利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

11 条记录 (耗时 0.016 秒)

    Method for fabricating a magnetic transducer using a slurry with spherical particles for CMP-assisted photoresist lift-off
    5.
    发明申请
    Method for fabricating a magnetic transducer using a slurry with spherical particles for CMP-assisted photoresist lift-off 失效

    公开(公告)号：US20060025057A1

    公开(公告)日：2006-02-02

    申请号：US11222611

    申请日：2005-09-09

    申请人： Marie-Claire Cyrille ,  Frederick Dill ,  Jui-Lung Li

    发明人： Marie-Claire Cyrille ,  Frederick Dill ,  Jui-Lung Li

    IPC分类号： B24B1/00

    CPC分类号： B82Y25/00 ,  B82Y40/00 ,  H01F41/308 ,  Y10T29/49032

    摘要： A method is described which uses a CMP slurry with an abrasive of spherical particles to lift-off photoresist used in the patterning of the sensor for a magnetic transducer. The spherical particles, preferably less than 0.015 microns, are preferably silica, alumina, titania or zirconia with colloidal silica being preferred. An alternative method of fabricating a CPP sensor structure according to the invention deposits a dielectric or CMP resistant metal over the hard bias structure. The CMP-resistant metal is preferably selected from the group consisting of rhodium, chromium, vanadium and platinum. A CMP resistant mask deposited over the dielectric or CMP-resistant metal can include an optional adhesion layer such as tantalum followed by a DLC layer. The CMP-assisted lift-off of the photoresist and the excess materials is executed at this point. The photoresist used to protect the selected area of the sensor structure is lifted-off using the slurry.

    Method for fabricating a magnetic transducer using a slurry with spherical particles for CMP-assisted photoresist lift-off
    6.
    发明申请
    Method for fabricating a magnetic transducer using a slurry with spherical particles for CMP-assisted photoresist lift-off 审中-公开
    使用具有用于CMP辅助光致抗蚀剂剥离的球形颗粒的浆料制造磁换能器的方法

    公开(公告)号：US20060025053A1

    公开(公告)日：2006-02-02

    申请号：US10909127

    申请日：2004-07-30

    申请人： Marie-Claire Cyrille ,  Frederick Dill ,  Jui-Lung Li

    发明人： Marie-Claire Cyrille ,  Frederick Dill ,  Jui-Lung Li

    IPC分类号： B24B1/00

    CPC分类号： B82Y25/00 ,  B82Y40/00 ,  H01F41/308 ,  Y10T29/49032

    摘要： A method is described which uses a CMP slurry with an abrasive of spherical particles to lift-off photoresist used in the patterning of the sensor for a magnetic transducer. The spherical particles are preferably silica, alumina, titania or zirconia with colloidal silica being preferred. The size of the particle is preferably less than 0.015 microns. The pH is preferably alkaline and even more preferably with a pH of about 10-11. In a method according to the invention a CPP sensor structure width or height is defined according to the prior art by removing excess sensor material at opposite sides of the sensor structure to form voids to define the track width or stripe height. The photoresist used to protect the selected area of the sensor structure is lifted-off using the slurry.

    摘要翻译： 描述了一种方法，其使用具有球形颗粒磨料的CMP浆料来剥离用于磁传感器的传感器的图案化中使用的光致抗蚀剂。 球形颗粒优选为二氧化硅，氧化铝，二氧化钛或具有胶体二氧化硅的氧化锆。 颗粒的尺寸优选小于0.015微米。 pH优选为碱性，甚至更优选pH为约10-11。 在根据本发明的方法中，根据现有技术通过在传感器结构的相对侧移除多余的传感器材料来形成CPP传感器结构的宽度或高度，以形成空隙以限定轨迹宽度或条纹高度。 用于保护传感器结构的选定区域的光致抗蚀剂使用浆料被剥离。

    Method of forming a read sensor using photoresist structures without undercuts which are removed using chemical-mechanical polishing (CMP) lift-off processes
    8.
    发明申请
    Method of forming a read sensor using photoresist structures without undercuts which are removed using chemical-mechanical polishing (CMP) lift-off processes 审中-公开
    使用光刻胶结构形成读取传感器的方法，而不使用化学机械抛光（CMP）剥离工艺除去底切

    公开(公告)号：US20050067374A1

    公开(公告)日：2005-03-31

    申请号：US10675697

    申请日：2003-09-30

    申请人： Ananda Baer ,  Marie-Claire Cyrilla ,  Frederick Dill ,  Benjamin Wang ,  Charngye Hwang ,  Mustafa Pinarbasi

    发明人： Ananda Baer ,  Marie-Claire Cyrilla ,  Frederick Dill ,  Benjamin Wang ,  Charngye Hwang ,  Mustafa Pinarbasi

    IPC分类号： G11B5/31 ,  G11B5/39 ,  H01L43/08 ,  B44C1/22

    CPC分类号： G11B5/3903 ,  G11B5/3163

    摘要： A method of making a read sensor which defines its stripe height before its trackwidth using photoresist layers formed without undercuts is disclosed. The photoresist layers are removed using chemical-mechanical polishing (CMP) lift-off techniques instead of using conventional solvents. In particular, a first photoresist layer is formed in a central region over a plurality of read sensor layers. End portions of the read sensor layers around the first photoresist layer are removed by ion milling to define the stripe height for the read sensor. Next, insulator layers are deposited where the end portions of the read sensor layers were removed. The first photoresist layer is then removed through mechanical interaction with a CMP pad. In subsequently defining the trackwidth for the read sensor, a second photoresist layer is formed in a central region over the remaining read sensor layers. End portions of the read sensor layers around the second photoresist layer are then removed by ion milling to define the trackwidth for the read sensor. Next, hard bias and lead layers are deposited where the end portions of the read sensor layers were removed. The second photoresist layer is then removed through mechanical interaction with the CMP pad. Preferably, protective layers (e.g. carbon) between the photoresist layers and the read sensor layers are formed prior to photoresist removal. Thus, problems including those inherent with use of photoresist structures having undercuts are eliminated.

    摘要翻译： 公开了一种制造读取传感器的方法，该读取传感器在其没有底切形成的光致抗蚀剂层之前在其轨道宽度之前限定其条纹高度。 使用化学机械抛光（CMP）剥离技术而不是使用常规溶剂来除去光致抗蚀剂层。 特别地，在多个读取传感器层上的中心区域中形成第一光致抗蚀剂层。 通过离子研磨去除第一光致抗蚀剂层周围的读取传感器层的端部，以限定读取传感器的条带高度。 接下来，沉积读取传感器层的端部的绝缘体层被去除。 然后通过与CMP垫的机械相互作用去除第一光致抗蚀剂层。 随后定义读取传感器的轨道宽度，在剩余的读取传感器层上的中心区域中形成第二光致抗蚀剂层。 然后通过离子铣削去除第二光致抗蚀剂层周围的读取传感器层的端部，以限定读取传感器的轨道宽度。 接下来，在读取传感器层的端部被去除的地方沉积硬偏压和引线层。 然后通过与CMP垫的机械相互作用去除第二光致抗蚀剂层。 优选地，在光致抗蚀剂去除之前形成光致抗蚀剂层和读取传感器层之间的保护层（例如碳）。 因此，消除了包括使用具有底切的光致抗蚀剂结构固有的那些问题。

    Method of making a read sensor while protecting it from electrostatic discharge (ESD) damage
    9.
    发明申请
    Method of making a read sensor while protecting it from electrostatic discharge (ESD) damage 失效
    制造读取传感器同时防止静电放电（ESD）损坏的方法

    公开(公告)号：US20050241138A1

    公开(公告)日：2005-11-03

    申请号：US10835807

    申请日：2004-04-30

    申请人： Frederick Dill ,  Meng Ding ,  Kuok Ho ,  Jordan Katine ,  Scott MacDonald ,  Huey-Ming Tzeng

    发明人： Frederick Dill ,  Meng Ding ,  Kuok Ho ,  Jordan Katine ,  Scott MacDonald ,  Huey-Ming Tzeng

    IPC分类号： G11B5/187 ,  G11B5/31 ,  G11B5/39 ,  G11B5/40

    CPC分类号： G11B5/3906 ,  G11B5/3163 ,  G11B5/40 ,  Y10T29/49021 ,  Y10T29/49043 ,  Y10T29/49048

    摘要： A method of making a read sensor while protecting it from electrostatic discharge (ESD) damage involves forming a severable shunt during the formation of the read sensor. The method may include forming a resist layer over a plurality of read sensor layers; performing lithography with use of a mask to form the resist layer into a patterned resist which exposes left and right side regions over the read sensor layers as well as a shunt region; etching, with the patterned resist in place, to remove materials in the left and right side regions and in the shunt region; and depositing, with the patterned resist in place, left and right hard bias and lead layers in the left and right side regions, respectively, and in the shunt region for forming a severable shunt which electrically couples the left and right hard bias and lead layers together for ESD protection.

    摘要翻译： 制造读取传感器同时防止静电放电（ESD）损坏的方法包括在形成读取的传感器期间形成可分离的分流。 该方法可以包括在多个读取传感器层上形成抗蚀剂层; 使用掩模执行光刻以将抗蚀剂层形成图案化的抗蚀剂，其在读取的传感器层以及分流区域上暴露左侧区域和右侧区域; 蚀刻，图案化抗蚀剂就位，以去除左右侧区域和分流区域中的材料; 并且分别在左侧区域和右侧区域以及分流区域中分别将图案化的抗蚀剂沉积在左侧和右侧的硬偏压和引线层，以形成可分离的分流器，其将左右硬偏压和引线层电耦合 一起为ESD保护。

    Magnetic recording head wiht overlaid leads
    10.
    发明申请
    Magnetic recording head wiht overlaid leads 失效
    磁记录头与重叠导线

    公开(公告)号：US20070048624A1

    公开(公告)日：2007-03-01

    申请号：US11211877

    申请日：2005-08-24

    申请人： Tsung Chen ,  Frederick Dill ,  James Frietag ,  Kuok San Ho ,  Wipul Jayasekara ,  Kim Lee ,  Mustafa Pinarbasi ,  Ching Tsang ,  Pactrick Webb

    发明人： Tsung Chen ,  Frederick Dill ,  James Frietag ,  Kuok San Ho ,  Wipul Jayasekara ,  Kim Lee ,  Mustafa Pinarbasi ,  Ching Tsang ,  Pactrick Webb

    IPC分类号： G03H3/00 ,  G11B5/127

    CPC分类号： G11B5/3932 ,  G11B5/3929 ,  G11B5/398 ,  Y10T29/49032 ,  Y10T29/49043 ,  Y10T29/49044 ,  Y10T29/49046 ,  Y10T29/49048 ,  Y10T29/49052

    摘要： An embodiment of the invention is a magnetic head with overlaid lead pads that contact the top surface of the sensor between the hardbias structures and do not contact the hardbias structures which are electrically insulated from direct contact with the sensor. The lead pad contact area on the top of the sensor is defined by sidewall deposition of a conductive material to form leads pads on a photoresist prior to formation of the remainder of the leads. The conductive material for the lead pads is deposited at a shallow angle to maximize the sidewall deposition on the photoresist, then ion-milled at a high angle to remove the conductive material from the field while leaving the sidewall material. An insulation layer is deposited on the lead material at a high angle, then milled at a shallow angle to remove insulation from the sidewall.

    摘要翻译： 本发明的一个实施例是具有覆盖的引线焊盘的磁头，该焊盘在硬质合金结构之间接触传感器的顶表面，并且不接触与传感器直接接触的电绝缘的硬质合金结构。 传感器顶部的引线焊盘接触区域由导电材料的侧壁沉积限定，以在形成其余引线之前在光致抗蚀剂上形成引线焊盘。 用于引线焊盘的导电材料以浅角度沉积，以使光致抗蚀剂上的侧壁沉积最大化，然后以高角度离子研磨，以从外界移除导电材料，同时留下侧壁材料。 绝缘层以高角度沉积在引线材料上，然后以浅角度铣削以除去与侧壁的绝缘。