,用于随后的选择性蚀刻。 光泽材料暴露是非线性的,具有激光注量,临界剂量取决于每个射流注量的平方和脉冲数。 激光被聚焦到焦点深度,用于在残留的临时体积内的焦点体积内材料的选择性体积暴露,其被批量选择用于选择高度限定的嵌入结构的蚀刻和批量制造。
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公开(公告)号:US08410660B2
公开(公告)日:2013-04-02
申请号:US12686989
申请日:2010-01-13
IPC分类号: H01L41/08
CPC分类号: B29C67/0048 , B01J19/00 , B01L3/502707 , B41J2/00 , B81B2203/0338 , B81C1/00 , B81C1/00634 , C03C23/00 , G03F7/00 , Y10T29/42
摘要: A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.
摘要翻译: 使用用于将器件嵌入可光可陶瓷陶瓷体积内的光学结构化工艺步骤来处理可光电陶瓷,该器件可以包括化学,机械,电子,电磁,光学和声学设备中的一种或多种,所有这些都部分地通过在 陶瓷或通过陶瓷体的表面端口设置器件材料,使用内部连接和表面接口互连这些器件。
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公开(公告)号:US20110169375A1
公开(公告)日:2011-07-14
申请号:US12686989
申请日:2010-01-13
CPC分类号: B29C67/0048 , B01J19/00 , B01L3/502707 , B41J2/00 , B81B2203/0338 , B81C1/00 , B81C1/00634 , C03C23/00 , G03F7/00 , Y10T29/42
摘要: A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.
摘要翻译: 使用用于将器件嵌入可光可陶瓷陶瓷体积内的光学结构化工艺步骤来处理可光电陶瓷,该器件可以包括化学,机械,电子,电磁,光学和声学设备中的一种或多种,所有这些都部分地通过在 陶瓷或通过陶瓷体的表面端口设置器件材料,使用内部连接和表面接口互连这些器件。
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公开(公告)号:US08369070B2
公开(公告)日:2013-02-05
申请号:US12686978
申请日:2010-01-13
IPC分类号: H05K5/00
CPC分类号: H05K3/101 , B01J19/0093 , B01J2219/00824 , B01J2219/00835 , B01J2219/00853 , B01J2219/00941 , B01J2219/00948 , B01L3/502707 , B01L2300/12 , B81B2201/051 , B81B2203/0338 , B81C1/00634 , G02B2006/12035 , G02B2006/12171 , H01P3/121 , H05K1/0306 , H05K1/16 , H05K1/162 , H05K1/165 , H05K3/0023 , Y10T29/49117
摘要: A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electrical, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.
摘要翻译: 使用用于将装置嵌入可光可陶瓷陶瓷体积内的光学结构化工艺步骤来处理可光刻陶瓷,所述装置可以包括化学,机械,电气,电磁,光学和声学装置中的一种或多种,所有这些都部分地通过在 陶瓷或通过陶瓷体的表面端口设置器件材料,使用内部连接和表面接口互连这些器件。
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公开(公告)号:US20110170241A1
公开(公告)日:2011-07-14
申请号:US12686978
申请日:2010-01-13
CPC分类号: H05K3/101 , B01J19/0093 , B01J2219/00824 , B01J2219/00835 , B01J2219/00853 , B01J2219/00941 , B01J2219/00948 , B01L3/502707 , B01L2300/12 , B81B2201/051 , B81B2203/0338 , B81C1/00634 , G02B2006/12035 , G02B2006/12171 , H01P3/121 , H05K1/0306 , H05K1/16 , H05K1/162 , H05K1/165 , H05K3/0023 , Y10T29/49117
摘要: A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electrical, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.
摘要翻译: 使用用于将装置嵌入可光可陶瓷陶瓷体积内的光学结构化工艺步骤来处理可光刻陶瓷,所述装置可以包括化学,机械,电气,电磁,光学和声学装置中的一种或多种,所有这些都部分地通过在 陶瓷或通过陶瓷体的表面端口设置器件材料,使用内部连接和表面接口互连这些器件。
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公开(公告)号:US09481571B2
公开(公告)日:2016-11-01
申请号:US14564406
申请日:2014-12-09
申请人: Henry Helvajian
发明人: Henry Helvajian
CPC分类号: B81C1/00341 , B01J19/0093 , B01J2219/00788 , B01J2219/00835 , B01L3/502707 , B01L3/50273 , B01L3/502738 , B01L2300/0654 , B01L2300/0874 , B01L2300/12 , B01L2400/0439 , B01L2400/0478 , B01L2400/0633 , B28B1/001 , B33Y10/00 , B33Y80/00 , B81B2201/051 , B81B2203/0338 , B81C1/00634 , C06B21/00 , F16L55/00 , G03F7/70216 , Y10T29/49117
摘要: A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.
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公开(公告)号:US20110171068A1
公开(公告)日:2011-07-14
申请号:US12686972
申请日:2010-01-13
申请人: Henry Helvajian
发明人: Henry Helvajian
CPC分类号: B81C1/00341 , B01J19/0093 , B01J2219/00788 , B01J2219/00835 , B01L3/502707 , B01L3/50273 , B01L3/502738 , B01L2300/0654 , B01L2300/0874 , B01L2300/12 , B01L2400/0439 , B01L2400/0478 , B01L2400/0633 , B28B1/001 , B33Y10/00 , B33Y80/00 , B81B2201/051 , B81B2203/0338 , B81C1/00634 , C06B21/00 , F16L55/00 , G03F7/70216 , Y10T29/49117
摘要: A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.
摘要翻译: 使用用于将器件嵌入可光可陶瓷陶瓷体积内的光学结构化工艺步骤来处理可光电陶瓷,该器件可以包括化学,机械,电子,电磁,光学和声学设备中的一种或多种,所有这些都部分地通过在 陶瓷或通过陶瓷体的表面端口设置器件材料,使用内部连接和表面接口互连这些器件。
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