SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING DEVICE
    2.
    发明申请
    SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING DEVICE 有权
    基板清洗方法和基板清洗装置

    公开(公告)号:US20120006361A1

    公开(公告)日:2012-01-12

    申请号:US13116793

    申请日:2011-05-26

    IPC分类号: B08B3/00

    摘要: A substrate rotates, and a liquid nozzle of a gas/liquid supply nozzle moves to a position above the center of the rotating substrate. In this state, a rinse liquid is discharged from the liquid nozzle onto the rotating substrate. The gas/liquid supply nozzle moves toward a position outside the substrate. A gas nozzle reaches the position above the center of the rotating substrate, so that the gas/liquid supply nozzle temporarily stops. With the gas/liquid supply nozzle stopping, an inert gas is discharged onto the center of the rotating substrate for a given period of time. After that, the gas/liquid supply nozzle again moves toward the position outside the substrate.

    摘要翻译: 基板旋转,气/液供给喷嘴的液体喷嘴移动到旋转基板的中心上方的位置。 在该状态下,将冲洗液从液体喷嘴排出到旋转基板上。 气体/液体供给喷嘴朝向基板外侧的位置移动。 气体喷嘴到达旋转基板的中心上方的位置,使气/液供给喷嘴临时停止。 在气/液供给喷嘴停止的情况下,将惰性气体排出到旋转基板的中心一定时间。 之后,气体/液体供给喷嘴再次朝向基板外侧的位置移动。

    METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING APPARATUS
    3.
    发明申请
    METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING APPARATUS 审中-公开
    基板加工方法,基板加工系统及基板加工设备

    公开(公告)号:US20070253710A1

    公开(公告)日:2007-11-01

    申请号:US11740397

    申请日:2007-04-26

    IPC分类号: G03D5/00

    摘要: In an exposure unit compatible with immersion exposure, a dummy substrate to be used for an alignment process for adjustment of an exposure position for a pattern image is transferred to a substrate processing apparatus for performing a resist coating process before exposure and a development process after exposure. In the substrate processing apparatus, the received dummy substrate is reversed and transferred to a back surface cleaning unit, to be subjected to a back surface cleaning process. After that, the dummy substrate is reversed again and transferred to a front surface cleaning unit, to be subjected to a front surface cleaning process. The dummy substrate after being cleaned is transferred back from the substrate processing apparatus to the exposure unit. Since the alignment process can be performed by using a clean dummy substrate in the exposure unit, it is possible to reduce contamination of mechanisms in the exposure unit, such as a substrate stage and the like.

    摘要翻译: 在与浸没曝光兼容的曝光单元中,将用于调整图案图像的曝光位置的对准处理的虚设基板转印到用于在曝光之前进行抗蚀剂涂布处理的基板处理装置和曝光后的显影处理 。 在基板处理装置中,将接收到的虚拟基板反转并转印到后表面清洁单元,以进行后表面清洁处理。 之后,将虚拟基板再次反转并转移到前表面清洁单元,以进行正面清洁处理。 清理后的虚设基板从基板处理装置返回到曝光单元。 由于可以通过在曝光单元中使用清洁的虚设基板进行取向处理,所以可以减少诸如基板台等的曝光单元中的机构的污染。

    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    4.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 审中-公开
    基板处理装置和基板处理方法

    公开(公告)号:US20070274711A1

    公开(公告)日:2007-11-29

    申请号:US11754631

    申请日:2007-05-29

    IPC分类号: G03D5/00

    摘要: A cleaning substrate for use in the cleaning operation for a substrate stage in an exposure unit compatible with immersion exposure and a dummy substrate for use during the adjustment of an exposure position of a pattern image in the exposure unit are held in a cleaning substrate housing part and a dummy substrate housing part, respectively, which are provided in a substrate processing apparatus. For the cleaning operation for the substrate stage or an alignment operation in the exposure unit, the cleaning substrate or the dummy substrate is transferred from the substrate processing apparatus to the exposure unit. A back surface cleaning process on the cleaning substrate or the dummy substrate is performed in a back surface cleaning unit of the substrate processing apparatus immediately before or immediately after the cleaning operation for the substrate stage or the alignment operation.

    摘要翻译: 在曝光单元兼容的曝光单元中的基板台的清洁操作中使用的清洁基板和在调整曝光单元中的图案图像的曝光位置期间使用的虚设基板被保持在清洁基板壳体部分 以及分别设置在基板处理装置中的虚设基板收容部。 对于衬底台的清洁操作或曝光单元中的对准操作,清洁衬底或虚设衬底从衬底处理设备转移到曝光单元。 清洁基板或虚设基板上的背面清洗工序在基板台的清扫动作前后或紧随其后的基板处理装置的背面清扫装置或对位动作中进行。