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25 条记录 (耗时 0.014 秒)

    Precision abrasive machining of work piece surfaces
    2.
    发明申请
    Precision abrasive machining of work piece surfaces 失效
    工件表面的精密磨削加工

    公开(公告)号：US20080132148A1

    公开(公告)日：2008-06-05

    申请号：US11998691

    申请日：2007-11-30

    申请人： Mark Andrew Stocker

    发明人： Mark Andrew Stocker

    IPC分类号： B24B49/00

    CPC分类号： B24B49/16 ,  B24B7/228 ,  B24B13/01

    摘要： The spacing between an abrasive type surface polishing tool and the surface of the work piece that is being polished is controlled dynamically so that variations in the area of the abrasive pad in contact with the surface of the work piece compensated, thereby eliminating size variations in this contact area and the accompanying variations in material removal that produce surface height fluctuations.

    摘要翻译： 研磨型表面抛光工具与正被抛光的工件表面之间的间距被动态地控制，使得与工件表面接触的磨料区域的变化被补偿，由此消除了这种尺寸变化 接触面积以及产生表面高度波动的材料去除的伴随变化。

    Edge grinding
    3.
    发明授权
    Edge grinding 失效
    边磨

    公开(公告)号：US06881130B1

    公开(公告)日：2005-04-19

    申请号：US10018767

    申请日：2000-04-20

    申请人： Mark Andrew Stocker

    发明人： Mark Andrew Stocker

    IPC分类号： B24B53/00 ,  B23H1/04 ,  B23H9/00 ,  B24B1/00 ,  B24B9/00 ,  B24B9/06 ,  B24B47/22 ,  B24B49/04 ,  B24B53/065 ,  B25J9/16 ,  H01L21/304

    CPC分类号： B24B1/00 ,  B23H1/04 ,  B23H9/00 ,  B24B9/065 ,  B24B47/22 ,  B24B49/04 ,  B24B53/065 ,  B25J9/1602 ,  H01L21/304

    摘要： A method of positioning a grooved grinding wheel relative to a disc-like circular workpiece for edge grinding the workpiece using the groove in the wheel includes the steps of mounting the workpiece for rotation about a first axis, mounting the grinding wheel for rotation about a second parallel axis, effecting relative movement between the workpiece and the wheel to engage the rim of the wheel within the groove and performing a preliminary grind. The position of the wheel is axially adjusted in accordance with the measurements made on the profile of the rim produced by the preliminary grind, and the rim is ground again with a second preliminary grind with the grinding wheel located at the axially shifted position. The steps of grinding and measuring the periphery of the workpiece are repeated until the rim profile possesses the desired accuracy. The final position of the grooved grinding wheel is then utilized for grinding future wafers.

    摘要翻译： 相对于盘状圆形工件定位带槽砂轮的方法，用于使用车轮中的槽边缘研磨工件的步骤包括以下步骤：将工件安装在第一轴线周围，将砂轮安装在第二轴上 平行的轴线，影响工件和车轮之间的相对运动，以使车轮轮缘在槽内啮合并进行预磨。 轮的位置根据由预研磨产生的轮辋轮廓上的测量值进行轴向调节，并且轮辋再次用第二初步磨削研磨，砂轮位于轴向位移位置。 重复磨削和测量工件的周边的步骤，直到轮辋轮廓具有期望的精度。 然后利用开槽砂轮的最终位置研磨未来的晶圆。

    Machine tools and methods of operation thereof
    4.
    发明授权
    Machine tools and methods of operation thereof 有权

    公开(公告)号：US09630294B2

    公开(公告)日：2017-04-25

    申请号：US12863786

    申请日：2009-01-21

    申请人： Mark Andrew Stocker

    发明人： Mark Andrew Stocker

    IPC分类号： B24B49/00 ,  B24B47/22 ,  B23Q1/25 ,  B24B41/00 ,  B24B47/20 ,  B23Q1/54 ,  B23Q1/48

    CPC分类号： B24B47/22 ,  B23Q1/25 ,  B23Q1/4804 ,  B23Q1/5425 ,  B24B41/005 ,  B24B47/20 ,  B24B49/00

    摘要： A machine tool is provided which comprises a machine base (10), a first support (20,100) mounted on a first rotational machine axis on the base, and a second support (22,102) mounted on a second rotational machine axis on the base. The second rotational axis is parallel to and spaced laterally from the first rotational axis and carries a mount (38,112) moveable relative to the second support along a first linear machine axis orthogonal to the second rotational axis. A control arrangement is operable to control the orientation of the first support on the first rotational axis, and the orientation of the mount relative to the second rotational axis and its location along the linear axis, so as to govern the position and orientation of the first support and the mount relative to each other. Existing machine tools often use long linear guide rails and stacked orthogonal axes which introduce alignment and offset errors. The present invention avoids the need for and/or reduces the number of these structures in machine tools.

    Methods and apparatus for forming a slurry polishing pad
    8.
    发明授权
    Methods and apparatus for forming a slurry polishing pad 失效
    用于形成浆料抛光垫的方法和装置

    公开(公告)号：US08500934B2

    公开(公告)日：2013-08-06

    申请号：US13048399

    申请日：2011-03-15

    申请人： Raymond Charles Cady ,  Michael John Moore ,  Mark Alex Shalkey ,  Mark Andrew Stocker

    发明人： Raymond Charles Cady ,  Michael John Moore ,  Mark Alex Shalkey ,  Mark Andrew Stocker

    IPC分类号： B24B7/00

    CPC分类号： B24B37/26 ,  B24B13/02 ,  B24B37/20 ,  B24D18/0009 ,  Y10T29/53796 ,  Y10T156/1028 ,  Y10T156/1031

    摘要： Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.

    摘要翻译： 用于形成用于抛光半导体表面的半球形抛光垫的方法和装置提供：将抛光垫预成型放置在圆顶形成形表面上，所述抛光垫预成型件包括具有中心和外部的圆形主体 周缘，以及从外周缘向中心延伸的多个槽; 设置与圆顶形状表面相对的囊和抛光垫预成型件; 用流体使气囊膨胀，使得发动机罩形状的圆顶形成表面从一侧挤压抛光垫预成型件，并且气囊从相对侧压靠抛光垫预成型件; 并且保持按压步骤达预定时间以实现半球形抛光垫。

    Methods and Apparatus for Forming a Slurry Polishing Pad
    10.
    发明申请
    Methods and Apparatus for Forming a Slurry Polishing Pad 有权
    用于形成浆料抛光垫的方法和装置

    公开(公告)号：US20090170416A1

    公开(公告)日：2009-07-02

    申请号：US11967818

    申请日：2007-12-31

    申请人： Raymond Charles Cady ,  Michael John Moore ,  Mark Alex Shalkey ,  Mark Andrew Stocker

    发明人： Raymond Charles Cady ,  Michael John Moore ,  Mark Alex Shalkey ,  Mark Andrew Stocker

    IPC分类号： B24B7/00 ,  B23P19/04

    CPC分类号： B24B37/26 ,  B24B13/02 ,  B24B37/20 ,  B24D18/0009 ,  Y10T29/53796 ,  Y10T156/1028 ,  Y10T156/1031

    摘要： Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.

    摘要翻译： 用于形成用于抛光半导体表面的半球形抛光垫的方法和装置提供：将抛光垫预成型放置在圆顶形成形表面上，所述抛光垫预成型件包括具有中心和外部的圆形主体 周缘，以及从外周缘向中心延伸的多个槽; 设置与圆顶形状表面相对的囊和抛光垫预成型件; 用流体使气囊膨胀，使得发动机罩形状的圆顶形成表面从一侧挤压抛光垫预成型件，并且气囊从相对侧压靠抛光垫预成型件; 并且保持按压步骤达预定时间以实现半球形抛光垫。