公开(公告)号：US06441705B1

公开(公告)日：2002-08-27

申请号：US09830277

申请日：2001-05-30

申请人： Mario Costa ,  Roberto Ravanelli

发明人： Mario Costa ,  Roberto Ravanelli

IPC分类号： H01P706

CPC分类号： H01P1/2138

摘要： The present invention relates to a duplexer set up by two decoupling filters for high frequency transceivers of the temperature self-compensating type and implemented by means of a pair of mechanic bodies (2), each one of which including a plurality of resonance cavities (3). Inside of the cavity (3) of the superior body (2) of the duplexer, a corresponding adjustment disc (7) is lodged in a removable and coaxial way which is provided with a supporting stem (8) coming out of a passage hole (12) obtained on the summit of the cavity (3). The bodies (2) are bound between them, so that the cavities of one or the other turn out to be coaxially facing each other. The passage hole (12) of the filter according to the invention is threaded. Moreover at each filter at least one bush (9) is associated having one portion (11) engaged in the hole (12) and inside of which the stem (8) of the disc (7) is housed.

摘要翻译： 本发明涉及一种由两个去耦滤波器构成的双工器，该去耦滤波器用于温度自补偿型的高频收发器，并通过一对机械体（2）实现，其中每一个包括多个谐振腔（3） ）。 在双工器的上部主体（2）的空腔（3）的内部，相应的调节盘（7）以可移动和同轴的方式存放，其中设置有从通道孔（8）出来的支撑杆（8） 12）在空腔（3）的顶部获得。 主体（2）被夹在它们之间，使得一个或另一个的空腔相互同轴地相对。 根据本发明的过滤器的通孔（12）是螺纹的。 此外，在每个过滤器处，至少一个衬套（9）被联接成具有接合在孔（12）中的一个部分（11），并且其内部容纳有盘（7）的杆（8）。

公开(公告)号：US06420944B1

公开(公告)日：2002-07-16

申请号：US09508815

申请日：2000-04-07

申请人： Mario Costa ,  Roberto Ravanelli

发明人： Mario Costa ,  Roberto Ravanelli

IPC分类号： H01P512

CPC分类号： H01P1/2138

摘要： An antenna duplexer including an elongated hollow body realized with two opposed half shells is disclosed. The duplexer also includes a first opening or antenna port and a second and a third opening, or ports of the transmitter and of the receiver. A filtering structure is provided including a plurality of metal inserts available to uncouple the transmitter from the receiver. The duplexer has at least an additional portion of waveguide structured in order to keep the wave “under the cut-off frequency”, interposed between at least second or third opening and the relative end wall of the elongated body. An additional portion of wave guide includes an additional metal insert, forming part of the above mentioned filtering structure, which determines an exponential attenuation of the signal, thus nullifying the negative effects deriving from the mechanical tolerance of the hollow body.

摘要翻译： 公开了一种天线双工器，其包括实现有两个相对的半壳体的细长中空体。 双工器还包括第一开口或天线端口以及发射器和接收器的第二和第三开口或端口。 提供了一种滤波结构，其包括多个可用于将发射器与接收器分离的金属插入件。 双工器具有至少另外一部分波导结构，以便将波浪“保持在截止频率之下”，插入在至少第二或第三开口和细长主体的相对端壁之间。 波导的附加部分包括形成上述滤波结构的一部分的附加金属插入件，其确定信号的指数衰减，从而消除由中空体的机械容差导致的负面影响。

公开(公告)号：US06717255B2

公开(公告)日：2004-04-06

申请号：US10032675

申请日：2001-10-23

申请人： Stefano Oggioni ,  Roberto Ravanelli

发明人： Stefano Oggioni ,  Roberto Ravanelli

IPC分类号： H01L2348

CPC分类号： H01L23/552 ,  H01L23/49816 ,  H01L23/66 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014

摘要： An electronic package is provided. The electronic package includes a chip carrier having a first conductive layer which includes at least one signal track and at least one contact area, the contact area being electrically connected to the signal track and adapted for transmitting a high-frequency signal. The chip carrier further includes a reference structure having at least two conductive layers such that the signal track is electrically shielded by the reference structure. A semiconductor chip is positioned on the chip carrier and includes at least one terminal electrically interconnected to the at least one contact area.

摘要翻译： 提供电子包装。 电子封装包括具有第一导电层的芯片载体，所述第一导电层包括至少一个信号轨道和至少一个接触区域，所述接触区域电连接到所述信号轨道并适于发射高频信号。 芯片载体还包括具有至少两个导电层的参考结构，使得信号轨道被参考结构电屏蔽。 半导体芯片位于芯片载体上，并且包括至少一个电连接到至少一个接触区域的端子。

公开(公告)号：US06710258B2

公开(公告)日：2004-03-23

申请号：US10125624

申请日：2002-04-18

申请人： Stefano Oggioni ,  Roberto Ravanelli

发明人： Stefano Oggioni ,  Roberto Ravanelli

IPC分类号： H05K103

CPC分类号： H05K1/0222 ,  H01L23/49827 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6622 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/112 ,  H05K3/429 ,  H05K2201/093 ,  H05K2201/09618 ,  H05K2201/0969 ,  H05K2201/09809 ,  H05K2201/10734 ,  H01L2224/05599

摘要： A multi-layered circuitized substrate for high-frequency applications. Conductive via-holes extend between two non-adjacent conductive layers for transmitting high-frequency signals therebetween. For each via-hole, shielding rings connectable to a reference voltage are provided, each ring formed in a corresponding intermediate conductive layer between the two non-adjacent conductive layers. The rings define a shielding coaxial structure for the via-hole. Preferably, the intermediate conductive layers are spaced apart from the via-hole, and particularly from respective lands at the ends thereof, in order to reduce stray capacitance associated with the via-hole without losing the shielding effect provided by the rings.

摘要翻译： 一种用于高频应用的多层电路衬底。 导电通孔在两个不相邻的导电层之间延伸，用于在它们之间传输高频信号。 对于每个通孔，提供可连接到参考电压的屏蔽环，每个环形成在两个不相邻的导电层之间的对应的中间导电层中。 这些环限定了用于通孔的屏蔽同轴结构。 优选地，中间导电层与通孔间隔开，特别是从其端部的相应焊盘间隔开，以便减少与通孔相关联的杂散电容，而不会损失由环提供的屏蔽效应。