-
公开(公告)号：US08614900B2
公开(公告)日：2013-12-24
申请号：US13110175
申请日：2011-05-18
申请人： Martin Beaumier , Alexandre Blander , Pascale Gagnon , Michael A. Gaynes , Eric Giguere , Eric Salvas , Luc Tousignant
发明人： Martin Beaumier , Alexandre Blander , Pascale Gagnon , Michael A. Gaynes , Eric Giguere , Eric Salvas , Luc Tousignant
CPC分类号： H05K9/0009 , H01L23/055 , H01L23/10 , H01L23/552 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/10253 , H01L2924/15311 , H01L2924/16251 , Y10T29/49117 , H01L2924/00 , H01L2224/0401
摘要： An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.
-
公开(公告)号：US20110292621A1
公开(公告)日：2011-12-01
申请号：US13110175
申请日：2011-05-18
申请人： Martin Beaumier , Alexandre Blander , Pascale Gagnon , Michael A. Gaynes , Eric Giguere , Eric Salvas , Luc Tousignant
发明人： Martin Beaumier , Alexandre Blander , Pascale Gagnon , Michael A. Gaynes , Eric Giguere , Eric Salvas , Luc Tousignant
CPC分类号： H05K9/0009 , H01L23/055 , H01L23/10 , H01L23/552 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/10253 , H01L2924/15311 , H01L2924/16251 , Y10T29/49117 , H01L2924/00 , H01L2224/0401
摘要： An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.
摘要翻译： 用于在微电子部件级降低EMI的装置包括具有集成在其中的接地导体的基板。 诸如集成电路的微电子部件安装到基板。 导电盖安装到基板上，从而与基板形成物理界面。 导电盖基本覆盖微电子部件。 提供导电链路以在物理接口处在导电盖和接地导体之间产生电连接。
-
公开(公告)号：US08421217B2
公开(公告)日：2013-04-16
申请号：US13419949
申请日：2012-03-14
申请人： Jon A. Casey , John S. Corbin, Jr. , David Danovitch , Isabelle Depatie , Virendra R. Jadhav , Roger A. Liptak , Kenneth C. Marston , Jennifer V. Muncy , Sylvain Ouimet , Eric Salvas
发明人： Jon A. Casey , John S. Corbin, Jr. , David Danovitch , Isabelle Depatie , Virendra R. Jadhav , Roger A. Liptak , Kenneth C. Marston , Jennifer V. Muncy , Sylvain Ouimet , Eric Salvas
CPC分类号： H01L23/04 , H01L23/3675 , H01L23/42 , H01L23/433 , H01L24/28 , H01L24/31 , H01L25/0652 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/83192 , H01L2224/92225 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01074 , H01L2924/01088 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/16152 , H01L2924/16251 , H01L2924/19105 , H01L2924/00 , H01L2224/0401
摘要： A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.
摘要翻译： 一种用于在多芯片封装中实现机械和热稳定性的系统和方法系统。 该系统采用盖子和多个热界面材料。 该方法包括在多芯片封装上利用盖子，并在多芯片封装上利用多个热界面材料。
-
4.发明申请SYSTEM AND METHOD OF ACHIEVING MECHANICAL AND THERMAL STABILITY IN A MULTI-CHIP PACKAGE 有权在多芯片包装中实现机械和热稳定性的系统和方法公开(公告)号：US20120175766A1
公开(公告)日：2012-07-12
申请号：US13419949
申请日：2012-03-14
申请人： Jon A. Casey , John S. Corbin, JR. , David Danovitch , Isabelle Dépatie , Virendra R. Jadhav , Roger A. Liptak , Kenneth C. Marston , Jennifer V. Muncy , Sylvain Ouimet , Eric Salvas
发明人： Jon A. Casey , John S. Corbin, JR. , David Danovitch , Isabelle Dépatie , Virendra R. Jadhav , Roger A. Liptak , Kenneth C. Marston , Jennifer V. Muncy , Sylvain Ouimet , Eric Salvas
IPC分类号： H01L23/34
CPC分类号： H01L23/04 , H01L23/3675 , H01L23/42 , H01L23/433 , H01L24/28 , H01L24/31 , H01L25/0652 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/83192 , H01L2224/92225 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01074 , H01L2924/01088 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/16152 , H01L2924/16251 , H01L2924/19105 , H01L2924/00 , H01L2224/0401
摘要： A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.
摘要翻译： 一种用于在多芯片封装中实现机械和热稳定性的系统和方法系统。 该系统采用盖子和多个热界面材料。 该方法包括在多芯片封装上利用盖子，并在多芯片封装上利用多个热界面材料。
-
公开(公告)号：US08202765B2
公开(公告)日：2012-06-19
申请号：US12357716
申请日：2009-01-22
申请人： Jon A. Casey , John S. Corbin, Jr. , David Danovitch , Isabelle Depatie , Virendra R. Jadhav , Roger A. Liptak , Kenneth C. Marston , Jennifer V. Muncy , Sylvain Ouimet , Eric Salvas
发明人： Jon A. Casey , John S. Corbin, Jr. , David Danovitch , Isabelle Depatie , Virendra R. Jadhav , Roger A. Liptak , Kenneth C. Marston , Jennifer V. Muncy , Sylvain Ouimet , Eric Salvas
CPC分类号： H01L23/04 , H01L23/3675 , H01L23/42 , H01L23/433 , H01L24/28 , H01L24/31 , H01L25/0652 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/83192 , H01L2224/92225 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01074 , H01L2924/01088 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/16152 , H01L2924/16251 , H01L2924/19105 , H01L2924/00 , H01L2224/0401
摘要： A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.
摘要翻译： 一种用于在多芯片封装中实现机械和热稳定性的系统和方法系统。 该系统采用盖子和多个热界面材料。 该方法包括在多芯片封装上利用盖子，并在多芯片封装上利用多个热界面材料。
-
-
-
-
搜索结果
5 条记录 (耗时 0.026 秒)
