METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING APPARATUS
    1.
    发明申请
    METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING APPARATUS 审中-公开
    基板加工方法,基板加工系统及基板加工设备

    公开(公告)号:US20070253710A1

    公开(公告)日:2007-11-01

    申请号:US11740397

    申请日:2007-04-26

    IPC分类号: G03D5/00

    摘要: In an exposure unit compatible with immersion exposure, a dummy substrate to be used for an alignment process for adjustment of an exposure position for a pattern image is transferred to a substrate processing apparatus for performing a resist coating process before exposure and a development process after exposure. In the substrate processing apparatus, the received dummy substrate is reversed and transferred to a back surface cleaning unit, to be subjected to a back surface cleaning process. After that, the dummy substrate is reversed again and transferred to a front surface cleaning unit, to be subjected to a front surface cleaning process. The dummy substrate after being cleaned is transferred back from the substrate processing apparatus to the exposure unit. Since the alignment process can be performed by using a clean dummy substrate in the exposure unit, it is possible to reduce contamination of mechanisms in the exposure unit, such as a substrate stage and the like.

    摘要翻译: 在与浸没曝光兼容的曝光单元中,将用于调整图案图像的曝光位置的对准处理的虚设基板转印到用于在曝光之前进行抗蚀剂涂布处理的基板处理装置和曝光后的显影处理 。 在基板处理装置中,将接收到的虚拟基板反转并转印到后表面清洁单元,以进行后表面清洁处理。 之后,将虚拟基板再次反转并转移到前表面清洁单元,以进行正面清洁处理。 清理后的虚设基板从基板处理装置返回到曝光单元。 由于可以通过在曝光单元中使用清洁的虚设基板进行取向处理,所以可以减少诸如基板台等的曝光单元中的机构的污染。

    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    2.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 审中-公开
    基板处理装置和基板处理方法

    公开(公告)号:US20070274711A1

    公开(公告)日:2007-11-29

    申请号:US11754631

    申请日:2007-05-29

    IPC分类号: G03D5/00

    摘要: A cleaning substrate for use in the cleaning operation for a substrate stage in an exposure unit compatible with immersion exposure and a dummy substrate for use during the adjustment of an exposure position of a pattern image in the exposure unit are held in a cleaning substrate housing part and a dummy substrate housing part, respectively, which are provided in a substrate processing apparatus. For the cleaning operation for the substrate stage or an alignment operation in the exposure unit, the cleaning substrate or the dummy substrate is transferred from the substrate processing apparatus to the exposure unit. A back surface cleaning process on the cleaning substrate or the dummy substrate is performed in a back surface cleaning unit of the substrate processing apparatus immediately before or immediately after the cleaning operation for the substrate stage or the alignment operation.

    摘要翻译: 在曝光单元兼容的曝光单元中的基板台的清洁操作中使用的清洁基板和在调整曝光单元中的图案图像的曝光位置期间使用的虚设基板被保持在清洁基板壳体部分 以及分别设置在基板处理装置中的虚设基板收容部。 对于衬底台的清洁操作或曝光单元中的对准操作,清洁衬底或虚设衬底从衬底处理设备转移到曝光单元。 清洁基板或虚设基板上的背面清洗工序在基板台的清扫动作前后或紧随其后的基板处理装置的背面清扫装置或对位动作中进行。

    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    4.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
    基板处理装置和基板处理方法

    公开(公告)号:US20110236011A1

    公开(公告)日:2011-09-29

    申请号:US13019711

    申请日:2011-02-02

    申请人: Koji KANEYAMA

    发明人: Koji KANEYAMA

    IPC分类号: G03D5/00 G03F7/004

    摘要: A substrate subjected to back surface cleaning by a back surface cleaning processing unit is held by a hand of an interface transport mechanism and transported to a cooling unit. The substrate whose temperature has been adjusted by the cooling unit is held by a hand of the interface transport mechanism and transported to an exposure device. The substrate subjected to exposure processing by the exposure device is held by a hand of the interface transport mechanism and transported from the exposure device to a substrate platform.

    摘要翻译: 通过背面清洁处理单元进行背面清洁的基板由界面输送机构的手保持并被输送到冷却单元。 温度由冷却单元调节的基板由界面输送机构的手保持并被输送到曝光装置。 通过曝光装置进行曝光处理的基板由界面输送机构的手保持并从曝光装置传送到基板平台。

    SUBSTRATE PROCESSING METHOD
    5.
    发明申请
    SUBSTRATE PROCESSING METHOD 有权
    基板处理方法

    公开(公告)号:US20140104586A1

    公开(公告)日:2014-04-17

    申请号:US14132592

    申请日:2013-12-18

    申请人: Koji KANEYAMA

    发明人: Koji KANEYAMA

    IPC分类号: G03F7/20

    摘要: A substrate processing method for a substrate having a photosensitive film on a top surface thereof, includes cleaning a back surface of the substrate after the formation of the photosensitive film and before exposure processing; transporting the substrate to a temperature adjuster such as a cooling unit, while holding the substrate with a first holder; adjusting a temperature of the substrate with the temperature adjuster; transporting the substrate from the temperature adjuster to the exposure device with a second holder; and transporting the substrate after the exposure processing to a first platform while holding the substrate with a third holder.

    摘要翻译: 一种用于在其顶表面上具有感光膜的基板的基板处理方法,包括在形成感光膜之后和曝光处理之前清洁基板的背面; 将基板传送到诸如冷却单元的温度调节器,同时用第一保持器保持基板; 用温度调节器调节基板的温度; 将所述基板从所述温度调节器传送到具有第二保持器的所述曝光装置; 以及在曝光处理之后将所述基板传送到第一平台,同时用第三保持器保持所述基板。

    METHOD OF AND APPARATUS FOR HEAT-TREATING EXPOSED SUBSTRATE
    6.
    发明申请
    METHOD OF AND APPARATUS FOR HEAT-TREATING EXPOSED SUBSTRATE 有权
    热处理基片的方法与装置

    公开(公告)号:US20120091110A1

    公开(公告)日:2012-04-19

    申请号:US13239529

    申请日:2011-09-22

    申请人: Koji KANEYAMA

    发明人: Koji KANEYAMA

    IPC分类号: H05B1/00

    摘要: A substrate subjected to a pattern exposure process is transported to a flash bake unit. The flash bake unit performs a post-exposure bake process in which flashes of light are directed from flash lamps onto a surface of the substrate held on an upper surface of a cooling plate to momentarily heat the surface of the substrate, thereby causing crosslinking, deprotection or decomposition and the like of resist resin to proceed by using active species produced in a resist film by a photochemical reaction during the pattern exposure process as an acid catalyst, so that the solubility of only the exposed portion of the resist film in a developing solution is locally changed. The flash heating treatment performed by the irradiation with flashes of light requires extremely short treatment time of not greater than one second. This reduces the diffusion length of acid during the post-exposure bake process.

    摘要翻译: 经受图案曝光处理的基板被输送到闪光烘烤单元。 闪光烘焙单元进行曝光后烘烤处理,其中闪光灯从闪光灯引导到保持在冷却板的上表面上的基板的表面上,以瞬时加热基板的表面,由此引起交联,脱保护 或抗蚀剂树脂的分解等通过在作为酸催化剂的图案曝光过程中通过光化学反应使用在抗蚀剂膜中产生的活性物质进行,使得仅将抗蚀剂膜的暴露部分在显影溶液中的溶解度 在本地更改。 用闪光灯照射进行的闪光加热处理需要非常短的处理时间不超过1秒。 这在曝光后烘烤过程中减少了酸的扩散长度。