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1.发明授权Cooling system for a computer system having dual fans and a movable baffle 有权具有双风扇和可移动挡板的计算机系统的冷却系统
公开(公告)号：US6108203A
公开(公告)日：2000-08-22
申请号：US267419
申请日：1999-03-12
申请人： Karl Klaus Dittus , Mohanlal S. Mansuria , Martin Joseph Crippen , Jason Aaron Matteson , Leo H. Webster, Jr.
发明人： Karl Klaus Dittus , Mohanlal S. Mansuria , Martin Joseph Crippen , Jason Aaron Matteson , Leo H. Webster, Jr.
CPC分类号： H05K7/2019 , F04D17/16 , F04D25/14 , F04D25/166 , G06F1/20
摘要： A computer system includes a housing that is divided into three compartments; two fan compartments, each containing a fan, and a third compartment containing heat generating electronic components. The air discharged from the fans flows through outlets in the fan compartments and into the third compartment to cool the electronic components. A single baffle is rotatably coupled between the two fan compartments using a vertically oriented hinge. When one of the fans fails, the air pressure from the working fan rotates the baffle until it covers the outlet of the fan compartment containing the failed fan. This enhances the flow of air from the working fan into the third compartment, and restricts the reverse flow of air through the dead fan compartment. When both fans are functioning, air pressure from both fans moves the baffle to a "midway" or "neutral" position, such that the air from both fans flows into the third compartment.
摘要翻译： 计算机系统包括被分成三个隔间的外壳; 两个风扇隔室，每个包含风扇，以及包含发热电子部件的第三隔室。 从风扇排出的空气流经风扇室的出口并进入第三隔室，以冷却电子部件。 单个挡板使用垂直定向的铰链可旋转地联接在两个风扇隔室之间。 当其中一个风扇故障时，来自工作风扇的气压使挡板旋转，直到其覆盖包含故障风扇的风扇室的出口。 这增强了从工作风扇进入第三隔室的空气流动，并且限制空气通过死风扇室的反向流动。 当两个风扇都工作时，来自两个风扇的空气压力将挡板移动到“中间”或“中间”位置，使得来自两个风扇的空气流入第三隔室。
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公开(公告)号：US06817405B2
公开(公告)日：2004-11-16
申请号：US10064000
申请日：2002-06-03
IPC分类号： F28F700
CPC分类号： F28F3/022 , H01L23/3677 , H01L23/467 , H01L2924/0002 , Y10S165/908 , H01L2924/00
摘要： A heat sink has a base plate and attached pin-fins with intake and discharge openings connected by a tubular channel. A pump moves cooling fluid across the exterior surface of the pin-fins, as well as the interior surface of the tubular channels, thereby increasing the surface area exposed to the cooling fluid. In one embodiment, the cooling fluid moves parallel to the base plate, and the discharge openings are oriented to discharge fluid in the same direction as the pump output, +/−90 degrees. Baffles may be added to duct the cooling fluid over the heat sink. In another embodiment, the cooling fluid moves perpendicular to the base plate and the discharge openings are oriented to vent the cooling fluid along lines that extend outward from a center point of the base plate, or along radial lines drawn from a central point through the pin-fins.
摘要翻译： 散热器具有基板和连接的带有通过管状通道连接的进气和排出开口的销翅片。 泵将冷却流体移动穿过销翅片的外表面以及管状通道的内表面，由此增加暴露于冷却流体的表面积。 在一个实施例中，冷却流体平行于基板移动，并且排出口被定向成以与泵输出相同的方向排出流体，+/- 90度。 可以加入挡板以将散热器上的冷却流体导管。 在另一个实施例中，冷却流体垂直于基板移动，并且排出口被定向成沿着从基板的中心点向外延伸的线排出冷却流体，或者沿着从中心点通过销引出的径向线 烯烃。
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3.发明授权公开(公告)号：US06269001B1
公开(公告)日：2001-07-31
申请号：US09553185
申请日：2000-04-20
IPC分类号： H05K720
CPC分类号： H05K7/1431 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An integrated cooling and retention bracket is detachably coupled to a computer processor cartridge having a heatsink mounted thereto. The bracket is U-shaped with a cross-bar and a short, perpendicular arm on each end of the cross-bar. The lower end of each arm acts as a hinge for an upward-turned extension on the outer side of each arm. Each extension has a rounded knob at its tip and an outward protruding tooth therebelow. An integrally formed, cooling fan mounting structure is located on top of the cross-bar. The mounting structure has two side panels with a central opening therebetween for holding a conventional cooling fan, which is snap mounted inside the central opening. The cartridge and bracket assembly is installed in a retention mechanism on a printed circuit board. The teeth on the bracket snap into holes in the posts in the retention mechanism to electrically interconnect the processor cartridge to the circuit board. With the assembly installed in the retention mechanism, the fan is located directly adjacent to the cartridge for cooling the processor. The concave surfaces of the end wall and the baffle direct airflow from the fan along the entire width heatsink to maximize the cooling capability of the fan.
摘要翻译： 集成的冷却和保持支架可拆卸地联接到具有安装在其上的散热器的计算机处理器盒。 支架是U形的，横杆的横截面和横杆的每一端都有一个短的垂直臂。 每个臂的下端用作在每个臂的外侧上向上转动的延伸的铰链。 每个延伸部在其尖端处具有圆形旋钮，并在其下方具有向外突出的齿。 整体形成的冷却风扇安装结构位于横杆的顶部。 安装结构具有两个侧板，其间具有中间开口，用于保持传统的冷却风扇，该风扇被卡扣安装在中央开口内。 盒和支架组件安装在印刷电路板上的保持机构中。 支架上的齿卡入保持机构中的柱中的孔中，以将处理器盒电连接到电路板。 当组件安装在保持机构中时，风扇直接位于盒的附近，用于冷却处理器。 端壁和挡板的凹表面沿着整个宽度散热片直接来自风扇的气流，以最大化风扇的冷却能力。
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公开(公告)号：US06889908B2
公开(公告)日：2005-05-10
申请号：US10610303
申请日：2003-06-30
CPC分类号： G06F11/3006 , F24F11/30 , F24F11/32 , F24F11/62 , G05B23/0235 , G06F1/206 , G06F11/3051 , G06F11/3058 , H05K7/20727 , H05K7/20836
摘要： Methods, systems, and media for thermal analysis are disclosed. Embodiments of the invention receive temperatures associated with elements of a system. The temperatures received are dependant upon airflow and heating patterns of the elements. Differences between the temperatures received and expected temperatures are detected. Potential airflow and heating patterns associated with a thermal problem are then determined, the potential airflow and heating patterns being substantially consistent with the temperatures received, to identify a root cause of the thermal problem as a probable source of the differences. More specifically, embodiments collect temperature readings from temperature sensors within an enclosure of the system; identify and upward temperature gradient or temperature that exceeds a threshold temperature; and select a failure scenario associated with a root cause of a thermal problem that is similar to the thermal problem described by the temperature readings collected.
摘要翻译： 公开了用于热分析的方法，系统和介质。 本发明的实施例接收与系统的元件相关联的温度。 接收的温度取决于元件的气流和加热模式。 检测到接收到的温度和预期温度之间的差异。 然后确定与热问题相关联的潜在气流和加热模式，潜在气流和加热模式与接收的温度基本一致，以将热问题的根本原因识别为差异的可能来源。 更具体地，实施例从系统的外壳内的温度传感器收集温度读数; 识别和向上的温度梯度或温度超过阈值温度; 并选择与热问题的根本原因相关联的故障情景，其类似于所收集的温度读数描述的热问题。
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公开(公告)号：US06807058B2
公开(公告)日：2004-10-19
申请号：US10300058
申请日：2002-11-20
IPC分类号： H05K720
CPC分类号： H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： The capability of an assembly to transfer heat from a semiconductor package source is enhanced while a reduction in the space required for effective operation is achieved. Bodies of fins defining tubular channels are affixed to oppositely facing surfaces of a rectilinear body which is adapted to receive heat from a semiconductor package.
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6.发明授权Server blade chassis with airflow bypass damper engaging upon blade removal 有权具有气流旁路阻尼器的服务器刀片机箱，与刀片拆卸相配合公开(公告)号：US06771499B2
公开(公告)日：2004-08-03
申请号：US10306302
申请日：2002-11-27
IPC分类号： G06F120
CPC分类号： H05K7/20718 , G06F1/20 , Y10T16/538
摘要： A server blade system includes a plurality of slots for receiving server blades. The system includes an air moving device to move air through each of the server blades installed in the system. When one of the server blades is removed, a bypass damper rotates into the empty slot to obstruct the flow of air through the slot. The bypass damper is pivotally mounted within each slot and includes a torsion spring to move the damper into the obstruction position. Two hinge pin mounts, which are “U” shaped in cross section, provide a snap fit for two hinge pins positioned at one end of the bypass damper. A spring mounting pin is positioned between the two hinge pins and a torsion spring is mounted over the spring mounting pin.
摘要翻译： 服务器刀片系统包括用于接收服务器刀片的多个槽。 该系统包括空气移动装置，以将空气移动通过安装在系统中的每个服务器刀片。 当其中一个服务器刀片被卸下时，旁路阻尼器旋转到空槽中以阻止空气流过该槽。 旁通阻尼器枢转地安装在每个槽内，并且包括扭转弹簧以将阻尼器移动到阻塞位置。 横截面为“U”形的两个铰链销安装件为位于旁路阻尼器一端的两个铰链销提供卡扣配合。 弹簧安装销位于两个铰链销之间，扭簧安装在弹簧安装销上。
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公开(公告)号：US06688965B1
公开(公告)日：2004-02-10
申请号：US10306371
申请日：2002-11-27
IPC分类号： H05K500
CPC分类号： H05K7/20181 , H05K7/20718
摘要： An air moving system such as a fan or blower system includes a back flow damper that functions in two orientations; non-inverted and inverted. First and second “end” baffles are pivotally attached at opposite ends of the damper, and three “middle” baffles are pivotally attached between the two end baffles. When the air moving system fails in the non-inverted orientation, the first end baffle and the three middle baffles are gravity operated to close off the air outlet to prevent the back flow of air, and the second end baffle pivots away from the outlet. When the air moving device fails in the inverted orientation, the second end baffle and the three middle baffles operate to close off the air outlet, and the first end baffle pivots away from the outlet. The three middle baffles are pivotally coupled to a connecting rod, which prevents the inadvertent jamming of baffles.
摘要翻译： 诸如风扇或鼓风机系统的空气移动系统包括以两个方向起作用的回流阻尼器; 非反转和倒置。 第一和第二“端部”挡板枢转地附接在阻尼器的相对端，并且三个“中间”挡板枢转地附接在两个端部挡板之间。 当空气移动系统以非倒置方向故障时，第一端挡板和三个中间挡板重力操作，以关闭出风口，以防止空气回流，第二端挡板从出口枢转。 当空气移动装置以倒置方向故障时，第二端挡板和三个中间挡板操作以关闭空气出口，并且第一端挡板从出口枢转。 三个中间挡板可枢转地连接到连杆上，防止挡板的意外堵塞。
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公开(公告)号：US07621134B2
公开(公告)日：2009-11-24
申请号：US11530284
申请日：2006-09-08
IPC分类号： F25B21/02
CPC分类号： F25B21/02 , F25B2321/0212 , F25B2700/21 , H05K7/20754
摘要： A method for selectively cooling one or more heat-generating electronic components in an enclosure. Air is passed through an enclosure that houses one or more heat-generating components. Heated air is separated into at least first and second parallel airstreams within the enclosure. The first airstream is passed through a first heat exchanger in thermal contact with a first side of a thermoelectric cooling module. The second airstream is passed through a second heat exchanger in thermal contact with a second side of the thermoelectric cooling module. A voltage is applied to the thermoelectric cooling module to cool the first side and heat the second side of the thermoelectric cooling module. A temperature at a location in the enclosure in sensed and the voltage applied to the thermoelectric cooling module is varied in response to the sensed temperature.
摘要翻译： 一种用于选择性地冷却外壳中的一个或多个发热电子部件的方法。 空气通过容纳一个或多个发热部件的外壳。 加热空气在外壳内分成至少第一和第二平行气流。 第一气流通过与热电冷却模块的第一侧热接触的第一热交换器。 第二气流通过与热电冷却模块的第二侧热接触的第二热交换器。 电压被施加到热电冷却模块以冷却第一侧并加热热电冷却模块的第二侧。 感测到的外壳中的位置处的温度和施加到热电冷却模块的电压响应于感测到的温度而变化。
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公开(公告)号：US20080271464A1
公开(公告)日：2008-11-06
申请号：US12173351
申请日：2008-07-15
IPC分类号： F25B21/02
CPC分类号： F25B21/02 , F25B2321/0212 , F25B2700/21 , H05K7/20754
摘要： Embodiments include systems and methods for selectively cooling heat-generating electronic components in an enclosure. According to one embodiment, an enclosure houses a plurality of heat-generating electronic components. Air enters the enclosure at the front and is exhausted at the rear. After passing through one or more upstream components, air diverges into at least first and second airstreams within the enclosure. The first airstream is re-cooled by a cooling system having a thermoelectric cooling module. The thermoelectric cooling module is configured such that a first side is cooled and a second side is heated in response to an applied voltage. A voltage regulator may govern the voltage in response to one or more temperatures sensed within the rack system.
摘要翻译： 实施例包括用于选择性地冷却外壳中的发热电子部件的系统和方法。 根据一个实施例，外壳容纳多个发热电子部件。 空气进入前部的外壳，并在后部排空。 在通过一个或多个上游部件之后，空气在外壳内至少分散到第一和第二气流中。 第一气流由具有热电冷却模块的冷却系统再次冷却。 热电冷却模块被构造成使得第一侧被冷却，并且第二侧被响应于所施加的电压而被加热。 电压调节器可以响应于在机架系统内感测到的一个或多个温度来控制电压。
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10.发明授权System, method, and apparatus for providing a thermal bypass in electronic equipment 有权用于在电子设备中提供热旁路的系统，方法和装置公开(公告)号：US07134288B2
公开(公告)日：2006-11-14
申请号：US10842284
申请日：2004-05-10
IPC分类号： F25B21/02
CPC分类号： H05K7/20 , F25B21/02 , F25B2321/0251
摘要： A system enclosure uses two heat exchangers and a thermoelectric cooling module to manage heat within the system. An airflow enters the system and is heated by server blades. Portions of the airflow split and travel to various portions of the system enclosure. Some heat is removed from the airflow by passing through the first heat exchanger before circulating around downstream subsystems. The first heat exchanger contacts the cold side of a TEC module, to reduce the temperature of that airflow. The air then enters the network switch module or other subsystem where it is further heated. Thereafter, the second heat exchanger ‘bypasses’ those components by reinserting the upstream heat back into the downstream airflow. The second heat exchanger contacts the hot side of the TEC module. The mixture of all heated air is then expelled from the system enclosure.
摘要翻译： 系统机箱使用两个热交换器和热电冷却模块来管理系统内的热量。 气流进入系统并由服务器刀片加热。 气流的一部分分流并移动到系统外壳的各个部分。 在下游子系统周围循环之前，通过第一热交换器从气流中除去一些热量。 第一个热交换器接触TEC模块的冷端，以降低气流的温度。 空气然后进入网络交换机模块或进一步加热的其他子系统。 此后，第二热交换器通过将上游热量重新插入下游气流中来绕过这些部件。 第二个热交换器接触TEC模块的热侧。 然后将所有加热空气的混合物从系统外壳排出。
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