摘要:
A semiconductor substrate is presented which is manufactured from hollow, gas-filled glass or ceramic microspheres, which are bound together in a dried or fired matrix. The microspheres may be glass-coated microspheres, which are bound together by sintering the outer layers of glass together. The semiconductor surface may be smoothed by glazing the surface.
摘要:
A semiconductor substrate material is disclosed for producing a semiconductor substrate. In an embodiment, the semiconductor substrate material may include a multitude of hollow microspheres. Each one of the multitude of hollow microspheres may have an inner layer and an outer layer. The inner layer may include a first material, the outer layer may include a second material, and the first material and the second material may differ from one another. The first material of the inner layer of each of the multitude of hollow microspheres may have a first melting point, the second material of the outer layer of the multitude of hollow microspheres may have a second melting point, and the first melting point may be higher than the second melting point.
摘要:
The present invention relates to an electrical relay in which a solid slug is moved within a channel and used to make or break an electrical connection. The solid slug is moved by electromagnets. In the preferred embodiment, the slug is wetted by a conducting liquid, such as liquid metal, that also adheres to wettable contact pads within the channel to provide a latching mechanism. The relay is amenable to manufacture by micro-machiningtechniques.
摘要:
Fluid-based switches and a method for producing the same are disclosed. In one embodiment, a switch is provided with first and second mated substrates that define therebetween at least portions of a number of cavities. A plurality of wettable pads is exposed within one or more of the cavities. A switching fluid is held within one or more of the cavities, and is wetted to the wettable pads. The switching fluid serves to open and block light paths through one or more of the cavities, in response to forces that are applied to the switching fluid. Forces are applied to the switching fluid by an actuating fluid that is held within one or more of the cavities. At least a portion of the switching fluid is coated with a surface tension modifier.
摘要:
A method and structure for an optical switch. A channel is housed within a solid material. Contacts coupled to the channel are further coupled to the solid material, while a plurality of piezoelectric elements are coupled to chamber and further coupled to a slug. Optical waveguides are coupled to the channel. The contacts are coupled to a plurality of liquid metal globules, wherein one or more of the plurality of liquid metal globules are coupled to a slug. One or more piezoelectric elements are actuated, causing the slug to be moved within the channel. The motion of the slug is operable to block or unblock one or more of the plurality of optical waveguides.
摘要:
A piezoelectric optical relay array having one or more array elements. Each array element contains a transparent mirror housing, located at the intersection of two optical paths. A liquid metal slug is moved within a channel passing through the transparent mirror housing by the action of piezoelectric elements. The liquid metal slug is moved in or out of the transparent mirror housing to select between the optical paths. When the liquid metal slug is within the transparent mirror housing, an incoming optical signal is reflected from a reflective surface of the slug. The liquid metal of the slug adheres to wettable metal surfaces within the channel to provide a latching mechanism.
摘要:
An electrical relay that uses a conducting liquid in the switching mechanism. In the relay, a pair of moveable switching contacts is positioned between a pair of fixed electrical contact pads. A surface of each contact supports a droplet of a conducting liquid, such as a liquid metal. An actuator is energized to move the pair of switching contacts, closing the gap between one of the fixed contact pads and one of the switching contacts, thereby causing conducting liquid droplets to coalesce and form an electrical circuit. At the same time, the gap between the other fixed contact pad and the other switching contact is increased, thereby causing conducting liquid droplets to separate and break an electrical circuit. The actuator is then de-energized and the switching contacts return to their starting positions. The volume of liquid metal is chosen so that liquid metal droplets remain coalesced or separated because of surface tension in the liquid. The relay is amenable to manufacture by micro-machining techniques.
摘要:
Fluid-based switch and methods for reducing oxides and corrosion products on switching fluid are disclosed. In one method, oxides are reduced by depositing a switching fluid on a first substrate, coating the switching fluid with a corrosion inhibitor, and mating the first substrate to a second substrate, the first substrate and the second substrate defining therebetween a cavity holding the switching fluid, the cavity being sized to allow movement of the switching fluid between first and second states.
摘要:
In accordance with the invention, a piezoelectrically actuated relay that switches and latches by means of a liquid metal is disclosed. The relay operates by means of a longitudinal displacement of a piezoelectric element in extension mode displacing a liquid metal drop and causing it to wet between at least one contact pad on the piezoelectric element or substrate and at least one other fixed pad to close the switch contact. This motion of the piezoelectric element is rapid and causes the imparted momentum of the liquid metal drop to overcome the surface tension forces that would hold the bulk of the liquid metal drop in contact with the contact pad or pads near the actuating piezoelectric element. The switch latches by means of surface tension and the liquid metal wetting to the contact pads.
摘要:
A semiconductor substrate is presented which is manufactured from hollow, gas-filled glass or ceramic microspheres, which are bound together in a dried or fired matrix. The microspheres may be glass-coated microspheres, which are bound together by sintering the outer layers of glass together. The semiconductor surface may be smoothed by glazing the surface.