摘要:
A method of forming an NVM cell and a logic transistor uses a semiconductor substrate. In an NVM region, a polysilicon select gate of the NVM cell is formed over a first thermally-grown oxygen-containing layer, and in a logic region, a work-function-setting material is formed over a high-k dielectric and a polysilicon dummy gate is formed over the work-function-setting material. Source/drains, a sidewall spacer, and silicided regions of the logic transistor are formed after the first thermally-grown oxygen-containing layer is formed. The polysilicon dummy gate is replaced by a metal gate. The logic transistor is protected while the NVM cell is then formed including forming a charge storage region.
摘要:
A thermal oxide is formed in an NVM region and a logic region. A polysilicon layer is formed over the thermal oxide and patterned to form a dummy gate and a select gate in the logic and NVM regions, respectively. A first dielectric layer is formed in the NVM and logic regions which surrounds the select gate and dummy gate. The first dielectric layer is removed from the NVM region and protected in the logic region. A charge storage layer is formed over the select gate. The dummy gate is removed, forming an opening. A second dielectric layer is formed over the select gate and within the opening, and a gate layer is formed over the second dielectric layer and within the opening, wherein the gate layer within the opening forms a logic gate and the gate layer is patterned to form a control gate in the NVM region.
摘要:
A thermally-grown oxygen-containing layer is formed over a control gate in an NVM region, and a high-k dielectric layer and barrier layer are formed in a logic region. A polysilicon layer is formed over the oxygen-containing layer and barrier layer and is planarized. A first masking layer is formed over the polysilicon layer and control gate defining a select gate location laterally adjacent the control gate. A second masking layer is formed defining a logic gate location. Exposed portions of the polysilicon layer are removed such that a select gate remains at the select gate location and a polysilicon portion remains at the logic gate location. A dielectric layer is formed around the select and control gates and polysilicon portion. The polysilicon portion is removed to result in an opening at the logic gate location which exposes the barrier layer.
摘要:
A thermally-grown oxygen-containing gate dielectric and select gate are formed in an NVM region. A high-k gate dielectric, barrier layer, and dummy gate are formed in a logic region. The barrier layer may include a work-function-setting material. A first dielectric layer is formed in the NVM and logic regions which surrounds the select gate and dummy gate. The first dielectric layer is removed from the NVM region and protected in the logic region. A charge storage layer is formed over the select gate. The dummy gate is removed, resulting in an opening. A gate layer is formed over the charge storage layer in the NVM region and within the opening in the logic region, wherein the gate layer within the opening together with the barrier layer form a logic gate in the logic region, and the gate layer is patterned to form a control gate in the NVM region.
摘要:
A thermally-grown oxygen-containing layer is formed over a control gate in an NVM region, and a high-k dielectric layer and barrier layer are formed in a logic region. A polysilicon layer is formed over the oxygen-containing layer and barrier layer and is planarized. A first masking layer is formed over the polysilicon layer and control gate defining a select gate location laterally adjacent the control gate. A second masking layer is formed defining a logic gate location. Exposed portions of the polysilicon layer are removed such that a select gate remains at the select gate location and a polysilicon portion remains at the logic gate location. A dielectric layer is formed around the select and control gates and polysilicon portion. The polysilicon portion is removed to result in an opening at the logic gate location which exposes the barrier layer.
摘要:
A control gate overlying a charge storage layer is formed. A thermally-grown oxygen-containing layer is formed over the control gate. A polysilicon layer is formed over the oxygen-containing layer and planarized. A first masking layer is formed defining a select gate location laterally adjacent the control gate and a second masking layer is formed defining a logic gate location. Exposed portions of the polysilicon layer are removed such that a select gate remains at the select gate location and a polysilicon portion remains at the logic gate location. A dielectric layer is formed around the select and control gates and polysilicon portion. The polysilicon portion is removed to result in an opening in the dielectric. A high-k gate dielectric and logic gate are formed in the opening.
摘要:
An oxide-containing layer is formed directly on a semiconductor layer in an NVM region, and a first partial layer of a first material is formed over the oxide-containing layer in the NVM region. A first high-k dielectric layer is formed directly on the semiconductor layer in a logic region. A first conductive layer is formed over the first dielectric layer in the logic region. A second partial layer of the first material is formed directly on the first partial layer in the NVM region and over the first conductive layer in the logic region. A logic device is formed in the logic region. An NVM cell is formed in the NVM region, wherein the first and second partial layer together are used to form one of a charge storage layer if the cell is a floating gate cell or a select gate if the cell is a split gate cell.
摘要:
A method of forming an NVM cell and a logic transistor uses a semiconductor substrate. In an NVM region, a polysilicon select gate of the NVM cell is formed over a first thermally-grown oxygen-containing layer, and in a logic region, a work-function-setting material is formed over a high-k dielectric and a polysilicon dummy gate is formed over the work-function-setting material. Source/drains, a sidewall spacer, and silicided regions of the logic transistor are formed after the first thermally-grown oxygen-containing layer is formed. The polysilicon dummy gate is replaced by a metal gate. The logic transistor is protected while the NVM cell is then formed including forming a charge storage region.
摘要:
A method of forming an NVM cell and a logic transistor uses a semiconductor substrate. A polysilicon select gate of the NVM cell is formed over a first thermally-grown oxygen-containing layer in an NVM region and a polysilicon dummy gate is formed over a second thermally-grown oxygen-containing layer in a logic region. Source/drains, a sidewall spacer, and silicided regions of the logic transistor are formed after the first and second thermally-grown oxygen-containing layers are formed. The second thermally-grown oxygen-containing layer and the dummy gate are replaced by a metal gate and a high-k dielectric. The logic transistor is protected while the NVM cell is then formed including forming a charge storage layer.
摘要:
A method of forming an NVM cell and a logic transistor uses a semiconductor substrate. A polysilicon select gate of the NVM cell is formed over a first thermally-grown oxygen-containing layer in an NVM region and a polysilicon dummy gate is formed over a second thermally-grown oxygen-containing layer in a logic region. Source/drains, a sidewall spacer, and silicided regions of the logic transistor are formed after the first and second thermally-grown oxygen-containing layers are formed. The second thermally-grown oxygen-containing layer and the dummy gate are replaced by a metal gate and a high-k dielectric. The logic transistor is protected while the NVM cell is then formed including forming a charge storage layer.