利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

14 条记录 (耗时 0.019 秒)

    Aqueous alkaline cleaning compositions and methods of their use
    3.
    发明授权
    Aqueous alkaline cleaning compositions and methods of their use 有权
    水性碱性清洗组合物及其使用方法

    公开(公告)号：US08927476B2

    公开(公告)日：2015-01-06

    申请号：US13805891

    申请日：2011-07-12

    申请人： Raimund Mellies ,  Andreas Klipp

    发明人： Raimund Mellies ,  Andreas Klipp

    IPC分类号： C11D1/62 ,  C11D3/34 ,  C11D3/06 ,  C11D3/20 ,  C11D3/30 ,  C11D3/37 ,  C11D11/00 ,  C11D1/34

    CPC分类号： C11D3/349 ,  C11D1/345 ,  C11D1/66 ,  C11D1/667 ,  C11D1/72 ,  C11D3/0073 ,  C11D3/06 ,  C11D3/2068 ,  C11D3/2086 ,  C11D3/30 ,  C11D3/3757 ,  C11D3/378 ,  C11D11/0017 ,  C11D11/0041 ,  C11D11/0047 ,  C11D11/0064 ,  H01L21/02074 ,  H05K3/1208 ,  H05K2203/0793

    摘要： Aqueous alkaline composition free from organic solvents and metal ion-free silicates, the said compositions comprising (A) a thioamino acid having at least one primary amino group and at least one mercapto group, (B) a quaternary ammonium hydroxide, (C) a chelating and/or corrosion inhibiting agent selected from the group consisting of aliphatic and cycloaliphatic amines having at least two primary amino groups, and aliphatic and cycloaliphatic amines having at least one hydroxy group, (D) a nonionic surfactant selected from the group of acetylenic alcohols, alkyloxylated acetylenic alcohols and alkyloxylated sorbitan monocarboxylic acid mono esters; the use of the alkaline composition for the processing of substrates useful for fabricating electrical and optical devices; and a method for processing substrates useful for fabricating electrical and optical devices making use of the said aqueous alkaline composition.

    摘要翻译： 所述组合物包含（A）具有至少一个伯氨基和至少一个巯基的硫代氨基酸，（B）季铵氢氧化物，（C） 螯合和/或腐蚀抑制剂，其选自具有至少两个伯氨基的脂族和脂环族胺，以及具有至少一个羟基的脂族和脂环族胺，（D）选自炔属醇类的非离子表面活性剂 ，烷氧基化炔醇和烷氧基化脱水山梨醇单羧酸单酯; 使用碱性组合物来处理可用于制造电气和光学器件的衬底; 以及用于处理用于制造使用所述含水碱性组合物的电气和光学器件的衬底的方法。

    AQUEOUS ALKALINE CLEANING COMPOSITIONS AND METHODS OF THEIR USE
    7.
    发明申请
    AQUEOUS ALKALINE CLEANING COMPOSITIONS AND METHODS OF THEIR USE 有权
    水性碱性清洁组合物及其使用方法

    公开(公告)号：US20130157919A1

    公开(公告)日：2013-06-20

    申请号：US13805891

    申请日：2011-07-12

    申请人： Raimund Mellies ,  Andreas Klipp

    发明人： Raimund Mellies ,  Andreas Klipp

    IPC分类号： C11D3/34

    CPC分类号： C11D3/349 ,  C11D1/345 ,  C11D1/66 ,  C11D1/667 ,  C11D1/72 ,  C11D3/0073 ,  C11D3/06 ,  C11D3/2068 ,  C11D3/2086 ,  C11D3/30 ,  C11D3/3757 ,  C11D3/378 ,  C11D11/0017 ,  C11D11/0041 ,  C11D11/0047 ,  C11D11/0064 ,  H01L21/02074 ,  H05K3/1208 ,  H05K2203/0793

    摘要： Aqueous alkaline cleaning composition free from organic solvents and metal ion-free silicates, the said compositions comprising (A) a thioamino acid having at least one primary amino group and at least one mercapto group, (B) a quaternary ammonium hydroxide, (C) a chelating and/or corrosion inhibiting agent selected from the group consisting of aliphatic and cycloaliphatic amines having at least two primary amino groups, and aliphatic and cycloaliphatic amines having at least one hydroxy group, (D) a nonionic surfactant selected from the group of acetylenic alcohols, alkyloxylated acetylenic alcohols and alkyloxylated sorbitan monocarboxylic acid mono esters; the use of the alkaline cleaning composition for the processing of substrates useful for fabricating electrical and optical devices; and a method for processing substrates useful for fabricating electrical and optical devices making use of the said aqueous alkaline cleaning composition.

    摘要翻译： 所述组合物包含（A）具有至少一个伯氨基和至少一个巯基的硫代氨基酸，（B）季铵氢氧化物，（C） 选自具有至少两个伯氨基的脂族和脂环族胺和具有至少一个羟基的脂族和脂环族胺的螯合和/或腐蚀抑制剂，（D）选自炔属的非离子表面活性剂 醇，烷氧基乙炔醇和烷氧基化脱水山梨糖醇单羧酸单酯; 使用碱性清洁组合物来处理可用于制造电气和光学装置的基底; 以及用于处理用于制造使用所述含水碱性清洁组合物的电气和光学装置的基板的方法。

    Aqueous solution for removing post-etch residue
    9.
    发明授权
    Aqueous solution for removing post-etch residue 有权
    用于去除蚀刻后残留物的水溶液

    公开(公告)号：US07919445B2

    公开(公告)日：2011-04-05

    申请号：US10594767

    申请日：2005-03-10

    申请人： Raimund Mellies

    发明人： Raimund Mellies

    IPC分类号： H01L21/302

    CPC分类号： H01L21/02071 ,  C11D1/72 ,  C11D1/83 ,  C11D3/0084 ,  C11D3/2086 ,  C11D3/43 ,  C11D7/265 ,  C11D11/0047 ,  G03F7/423 ,  H01L21/02063

    摘要： The present invention relates to a novel solution for the removal of post-etch residues having improved properties and to the use thereof in the production of semiconductors. The invention relates, in particular, to an aqueous solution having a reduced etching rate on metallisations and on surfaces which have to be freed from post-etch residues and particles during the semiconductor production process.

    摘要翻译： 本发明涉及一种用于去除具有改进性能的蚀刻后残留物的新颖解决方案及其在半导体生产中的应用。 本发明特别涉及在半导体生产过程中在金属化和表面上蚀刻速率降低的水溶液，其必须不含蚀刻后残留物和颗粒。