BIPOLAR TRANSISTOR HAVING RAISED EXTRINSIC BASE WITH SELECTABLE SELF-ALIGNMENT AND METHODS OF FORMING SAME
    1.
    发明申请
    BIPOLAR TRANSISTOR HAVING RAISED EXTRINSIC BASE WITH SELECTABLE SELF-ALIGNMENT AND METHODS OF FORMING SAME 有权
    具有可选择的自对准的提升的超级基座的双极晶体管及其形成方法

    公开(公告)号:US20050048735A1

    公开(公告)日:2005-03-03

    申请号:US10604988

    申请日:2003-08-29

    摘要: A bipolar transistor with raised extrinsic base and selectable self-alignment between the extrinsic base and the emitter is disclosed. The fabrication method may include the formation of a predefined thickness of a first extrinsic base layer of polysilicon or silicon on an intrinsic base. A dielectric landing pad is then formed by lithography on the first extrinsic base layer. Next, a second extrinsic base layer of polysilicon or silicon is formed on top of the dielectric landing pad to finalize the raised extrinsic base total thickness. An emitter opening is formed using lithography and RIE, where the second extrinsic base layer is etched stopping on the dielectric landing pad. The degree of self-alignment between the emitter and the raised extrinsic base is achieved by selecting the first extrinsic base layer thickness, the dielectric landing pad width, and the spacer width.

    摘要翻译: 公开了一种具有凸起的外在基极和在本征基极和发射极之间可选自对准的双极晶体管。 制造方法可以包括在内在基底上形成多晶硅或硅的第一非本征基极层的预定厚度。 然后通过在第一非本征基层上的光刻形成电介质着色焊盘。 接下来,在电介质贴片垫的顶部上形成第二非多晶硅或硅的非本征基极层,以最终确定凸出的非本征基本总厚度。 使用光刻和RIE形成发射器开口,其中第二外部基极层被蚀刻停止在电介质着色焊盘上。 通过选择第一非本征基极层厚度,电介质着陆焊盘宽度和间隔物宽度来实现发射极和凸出的外部基极之间的自对准程度。

    Bipolar transistor having raised extrinsic base with selectable self-alignment and methods of forming same
    2.
    发明申请
    Bipolar transistor having raised extrinsic base with selectable self-alignment and methods of forming same 失效
    双极晶体管具有可选择的自对准的外部基极和其形成方法

    公开(公告)号:US20060081934A1

    公开(公告)日:2006-04-20

    申请号:US11289915

    申请日:2005-11-30

    IPC分类号: H01L23/62

    摘要: A bipolar transistor with raised extrinsic base and selectable self-alignment between the extrinsic base and the emitter is disclosed. The fabrication method may include the formation of a predefined thickness of a first extrinsic base layer of polysilicon or silicon on an intrinsic base. A dielectric landing pad is then formed by lithography on the first extrinsic base layer. Next, a second extrinsic base layer of polysilicon or silicon is formed on top of the dielectric landing pad to finalize the raised extrinsic base total thickness. An emitter opening is formed using lithography and RIE, where the second extrinsic base layer is etched stopping on the dielectric landing pad. The degree of self-alignment between the emitter and the raised extrinsic base is achieved by selecting the first extrinsic base layer thickness, the dielectric landing pad width, and the spacer width.

    摘要翻译: 公开了一种具有凸起的外在基极和在本征基极和发射极之间可选自对准的双极晶体管。 制造方法可以包括在内在基底上形成多晶硅或硅的第一非本征基极层的预定厚度。 然后通过在第一非本征基层上的光刻形成电介质着色焊盘。 接下来,在电介质贴片垫的顶部上形成第二非多晶硅或硅的非本征基极层,以最终确定凸出的非本征基本总厚度。 使用光刻和RIE形成发射器开口,其中第二外部基极层被蚀刻停止在电介质着色焊盘上。 通过选择第一非本征基极层厚度,电介质着陆焊盘宽度和间隔物宽度来实现发射极和凸出的外部基极之间的自对准程度。

    Methods of base formation in a BiCMOS process
    3.
    发明申请
    Methods of base formation in a BiCMOS process 失效
    BiCMOS工艺中碱形成的方法

    公开(公告)号:US20060017066A1

    公开(公告)日:2006-01-26

    申请号:US11231385

    申请日:2005-09-21

    IPC分类号: H01L31/109

    摘要: Methods for fabricating a heterojunction bipolar transistor having a raised extrinsic base is provided in which the base resistance is reduced by forming a silicide atop the raised extrinsic base that extends to the emitter region in a self-aligned manner. The silicide formation is incorporated into a BiCMOS process flow after the raised extrinsic base has been formed. The present invention also provides a heterojunction bipolar transistor having a raised extrinsic base and a silicide located atop the raised extrinsic base. The silicide atop the raised extrinsic base extends to the emitter in a self-aligned manner. The emitter is separated from the silicide by a spacer.

    摘要翻译: 提供了制造具有凸起非本征基极的异质结双极晶体管的方法,其中通过在以自对准方式延伸到发射极区域的凸起的外部基极之上形成硅化物来降低基极电阻。 在形成凸起的外基之后,将硅化物形成结合到BiCMOS工艺流程中。 本发明还提供了一种异质结双极晶体管,其具有凸起的外部基极和位于凸起外部基极顶部的硅化物。 凸起的外基极上面的硅化物以自对准的方式延伸到发射极。 发射极通过间隔物与硅化物分离。

    BIPOLAR TRANSISTOR STRUCTURE WITH SELF-ALIGNED RAISED EXTRINSIC BASE AND METHODS
    5.
    发明申请
    BIPOLAR TRANSISTOR STRUCTURE WITH SELF-ALIGNED RAISED EXTRINSIC BASE AND METHODS 有权
    具有自对准基极的双极晶体管结构和方法

    公开(公告)号:US20060231924A1

    公开(公告)日:2006-10-19

    申请号:US11169444

    申请日:2005-06-29

    摘要: The invention includes methods of fabricating a bipolar transistor that adds a silicon germanium (SiGe) layer or a third insulator layer of, e.g., high pressure oxide (HIPOX), atop an emitter cap adjacent the intrinsic base prior to forming a link-up layer. This addition allows for removal of the link-up layer using wet etch chemistries to remove the excess SiGe or third insulator layer formed atop the emitter cap without using oxidation. In this case, an oxide section (formed by deposition of an oxide or segregation of the above-mentioned HIPOX layer) and nitride spacer can be used to form the emitter-base isolation. The invention results in lower thermal cycle, lower stress levels, and more control over the emitter cap layer thickness, which are drawbacks of the first embodiment. The invention also includes the resulting bipolar transistor structure.

    摘要翻译: 本发明包括制造双极晶体管的方法,该双极晶体管在形成连接层之前,将硅锗(SiGe)层或例如高压氧化物(HIPOX)的第三绝缘体层与邻近本征基极的发射极帽顶上相加 。 该添加允许使用湿蚀刻化学去除连接层,以去除在不使用氧化的情况下形成在发射极帽顶上的多余SiGe或第三绝缘体层。 在这种情况下,可以使用氧化物部分(通过沉积氧化物或上述HIPOX层的分离)和氮化物间隔物形成发射极 - 基极隔离。 本发明导致较低的热循环,较低的应力水平和对发射极盖层厚度的更多控制,这是第一实施例的缺点。 本发明还包括所得到的双极晶体管结构。

    BIPOLAR TRANSISTOR STRUCTURE WITH SELF-ALIGNED RAISED EXTRINSIC BASE AND METHODS
    6.
    发明申请
    BIPOLAR TRANSISTOR STRUCTURE WITH SELF-ALIGNED RAISED EXTRINSIC BASE AND METHODS 有权
    具有自对准的双极晶体管结构

    公开(公告)号:US20050151225A1

    公开(公告)日:2005-07-14

    申请号:US10904482

    申请日:2004-11-12

    IPC分类号: H01L21/331 H01L29/10

    摘要: The invention includes methods of fabricating a bipolar transistor that adds a silicon germanium (SiGe) layer or a third insulator layer of, e.g., high pressure oxide (HIPOX), atop an emitter cap adjacent the intrinsic base prior to forming a link-up layer. This addition allows for removal of the link-up layer using wet etch chemistries to remove the excess SiGe or third insulator layer formed atop the emitter cap without using oxidation. In this case, an oxide section (formed by deposition of an oxide or segregation of the above-mentioned HIPOX layer) and nitride spacer can be used to form the emitter-base isolation. The invention results in lower thermal cycle, lower stress levels, and more control over the emitter cap layer thickness, which are drawbacks of the first embodiment. The invention also includes the resulting bipolar transistor structure.

    摘要翻译: 本发明包括制造双极晶体管的方法,该双极晶体管在形成连接层之前,将硅锗(SiGe)层或例如高压氧化物(HIPOX)的第三绝缘体层与邻近本征基极的发射极帽顶上相加 。 该添加允许使用湿蚀刻化学去除连接层,以去除在不使用氧化的情况下形成在发射极帽顶上的多余SiGe或第三绝缘体层。 在这种情况下,可以使用氧化物部分(通过沉积氧化物或上述HIPOX层的分离)和氮化物间隔物形成发射极 - 基极隔离。 本发明导致较低的热循环,较低的应力水平和对发射极盖层厚度的更多控制,这是第一实施例的缺点。 本发明还包括所得到的双极晶体管结构。

    METHOD TO BUILD SELF-ALIGNED NPN IN ADVANCED BiCMOS TECHNOLOGY
    7.
    发明申请
    METHOD TO BUILD SELF-ALIGNED NPN IN ADVANCED BiCMOS TECHNOLOGY 失效
    在高级BiCMOS技术中构建自对准NPN的方法

    公开(公告)号:US20070264787A1

    公开(公告)日:2007-11-15

    申请号:US11830376

    申请日:2007-07-30

    IPC分类号: H01L21/331

    CPC分类号: H01L29/66242 H01L29/7378

    摘要: The present invention provides a method of forming a self-aligned heterobipolar transistor (HBT) device in a BiCMOS technology. The method includes forming a raised extrinsic base structure by using an epitaxial growth process in which the growth rate between single crystal silicon and polycrystalline silicon is different and by using a low temperature oxidation process such as a high-pressure oxidation (HIPOX) process to form a self-aligned emitter/extrinsic base HBT structure.

    摘要翻译: 本发明提供了一种在BiCMOS技术中形成自对准异双极晶体管(HBT)器件的方法。 该方法包括通过使用其中单晶硅和多晶硅的生长速率不同的外延生长工艺和通过使用诸如高压氧化(HIPOX)工艺的低温氧化工艺形成凸起的外在基体结构来形成 自对准发射极/非本征基极HBT结构。

    METHOD TO BUILD SELF-ALIGNED NPN IN ADVANCED BiCMOS TECHNOLOGY
    8.
    发明申请
    METHOD TO BUILD SELF-ALIGNED NPN IN ADVANCED BiCMOS TECHNOLOGY 有权
    在高级BiCMOS技术中构建自对准NPN的方法

    公开(公告)号:US20060060886A1

    公开(公告)日:2006-03-23

    申请号:US10711486

    申请日:2004-09-21

    IPC分类号: H01L29/737 H01L21/331

    CPC分类号: H01L29/66242 H01L29/7378

    摘要: The present invention provides a method of forming a self-aligned heterobipolar transistor (HBT) device in a BiCMOS technology. The method includes forming a raised extrinsic base structure by using an epitaxial growth process in which the growth rate between single crystal silicon and polycrystalline silicon is different and by using a low temperature oxidation process such as a high-pressure oxidation (HIPOX) process to form a self-aligned emitter/extrinsic base HBT structure.

    摘要翻译: 本发明提供了一种在BiCMOS技术中形成自对准异双极晶体管(HBT)器件的方法。 该方法包括通过使用其中单晶硅和多晶硅的生长速率不同的外延生长工艺和通过使用诸如高压氧化(HIPOX)工艺的低温氧化工艺形成凸起的外在基体结构来形成 自对准发射极/非本征基极HBT结构。

    Bipolar transistor having raised extrinsic base with selectable self-alignment and methods of forming same
    10.
    发明授权
    Bipolar transistor having raised extrinsic base with selectable self-alignment and methods of forming same 失效
    双极晶体管具有可选择的自对准的外部基极和其形成方法

    公开(公告)号:US07253096B2

    公开(公告)日:2007-08-07

    申请号:US11289915

    申请日:2005-11-30

    IPC分类号: H01L21/4763

    摘要: A bipolar transistor with raised extrinsic base and selectable self-alignment between the extrinsic base and the emitter is disclosed. The fabrication method may include the formation of a predefined thickness of a first extrinsic base layer of polysilicon or silicon on an intrinsic base. A dielectric landing pad is then formed by lithography on the first extrinsic base layer. Next, a second extrinsic base layer of polysilicon or silicon is formed on top of the dielectric landing pad to finalize the raised extrinsic base total thickness. An emitter opening is formed using lithography and RIE, where the second extrinsic base layer is etched stopping on the dielectric landing pad. The degree of self-alignment between the emitter and the raised extrinsic base is achieved by selecting the first extrinsic base layer thickness, the dielectric landing pad width, and the spacer width.

    摘要翻译: 公开了一种具有凸起的外在基极和在本征基极和发射极之间可选自对准的双极晶体管。 制造方法可以包括在内在基底上形成多晶硅或硅的第一非本征基极层的预定厚度。 然后通过在第一非本征基层上的光刻形成电介质着色焊盘。 接下来,在电介质贴片垫的顶部上形成第二非多晶硅或硅的非本征基极层,以最终确定凸出的非本征基本总厚度。 使用光刻和RIE形成发射器开口,其中第二外部基极层被蚀刻停止在电介质着色焊盘上。 通过选择第一非本征基极层厚度,电介质着陆焊盘宽度和间隔物宽度来实现发射极和凸出的外部基极之间的自对准程度。