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1.发明授权Easy release server cooling fan with integrated spring and method for using same 失效易于卸载的服务器散热风扇采用集成弹簧及方法使用公开(公告)号：US07251135B2
公开(公告)日：2007-07-31
申请号：US11223875
申请日：2005-09-08
IPC分类号： H05K7/20
CPC分类号： H05K7/20172
摘要： A fan assembly formed of a fan, at least one fan grill comprising a face panel and at least one side panel comprising a spring slot the fan grill coupled to the fan, and a spring coupled to the fan grill the spring comprising a spring driver end extending through the spring slot.
摘要翻译： 一种由风扇组成的风扇组件，至少一个风扇格栅，其包括面板和至少一个侧板，所述至少一个侧板包括与所述风扇连接的所述风扇格栅的弹簧槽，以及联接到所述风扇格栅的弹簧，所述弹簧包括弹簧驱动器端 延伸穿过弹簧槽。
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2.发明授权Cooling system for a computer system having dual fans and a movable baffle 有权具有双风扇和可移动挡板的计算机系统的冷却系统
公开(公告)号：US6108203A
公开(公告)日：2000-08-22
申请号：US267419
申请日：1999-03-12
申请人： Karl Klaus Dittus , Mohanlal S. Mansuria , Martin Joseph Crippen , Jason Aaron Matteson , Leo H. Webster, Jr.
发明人： Karl Klaus Dittus , Mohanlal S. Mansuria , Martin Joseph Crippen , Jason Aaron Matteson , Leo H. Webster, Jr.
CPC分类号： H05K7/2019 , F04D17/16 , F04D25/14 , F04D25/166 , G06F1/20
摘要： A computer system includes a housing that is divided into three compartments; two fan compartments, each containing a fan, and a third compartment containing heat generating electronic components. The air discharged from the fans flows through outlets in the fan compartments and into the third compartment to cool the electronic components. A single baffle is rotatably coupled between the two fan compartments using a vertically oriented hinge. When one of the fans fails, the air pressure from the working fan rotates the baffle until it covers the outlet of the fan compartment containing the failed fan. This enhances the flow of air from the working fan into the third compartment, and restricts the reverse flow of air through the dead fan compartment. When both fans are functioning, air pressure from both fans moves the baffle to a "midway" or "neutral" position, such that the air from both fans flows into the third compartment.
摘要翻译： 计算机系统包括被分成三个隔间的外壳; 两个风扇隔室，每个包含风扇，以及包含发热电子部件的第三隔室。 从风扇排出的空气流经风扇室的出口并进入第三隔室，以冷却电子部件。 单个挡板使用垂直定向的铰链可旋转地联接在两个风扇隔室之间。 当其中一个风扇故障时，来自工作风扇的气压使挡板旋转，直到其覆盖包含故障风扇的风扇室的出口。 这增强了从工作风扇进入第三隔室的空气流动，并且限制空气通过死风扇室的反向流动。 当两个风扇都工作时，来自两个风扇的空气压力将挡板移动到“中间”或“中间”位置，使得来自两个风扇的空气流入第三隔室。
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公开(公告)号：US07782606B2
公开(公告)日：2010-08-24
申请号：US12119292
申请日：2008-05-12
CPC分类号： G06F1/187 , G11B33/124 , G11B33/128 , Y10T29/49826
摘要： A hard disk drive carrier having a latch apparatus to facilitate leveraged insertion of a hard disk drive into a receiving drive bay to an interfaced position, securing of the hard disk drive carrier in the drive bay when the hard disk drive secured to the carrier interfaces with a host computer, leveraged dislodgement of the hard disk drive from its interfaced position for removal of the hard disk drive from the drive bay, and proper positioning of the latch apparatus upon insertion of the hard disk drive carrier to ensure proper engagement of the latch apparatus with the drive bay for leveraged insertion and removal.
摘要翻译： 一种具有锁定装置的硬盘驱动器托架，用于便于将硬盘驱动器有利地插入到接收驱动器托架到接口位置，当硬盘驱动器托架固定到托架上时将硬盘驱动器托架固定在驱动器托架中， 主机计算机，从其接口位置驱动硬盘驱动器从驱动器托架移除硬盘驱动器，以及在插入硬盘驱动器托架时适当地定位闩锁装置，以确保闩锁装置的正确接合 驱动器托架用于杠杆式插入和拆卸。
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公开(公告)号：US07735326B2
公开(公告)日：2010-06-15
申请号：US12173351
申请日：2008-07-15
IPC分类号： F25B21/02
CPC分类号： F25B21/02 , F25B2321/0212 , F25B2700/21 , H05K7/20754
摘要： Embodiments include systems and methods for selectively cooling heat-generating electronic components in an enclosure. According to one embodiment, an enclosure houses a plurality of heat-generating electronic components. Air enters the enclosure at the front and is exhausted at the rear. After passing through one or more upstream components, air diverges into at least first and second airstreams within the enclosure. The first airstream is re-cooled by a cooling system having a thermoelectric cooling module. The thermoelectric cooling module is configured such that a first side is cooled and a second side is heated in response to an applied voltage. A voltage regulator may govern the voltage in response to one or more temperatures sensed within the rack system.
摘要翻译： 实施例包括用于选择性地冷却外壳中的发热电子部件的系统和方法。 根据一个实施例，外壳容纳多个发热电子部件。 空气进入前部的外壳，并在后部排空。 在通过一个或多个上游部件之后，空气在外壳内至少分散到第一和第二气流中。 第一气流由具有热电冷却模块的冷却系统再次冷却。 热电冷却模块被构造成使得第一侧被冷却，并且第二侧被响应于所施加的电压而被加热。 电压调节器可以响应于在机架系统内感测到的一个或多个温度来控制电压。
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公开(公告)号：US20090070993A1
公开(公告)日：2009-03-19
申请号：US12120097
申请日：2008-05-13
IPC分类号： H01R43/00
CPC分类号： H01R12/88 , H01R43/0235 , H01R43/0249 , Y10T29/49117 , Y10T29/49126 , Y10T29/49147
摘要： A reduced insertion force mezzanine connector is used to couple first and second circuit boards. In one embodiment a connector frame has a first end disposed against the first circuit board and defining a first wall, and an opposing second end disposed against the second circuit board and defining a second wall generally parallel with the first wall. A plurality of wafers are disposed. Each wafer has a first edge in sliding contact with the first wall and an opposing second edge in sliding contact with the second wall. A plurality of electrically conducting pathways extend along each wafer from the first edge to the second edge. A wafer guide structure defines a plurality of wafer-support aisles on the first and second walls for receiving the edges of the wafers to constrain the wafers with a fixed spacing and generally parallel alignment. A plurality of terminals are biased to protrude laterally into each wafer support aisle, and are spaced along the wafer support aisle such that each wafer is movable within the respective wafer support aisle between a first position, wherein each electrically conducting pathway is disposed between adjacent terminals, to a second position, wherein each electrically conducting pathway is in electrical contact with a terminal on the first wall and an associated terminal on the second wall.
摘要翻译： 减少的插入力夹层连接器用于耦合第一和第二电路板。 在一个实施例中，连接器框架具有抵靠第一电路板设置并限定第一壁的第一端，以及抵靠第二电路板设置的相对的第二端，并限定大致平行于第一壁的第二壁。 设置多个晶片。 每个晶片具有与第一壁滑动接触的第一边缘和与第二壁滑动接触的相对的第二边缘。 多个导电通路沿着每个晶片从第一边缘延伸到第二边缘。 晶片引导结构在第一和第二壁上限定多个晶片支撑通道，用于接收晶片的边缘以以固定间隔和大致平行对准来约束晶片。 多个端子被偏置以横向突出到每个晶片支撑通道中，并且沿着晶片支撑通道间隔开，使得每个晶片可在相应的晶片支撑通道之间在第一位置之间移动，其中每个导电通路设置在相邻端子之间 到第二位置，其中每个导电路径与第一壁上的端子和第二壁上的相关联的端子电接触。
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公开(公告)号：USD484508S1
公开(公告)日：2003-12-30
申请号：US29171710
申请日：2002-11-27
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公开(公告)号：US08091219B2
公开(公告)日：2012-01-10
申请号：US12120097
申请日：2008-05-13
IPC分类号： H05K3/36
CPC分类号： H01R12/88 , H01R43/0235 , H01R43/0249 , Y10T29/49117 , Y10T29/49126 , Y10T29/49147
摘要： A reduced insertion force mezzanine connector is used to couple first and second circuit boards. In one embodiment a connector frame has a first end disposed against the first circuit board and defining a first wall, and an opposing second end disposed against the second circuit board and defining a second wall generally parallel with the first wall. A plurality of wafers are disposed. Each wafer has a first edge in sliding contact with the first wall and an opposing second edge in sliding contact with the second wall. A plurality of electrically conducting pathways extend along each wafer from the first edge to the second edge. A wafer guide structure defines a plurality of wafer-support aisles on the first and second walls for receiving the edges of the wafers to constrain the wafers with a fixed spacing and generally parallel alignment. A plurality of terminals are biased to protrude laterally into each wafer support aisle, and are spaced along the wafer support aisle such that each wafer is movable within the respective wafer support aisle between a first position, wherein each electrically conducting pathway is disposed between adjacent terminals, to a second position, wherein each electrically conducting pathway is in electrical contact with a terminal on the first wall and an associated terminal on the second wall.
摘要翻译： 减少的插入力夹层连接器用于耦合第一和第二电路板。 在一个实施例中，连接器框架具有抵靠第一电路板设置并限定第一壁的第一端，以及抵靠第二电路板设置的相对的第二端，并限定大致平行于第一壁的第二壁。 设置多个晶片。 每个晶片具有与第一壁滑动接触的第一边缘和与第二壁滑动接触的相对的第二边缘。 多个导电通路沿着每个晶片从第一边缘延伸到第二边缘。 晶片引导结构在第一和第二壁上限定多个晶片支撑通道，用于接收晶片的边缘以以固定间隔和大致平行对准来约束晶片。 多个端子被偏置以横向突出到每个晶片支撑通道中，并且沿着晶片支撑通道间隔开，使得每个晶片可在相应的晶片支撑通道之间在第一位置之间移动，其中每个导电通路设置在相邻端子之间 到第二位置，其中每个导电路径与第一壁上的端子和第二壁上的相关联的端子电接触。
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公开(公告)号：US08023263B2
公开(公告)日：2011-09-20
申请号：US12119380
申请日：2008-05-12
IPC分类号： H05K7/12
CPC分类号： G06F1/187 , G11B33/123 , G11B33/124
摘要： A latch apparatus and method to facilitate leveraged insertion of a component into a component bay to an interfaced position, securing of the component in the component bay when the component interfaces with a host computer, leveraged dislodgement of the component from its interfaced position for removal of the component from the component bay, and proper positioning of the latch apparatus upon insertion of the component housing to ensure proper engagement of the latch apparatus with the component bay for leveraged insertion and removal. One latch apparatus comprises a frame adapted to be secured to a proximal end of a component housing, a handle pivotally secured to the frame, and an extendable arm slidably secured to a distal end of the handle and biased toward an extended position, wherein the distal end of the extendable arm has a distally extending latch key for engaging a slot in the component bay.
摘要翻译： 一种闩锁装置和方法，用于有助于将部件有利地插入到部件间隔到接口位置，当部件与主机接口时将部件固定在部件托架中，从部件的接口位置移除部件 来自组件隔间的部件，以及在插入部件壳体时适当地定位闩锁装置，以确保闩锁装置与用于杠杆式插入和移除的部件槽的适当接合。 一个闩锁装置包括适于固定到部件壳体的近端的框架，可枢转地固定到框架的手柄和可滑动地固定到手柄的远端并被朝向延伸位置偏压的可伸展臂，其中远端 可伸缩臂的端部具有用于接合组件隔间中的狭槽的远侧延伸的闩锁键。
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9.发明申请Compact HDD Carrier Mechanism Featuring Self Actuating EMC Springs to Prevent HDD Component Shorting 有权具有自动执行EMC弹簧的紧凑型HDD载体机构，以防止HDD组件短路公开(公告)号：US20100149746A1
公开(公告)日：2010-06-17
申请号：US12333442
申请日：2008-12-12
CPC分类号： H05K9/0062 , G11B33/122 , Y10T29/49002
摘要： An improved carrier comprises a tray, an EMC component, and a bezel. The EMC component comprises a top spring set and a bottom spring set. Each spring set comprises a plurality of spring biased contacts connected by a plate and a bar so that each spring set moves in unison when depressed or released. Each tray has a first flange and a second flange and each of the flanges has a cut out portion. When an improved carrier is moved out of an array enclosure, the flanges depress the top spring of the EMC component of the carrier below. When the improved carrier is moved into the array enclosure, the flanges depress the top spring set of the carrier below until the top spring set of the carrier below is released by the cut-out portions of the flanges. When released, the top spring set of the carrier below contacts the bottom spring set of the carrier above to form a continuous EMC shield.
摘要翻译： 改进的载体包括托盘，EMC部件和挡板。 EMC组件包括顶部弹簧组件和底部弹簧组件。 每个弹簧组包括通过板和杆连接的多个弹簧偏置的触点，使得当按压或释放时，每个弹簧组一起移动。 每个托盘具有第一凸缘和第二凸缘，并且每个凸缘都具有切口部分。 当改进的载体从阵列外壳移出时，法兰将下面的载体的EMC部件的顶部弹簧压下。 当改进的载体移动到阵列外壳中时，凸缘将下面的载体的顶部弹簧组压下，直到下面的载体的顶部弹簧组由凸缘的切口部分释放。 当释放时，下面的载体的顶部弹簧组与上面的载体的底部弹簧组接触，形成一个连续的EMC屏蔽。
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公开(公告)号：US20080060363A1
公开(公告)日：2008-03-13
申请号：US11530284
申请日：2006-09-08
CPC分类号： F25B21/02 , F25B2321/0212 , F25B2700/21 , H05K7/20754
摘要： Systems and methods for selectively cooling heat-generating electronic components in an enclosure. According to one embodiment, an enclosure houses a plurality of heat-generating electronic components. Air enters the enclosure at the front and is exhausted at the rear. After passing through one or more upstream components, air diverges into at least first and second airstreams within the enclosure. The first airstream is re-cooled by a cooling system having a thermoelectric cooling module. The thermoelectric cooling module is configured such that a first side is cooled and a second side is heated in response to an applied voltage. A voltage regulator may govern the voltage in response to one or more temperatures sensed within the rack system.
摘要翻译： 用于选择性地冷却外壳中的发热电子部件的系统和方法。 根据一个实施例，外壳容纳多个发热电子部件。 空气进入前部的外壳，并在后部排空。 在通过一个或多个上游部件之后，空气在外壳内至少分散到第一和第二气流中。 第一气流由具有热电冷却模块的冷却系统再次冷却。 热电冷却模块被构造成使得第一侧被冷却，并且第二侧被响应于所施加的电压而被加热。 电压调节器可以响应于在机架系统内感测到的一个或多个温度来控制电压。
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