摘要:
A memory circuit has a high voltage and low voltage supply nodes. One of a first and second sets of voltages is selectively applied to the supply nodes of the memory circuit in dependence upon memory operational mode. If in active read/write mode, then the first set of voltages is selectively applied. Conversely, if in standby no-read/no-write mode, then the second set of voltages is selectively applied. A low voltage in the second set of voltages is greater than a low voltage in the first set of voltages by a selected one of a plurality of low offset voltages, and a high voltage in the second set of voltages is less than a high voltage in the first set of voltages by a selected one of a plurality of high offset voltages. The offset voltages are provided by diode-based circuits that are selectively active. Selective activation is provided by either selectably blowable fuse elements or selectively activated switching elements.
摘要:
A circuit includes a memory cell having a high voltage supply node and a low voltage supply node. Power multiplexing circuitry is provided to selectively apply one of a first set of voltages and a second set of voltages to the high and low voltage supply nodes of the cell in dependence upon a current operational mode of the cell. If the cell is in active read or write mode, then the multiplexing circuitry selectively applies the first set of voltages to the high and low voltage supply nodes. Conversely, if the cell is in standby no-read or no-write mode, then the multiplexing circuitry selectively applies the second set of voltages to the high and low voltage supply nodes. The second set of voltages are offset from the first set of voltages. More particularly, a low voltage in the second set of voltages is higher than a low voltage in the first set of voltages, and wherein a high voltage in the second set of voltages is less than a high voltage in the first set of voltages. The cell can be a member of an array of cells, in which case the selective application of voltages applies to the array depending on the active/standby mode of the array. The array can comprise a block or section within an overall memory device including many blocks or sections, in which case the selective application of voltages applies to individual blocks/sections depending on the active/standby mode of the block/section itself.
摘要:
An SRAM having two capacitors connected in series between respective bit storage nodes of each memory cell. The two inverters of the memory cell are powered by a positive voltage and a low voltage. The two capacitors are connected to each other at a common node. A leakage current generator is coupled to the common node. The leakage current generator supplies to the common node a leakage current to maintain a voltage which is approximately halfway between the voltages of the high and low SRAM supplies.
摘要:
An SRAM having two capacitors connected in series between respective bit storage nodes of each memory cell. The two inverters of the memory cell are powered by a positive voltage and a low voltage. The two capacitors are connected to each other at a common node. A leakage current generator is coupled to the common node. The leakage current generator supplies to the common node a leakage current to maintain a voltage which is approximately halfway between the voltages of the high and low SRAM supplies.
摘要:
A static random access memory having multiple I/Os includes a memory array (10) of memory cells (42) with columns that are selectively clearable as a function of the associated I/O. The columns are arranged in pairs (34) with each column in the pair (34) associated with the same I/O. A clear signal is input thereto on a line (28) and driven by a driver (30). The clear signal is only associated with the pairs (34) associated with a selected I/O. The remaining columns of memory cells associated with unselected I/Os are not cleared.
摘要:
The synchronization circuit of the preferred embodiment is a T flip flop which has a first output which changes state on the leading edge of the clock signal, and a second output which changes state on the trailing edge of the clock signal. The T flip flop has an exclusive OR gate input in which the T input is combined with the first output. The output of the exclusive OR is coupled to an internal node when the clock signal is at a first logic state, and isolated from the internal node when the clock signal is at a second logic state. The internal node is coupled to the first output when the clock signal is at the second logic sate and isolated from the internal node when the clock signal is at the first logic state. The first output signal is coupled to the second output signal when the clock signal is at the first logic state, and isolated from the second output terminal when the clock signal is at the second logic state.
摘要:
A push-pull output driver circuit is disclosed which includes control circuitry for controlling the gates of the driver transistors to effect precharge of the output terminal at the beginning of a cycle. Precharge is initiated at the beginning of each cycle, for example indicated by an address transition. The prior data state at the output is stored, and enables the opposing driver transistor from that which drove the stored prior data state by enabling a gated level detector with hysteresis, such as a Schmitt trigger, associated therewith. The transistor that drove the stored prior data state is disabled, thus precluding oscillations during precharge. The gated Schmitt triggers each receive the voltage of the output terminal and, when enabled, turn on a transistor which couples the output terminal to the gate of the driver transistor. The Schmitt triggers also control the precharge to terminate when the output terminal has reached an intermediate voltage, and so that oscillations are minimized as a result of the hysteresis characteristic. Connection of the output terminal to the gate of the precharging driver transistor helps to eliminate overshoot during precharge.
摘要:
A circuit includes a memory cell having a high voltage supply node and a low voltage supply node. Power multiplexing circuitry is included to selectively apply one of a first set of voltages and a second set of voltages to the high and low voltage supply nodes of the cell in dependence upon a current operational mode of the cell. If the cell is in active read or write mode, then the multiplexing circuitry selectively applies the first set of voltages to the high and low voltage supply nodes. Conversely, if the cell is in standby no-read or no-write mode, then the multiplexing circuitry selectively applies the second set of voltages to the high and low voltage supply nodes. The second set of voltages are offset from the first set of voltages. More particularly, a low voltage in the second set of voltages is higher than a low voltage in the first set of voltages, and wherein a high voltage in the second set of voltages is less than a high voltage in the first set of voltages. The cell can be a member of an array of cells, in which case the selective application of voltages applies to the array depending on the active/standby mode of the array. The array can include a block or section within an overall memory device including many blocks or sections, in which case the selective application of voltages applies to individual blocks/sections depending on the active/standby mode of the block/section itself.
摘要:
According to the present invention, a structure and method provides for single bit failures of an integrated circuit memory device to be analyzed. According to the method for analyzing a single bit failure of an integrated circuit memory device, a test mode is entered, bitline load devices of the integrated circuit memory device are turned off, a single bit of the integrated circuit memory device is selected, the device is placed into a write mode, a plurality of bitlines true and a plurality of bitlines complement of the integrated circuit memory device not associated with the single bit are then set to a low logic level, the bitline true and the bitline complement associated with the single bit is connected to a supply bus and a supply complement bus which is connected to test pads. Finally, the electrical characteristics of the single bit can be monitored on the test pads. According to the structure of the present invention, bitline load devices of the integrated circuit memory device are controlled by a test mode signal, the state of which determines when the test mode will be entered. These bitline load devices are connected to the bitlines true and complement which in turn are connected to the memory cell. Select devices, such as column select transistors, are connected to the bitline true and bitline complement; they are also connected to driver circuitry by a bus, such as a write bus, a read bus or a write/read bus. The driver circuitry is supplied with supply voltages as well as data signals. Further, a buffer circuit allows bitlines true and bitlines complement not associated with the single bit being tested to be pulled to a logic low level. A dummy structure also provides the opportunity to directly monitor the bitlines of the integrated circuit memory device without the need for microprobing.
摘要:
A fault tolerant sequential memory includes primary and redundant memory rows (or columns) and primary and redundant shift registers. The redundant memory rows (or columns) and redundant shift registers are formed at the end of the serial chain. Each shift register of each primary and redundant memory block is interconnected with an independent, separately programmable multiplexer logic circuit. Each multiplexer logic circuit includes an independently programmable repair buffer for logically bypassing a defective primary memory block and associated shift registers within the primary memory array. Each redundant memory block includes a multiplexer logic circuit having an independently programmable repair buffer for logically enabling a redundant memory block and shift register at the end of the serial chain. Consequently, a faulty memory block, including its shift register and memory row (or column) is bypassed and is effectively removed from the shifting sequence. The redundant memory block, including a redundant shift register and a redundant row (or column), is inserted at the end of the shift register chain by opening a programmable fuse element.